My Inquiry
My Account
Infineon Technologies S29GL01GT12TFN010
- Part No.:
- S29GL01GT12TFN010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL01GT12TFN010.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,817
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL01GT12TFN010 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 45-nm MIRRORBIT™ technology, single 2.7–3.6 V supply, and 100 ns random access time at –40°C to +85°C. It supports ×8/×16 data bus, 512-byte write buffer, and hardware ECC for single-bit error correction-used in boot code storage and firmware update in industrial embedded controllers.
For engineers reviewing the S29GL01GT12TFN010 datasheet, S29GL01GT12TFN010 pinout, S29GL01GT12TFN010 application, or S29GL01GT12TFN010 equivalent, key selection criteria include sector erase granularity (128 KB), OTP array size (2048 bytes), ASP protection modes, CFI compliance, and temperature grade (Industrial Plus, –40°C to +105°C).
Technical Context
This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both page-mode (32-byte) and random read operations. Its embedded algorithm controller (EAC) manages program/erase sequences, suspend/resume capability, and status reporting via Status Register, Data Polling, or RY/BY# pin.
The internal hardware ECC operates transparently during read cycles and corrects single-bit errors without software intervention. Sector protection uses volatile (lock bits) and non-volatile (ASP) methods, while the 2048-byte OTP array includes four lockable SSR regions-SSR0 factory-locked, SSR3 password-read-protected.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - sufficient for full firmware images and dual-bank boot code storage |
| Access time (tACC) | 100 ns at –40°C to +85°C - enables direct XIP execution from flash in real-time control systems |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch in boot loader initialization |
| Write buffer size | 512 bytes - reduces effective programming time by batching up to 256 words per operation |
| ECC capability | Single-bit error correction - ensures data integrity without host CPU overhead in mission-critical storage |
| Sector size | 128 KB uniform sectors - supports fine-grained firmware partitioning and field updates without full chip erase |
| OTP array | 2048 bytes with 4 SSR regions - provides secure storage for keys, calibration data, and device identity |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-142AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit address bus supporting full 128 MB linear addressing with byte/word alignment |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; configurable as ×8 or ×16 mode via BYTE# pin |
| CE#, OE#, WE# | Chip Enable, Output Enable, Write Enable | Standard asynchronous control signals enabling non-multiplexed parallel interface timing |
| RY/BY# | Ready/Busy output | Open-drain status indicator for embedded program/erase completion monitoring |
| VCC, VIO | Core and I/O supplies | Separate 2.7–3.6 V VCC and 1.65–VCC VIO allow interfacing with mixed-voltage SoCs |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC - enables direct connection to 1.8 V, 2.5 V, or 3.3 V logic without level shifters |
| Hardware ECC engine | On-the-fly single-bit correction with no latency penalty - eliminates need for external error-handling firmware |
| Advanced sector protection (ASP) | Volatile and non-volatile locking per 128 KB sector - prevents accidental overwrite during field firmware updates |
| Suspend/resume capability | Interrupts active program/erase to service high-priority reads - maintains system responsiveness in real-time OS environments |
| Common Flash Interface (CFI) | Standardized parameter table accessible via command sequence - simplifies bootloader portability across flash vendors |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot code and configuration parameters in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Non-volatile boot memory with XIP capability and 100 ns random access for deterministic startup timing. Use Value: Eliminates external RAM copy step during boot; 20-year data retention ensures firmware persistence over equipment lifetime. | Use Scenario: Holding safety-critical boot firmware for radar processing units in AEC-Q100 Grade 2 automotive systems (–40°C to +105°C). IC Role / Device Role / Timing Role: Certified flash memory providing secure, ECC-protected boot image storage with ASP-enabled sector lockdown. Use Value: Meets ISO 26262 ASIL-B requirements via hardware ECC and OTP-based key storage in SSR3 region. |
| Medical Imaging System Update Storage | Telecom Base Station Configuration |
Use Scenario: Hosting field-upgradable firmware and calibration tables in MRI and CT scanner subsystems requiring long-term reliability. IC Role / Device Role / Timing Role: High-endurance (100,000 cycles) flash for infrequent but critical firmware patches and regulatory-compliant version tracking. Use Value: 128 KB uniform sectors allow atomic update of diagnostic modules without disrupting core imaging runtime. | Use Scenario: Storing configuration profiles, protocol stacks, and encryption keys in 5G baseband units deployed in outdoor cabinets. IC Role / Device Role / Timing Role: Parallel NOR flash with CFI support and OTP-secured key storage for secure boot and remote management. Use Value: SSR0 factory lock prevents tampering with root-of-trust keys; Versatile I/O accommodates legacy 2.5 V FPGA interfaces. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT12TFI010 | Same die, Industrial grade (–40°C to +85°C), TSOP package, no extended temp support | Lacks +105°C operation - unsuitable for under-hood automotive or high-ambient telecom deployments | Select when cost-sensitive industrial designs do not require >85°C operation |
| S29GL01GT12TFV010 | Same die, Automotive Grade 2 (–40°C to +105°C), 64-ball LAE BGA (9 mm × 9 mm) | Different package (BGA vs TSOP); no OTP SSR3 password protection enabled in this variant | Choose for space-constrained automotive ECUs where board-level security is handled externally |
Compared with S29GL01GT12TFN010, the TI010 variant trades extended temperature support for lower cost in fixed-ambient applications, while the TV010 variant offers compact BGA packaging but omits password-protected OTP-making the FN010 uniquely suited for secure, high-temp industrial firmware storage.
Availability
S29GL01GT12TFN010 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system update storage requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL01GT12TFN010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for industrial, automotive, and IoT applications.
The GL-T family targets high-reliability embedded systems needing fast XIP-capable flash with robust data integrity-designed specifically for boot code, firmware, and secure configuration storage in harsh environments.
FAQ
What temperature grade does S29GL01GT12TFN010 support?
S29GL01GT12TFN010 is rated for Industrial Plus operation from –40°C to +105°C. This grade meets extended thermal requirements for enclosed industrial enclosures and under-dash automotive modules, validated per Infineon's qualification standards and supported by 100,000 program/erase cycles and 20-year data retention at max temperature.
Does this part support hardware ECC, and how is it implemented?
Yes, S29GL01GT12TFN010 includes on-die hardware ECC that automatically detects and corrects single-bit errors during read operations. The ECC engine operates transparently without CPU intervention or additional timing overhead, using dedicated circuitry aligned with the MIRRORBIT™ architecture-no external syndrome calculation or software driver required.
Can the OTP array be used for cryptographic key storage?
Yes-the 2048-byte OTP array contains four lockable SSR regions. SSR3 supports password-based read protection, allowing secure storage of AES keys or device-specific identifiers. Once programmed and locked, SSR3 contents cannot be read without the correct password, satisfying basic secure boot key isolation requirements per NIST SP 800-193 guidelines.
Is CFI compliance mandatory for bootloader compatibility?
CFI compliance is not mandatory but strongly recommended: it provides standardized register mapping and command sets that enable vendor-agnostic bootloader development. S29GL01GT12TFN010 implements full CFI v1.4 compliance-including ID-CFI ASO and parameter query-allowing reuse of existing flash abstraction layers across Infineon, Macronix, and Spansion-based platforms.
S29GL01GT12TFN010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 120 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL01GT12TFN010 FAQ
1.How can I place an order for S29GL01GT12TFN010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT12TFN010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT12TFN010 reliable?
The price and inventory of S29GL01GT12TFN010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT12TFN010 is usually 5 days.
3.What payment methods are accepted for S29GL01GT12TFN010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT12TFN010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT12TFN010?
S29GL01GT12TFN010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT12TFN010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT12TFN010?
For technical support, including S29GL01GT12TFN010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT12TFN010 requirements.
6.How does Aetrix verify that S29GL01GT12TFN010 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT12TFN010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT12TFN010 meets industry standards.
7.What is the process for return or replacement of S29GL01GT12TFN010?
All S29GL01GT12TFN010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT12TFN010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT12TFN010 part is unused and in its original packaging.
Return procedure for S29GL01GT12TFN010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GT12TFN010 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
