Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies S29GL01GT12TFN013

Part No.:
S29GL01GT12TFN013
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
56-TFSOP (0.724", 18.40mm Width)
Datasheet:
AetrixS29GL01GT12TFN013.pdf
Description:
IC FLASH 1GBIT PARALLEL 56TSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,981

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

S29GL01GT12TFN013 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, internal hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C) in 56-pin TSOP package. It serves as non-volatile program storage in boot code execution and firmware update subsystems of industrial controllers.

For engineers reviewing the S29GL01GT12TFN013 datasheet, S29GL01GT12TFN013 pinout, S29GL01GT12TFN013 application, or S29GL01GT12TFN013 equivalent, key selection criteria include verified 100,000 program/erase cycles, 20-year data retention, CFI-compliant interface, OTP array with four lockable SSR regions, and support for suspend/resume during erase and program operations.

Technical Context

This device implements an asynchronous parallel interface with ×8/×16 data bus configuration and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages all program and erase operations, including automatic ECC generation and correction, status monitoring via Status Register/Data Polling/RY/BY# pin, and sector protection through volatile and non-volatile ASP methods.

The architecture includes dedicated address space overlays (ASOs) for Device ID/CFI, Status Register, Data Polling, SSR (OTP), ECC status, and sector protection control. The 2048-byte OTP array contains four lockable sectors (SSR0–SSR3), with SSR0 factory-locked and SSR3 password-read-protected - enabling secure boot code and calibration data storage.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density1 Gb (128 MB) - provides sufficient capacity for full firmware images and field-upgradable code in resource-constrained embedded systems.
Access Time (tACC)100 ns at –40°C to +85°C - enables direct XIP execution without external cache in real-time control applications.
Page Access (tPACC)15 ns - accelerates sequential instruction fetch during boot or interrupt service routines.
Write Buffer Size512 bytes - reduces effective programming time by batching up to 256 words per operation, improving firmware update throughput.
ECC SupportInternal hardware single-bit error correction - eliminates need for external ECC logic and ensures reliable boot code integrity over 20-year retention.
Endurance100,000 program/erase cycles - supports frequent field updates in industrial HMI and gateway firmware management.
Operating Temp–40°C to +85°C (Industrial grade) - validated for use in programmable logic controllers and motor drives without derating.

Pinout & Package

Package: 56-pin Thin Small Outline Package (TSOP), standard JEDEC MO-142, 20.0 mm × 10.16 mm × 1.2 mm body height, lead pitch 0.5 mm.

Pin/TerminalCircuit RoleDesign Meaning
A0–A20Address Inputs21-bit address bus supporting full 128 MB linear addressing with byte/word boundary alignment.
DQ0–DQ15Data I/O16-bit bidirectional data bus configurable for ×8 or ×16 operation; supports versatile I/O voltage (1.65 V to VCC).
CE#Chip EnableActive-low chip select controlling device power state; tCE = 100 ns max defines minimum enable-to-access timing window.
OE#Output EnableActive-low read strobe; tOE = 25 ns max determines output valid delay after assertion.
WE#Write EnableActive-low control for write operations; initiates command sequences and buffer programming cycles.
RY/BY#Ready/Busy OutputOpen-drain status indicator; low during embedded operations (program/erase), used for hardware polling without CPU overhead.
VCCCore SupplySingle 2.7–3.6 V supply powers all functions - simplifies power design versus dual-supply NOR flash.
VIOI/O SupplyIndependent 1.65–VCC I/O voltage allows interfacing with 1.8 V, 2.5 V, or 3.3 V host processors.

Key Features

FeatureDesign Value
Versatile I/O Voltage RangeVIO supports 1.65 V to VCC, enabling direct connection to mixed-voltage SoCs without level shifters.
512-Byte Programming BufferReduces average programming time by >60% vs. single-word writes, critical for OTA firmware patching in edge devices.
Hardware ECC EngineOn-die single-bit error correction eliminates software ECC overhead and guarantees boot ROM reliability across temperature and lifetime.
Four Lockable OTP RegionsSSR0–SSR3 allow segmented protection of secure boot keys, calibration data, and device identity - SSR0 factory-locked prevents tampering at origin.
CFI-Compatible InterfaceStandardized parameter table enables auto-detection and driver compatibility across toolchains and bootloader frameworks (e.g., U-Boot, Coreboot).

Applications

Industrial PLC Firmware StorageAutomotive ADAS Boot Memory

Use Scenario: Storing and executing boot loader and real-time control firmware in programmable logic controllers with deterministic startup timing.

IC Role / Device Role / Timing Role: Non-volatile XIP-capable program memory providing sub-100 ns instruction fetch latency during cold start and watchdog recovery.

Use Value: Eliminates external SRAM caching requirement while maintaining 100,000-cycle endurance for periodic firmware updates in factory automation environments.

Use Scenario: Holding certified boot code and sensor fusion algorithms in automotive camera ECU requiring AEC-Q100 compliance.

IC Role / Device Role / Timing Role: Secure, high-reliability boot memory with OTP-protected calibration data and hardware ECC for ASIL-B functional safety path.

Use Value: Meets ISO 26262 requirements via factory-locked SSR0 and password-protected SSR3, ensuring immutable root-of-trust during vehicle lifecycle.

Medical Imaging System ConfigurationEnergy Meter Firmware Archive

Use Scenario: Retaining device-specific calibration tables and regulatory-compliant image processing parameters in portable ultrasound units.

IC Role / Device Role / Timing Role: OTP-backed configuration storage with four independent lockable sectors enabling tiered access control for OEM, service, and end-user fields.

Use Value: Prevents unauthorized modification of FDA-cleared image pipelines while allowing field-service recalibration via SSR2 unlock sequence.

Use Scenario: Archiving firmware revisions and tariff tables in smart electricity meters deployed in harsh outdoor substations.

IC Role / Device Role / Timing Role: Industrial-grade (–40°C to +85°C) parallel NOR flash with 20-year data retention guaranteeing meter accuracy over full service life.

Use Value: Supports remote firmware rollback and regulatory audit logging without battery backup or external EEPROM, reducing BOM cost and failure points.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S29GL01GT12TFI013Same die and specs, but in 64-ball LAE FBGA (9 mm × 9 mm); no TSOP package.Used where board space is constrained and PCB routing favors BGA over gull-wing leads.Select when footprint density outweighs reworkability and thermal test access requirements.
MX29GL128FPTI-90G128 MB (1 Gb), 90 ns tACC, no integrated ECC, requires external error handling; 56-pin TSOP same package outline.Lacks hardware ECC and OTP security features - suitable only for non-safety-critical legacy designs.Choose only if existing design uses Macronix-compatible command set and ECC is handled in software or external logic.

Compared with S29GL01GT12TFN013, the Infineon S29GL01GT12TFI013 offers identical functionality in compact BGA form, while the Macronix MX29GL128FPTI-90G trades ECC and OTP security for lower cost and broader legacy ecosystem support - making it viable only where those features are not required.

Availability

S29GL01GT12TFN013 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system configuration requiring stable component supply across long product lifecycles.

Supply support for S29GL01GT12TFN013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions for industrial and automotive markets.

The GL-T family targets embedded systems needing XIP-capable, high-endurance parallel NOR flash with integrated security and mixed-voltage I/O - designed specifically for boot code, firmware, and configuration storage in safety-critical and long-lifecycle applications.

FAQ

Does S29GL01GT12TFN013 support both ×8 and ×16 data bus configurations?

Yes. The device supports configurable ×8 (byte) or ×16 (word) operation via hardware pin strapping (BYTE# input). When BYTE# is high, DQ0–DQ7 function as the data bus; when low, DQ0–DQ15 operate as a full 16-bit bus. This flexibility allows seamless integration with 8-bit microcontrollers or 16-bit microprocessors without external glue logic.

What is the purpose of the SSR0–SSR3 regions in the OTP array?

SSR0–SSR3 are four independently lockable 512-byte sectors within the 2048-byte OTP array. SSR0 is factory-locked and immutable; SSR3 is password-protected for read access. SSR1 and SSR2 can be user-locked via command sequence. These regions store boot keys, calibration data, and device identity - enabling hierarchical security for firmware validation and field service.

How does the Ready/Busy# (RY/BY#) pin improve system efficiency?

RY/BY# is an open-drain output that goes low during embedded program or erase operations and returns high when complete. It enables hardware polling without CPU intervention or timer-based delays, reducing firmware overhead and ensuring deterministic timing for real-time systems like motor control loops or safety monitors.

Is the 15 ns page access time achievable across the full industrial temperature range?

Yes. The 15 ns page access time (tPACC) is guaranteed over –40°C to +85°C per datasheet Section "Performance summary for operating temperature range of –40°C to +85°C". This applies to all densities and voltage conditions specified, enabling consistent fast sequential reads during boot or interrupt handling regardless of ambient temperature.

S29GL01GT12TFN013 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-T
Package/Case:
56-TFSOP (0.724", 18.40mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
1Gbit
Memory Organization:
128M x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
60ns
Access Time:
120 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
56-TSOP

S29GL01GT12TFN013 FAQ

1.How can I place an order for S29GL01GT12TFN013 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL01GT12TFN013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL01GT12TFN013 reliable?

The price and inventory of S29GL01GT12TFN013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT12TFN013 is usually 5 days.

3.What payment methods are accepted for S29GL01GT12TFN013?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT12TFN013 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL01GT12TFN013?

S29GL01GT12TFN013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL01GT12TFN013 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL01GT12TFN013?

For technical support, including S29GL01GT12TFN013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT12TFN013 requirements.

6.How does Aetrix verify that S29GL01GT12TFN013 is sourced from the original manufacturer or authorized distributors?

All S29GL01GT12TFN013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT12TFN013 meets industry standards.

7.What is the process for return or replacement of S29GL01GT12TFN013?

All S29GL01GT12TFN013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT12TFN013, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL01GT12TFN013 part is unused and in its original packaging.

Return procedure for S29GL01GT12TFN013:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S29GL01GT12TFN013 Tags

  • S29GL01GT12TFN013
  • S29GL01GT12TFN013 PDF
  • S29GL01GT12TFN013 Datasheet
  • S29GL01GT12TFN013 Specifications
  • S29GL01GT12TFN013 Images
  • Infineon Technologies
  • Infineon Technologies S29GL01GT12TFN013
  • Buy S29GL01GT12TFN013
  • S29GL01GT12TFN013 Price
  • S29GL01GT12TFN013 Distributor
  • S29GL01GT12TFN013 Supplier
  • S29GL01GT12TFN013 Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER