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Infineon Technologies S29GL01GT12TFN020
- Part No.:
- S29GL01GT12TFN020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL01GT12TFN020.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,204
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Product details
Overview
S29GL01GT12TFN020 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for embedded microcontrollers in industrial control systems.
For engineers reviewing the S29GL01GT12TFN020 datasheet, S29GL01GT12TFN020 pinout, S29GL01GT12TFN020 application, or S29GL01GT12TFN020 equivalent, key selection factors include its asynchronous ×16 data bus, Versatile I/O (1.65 V to VCC), CFI-compliant interface, OTP array with four lockable SSR regions, and AEC-Q100 grade 3 qualification for automotive use cases.
Technical Context
This device implements an embedded algorithm controller (EAC) that executes program/erase operations autonomously without host CPU intervention. Its architecture supports both byte/word boundary addressing and asynchronous page-mode reads, enabling XIP-capable execution directly from flash memory while maintaining high-density data storage capability.
The internal hardware ECC engine operates transparently during read cycles, correcting single-bit errors on-the-fly and reporting uncorrectable multi-bit errors via status register flags. Sector protection is managed through volatile (lock bits) and non-volatile (ASP) methods, with dedicated 2048-byte OTP array partitioned into four SSR regions-SSR0 factory-locked, SSR3 password-protected.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - sufficient for full firmware images and configuration tables in resource-constrained embedded hosts |
| Access time (tACC) | 100 ns at –40°C to +85°C - enables direct code execution without external cache in real-time control applications |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch during boot or interrupt handling |
| Write buffer size | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| ECC capability | Single-bit error correction with detection of multi-bit errors - ensures data integrity over 20-year retention life |
| Endurance | 100,000 program/erase cycles - supports field firmware updates in industrial gateways and PLCs |
| Operating voltage | VCC = 2.7 V to 3.6 V, VIO = 1.65 V to VCC - simplifies power design with shared supply or level-shifted I/O |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit address bus supporting full 128 MB linear space; byte/word aligned addressing only |
| DQ0–DQ15 | Data I/O | ×16 bidirectional data bus; supports 8-bit or 16-bit mode via BYTE# signal |
| CE#, OE#, WE# | Chip Enable, Output Enable, Write Enable | Asynchronous control signals for read/write timing; CE# active-low enables device operation |
| RY/BY# | Ready/Busy output | Open-drain status indicator: low = operation in progress, high = ready for next command |
| RESET# | Hardware reset input | Active-low signal forcing device into reset state; required after power-up or to abort ongoing operations |
| VCC, VIO, GND | Power supplies | VCC powers core logic (2.7–3.6 V); VIO sets I/O voltage (1.65–VCC); separate GND pins reduce noise coupling |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC - eliminates level shifters when interfacing with 1.8 V or 3.3 V controllers |
| Hardware ECC engine | On-the-fly single-bit correction with status flag - removes need for software-based error handling in safety-critical boot paths |
| Uniform 128-KB sectors | 1024 erasable sectors - enables granular firmware update partitioning without wear-leveling overhead |
| CFI parameter table | Standardized JEDEC JESD68 query structure - allows automatic driver initialization across multiple flash vendors |
| OTP array with SSR locking | 2048-byte one-time-programmable space with four independently lockable regions - secures bootloader keys and calibration data |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers with field-upgrade capability. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with deterministic 100 ns access latency. Use Value: Eliminates external SRAM requirement for boot code execution; 100,000-cycle endurance supports over-the-air firmware updates. | Use Scenario: Holding certified boot firmware and sensor calibration data in advanced driver-assistance systems requiring AEC-Q100 Grade 2 compliance. IC Role / Device Role / Timing Role: Automotive-grade parallel NOR flash with –40°C to +105°C operation and hardware ECC for ASIL-B functional safety support. Use Value: SSR3 password protection prevents unauthorized readout of calibration parameters; OTP region resists tampering during vehicle lifetime. |
| Medical Imaging System Configuration | Telecom Base Station BIOS |
Use Scenario: Retaining system configuration, image processing profiles, and regulatory certification data in diagnostic imaging equipment. IC Role / Device Role / Timing Role: High-reliability flash memory with 20-year data retention and sector-level protection against accidental overwrite. Use Value: Ensures consistent image quality calibration across device lifespan; uniform sector erase enables safe profile updates without affecting operational settings. | Use Scenario: Hosting BIOS and FPGA configuration bitstreams in carrier-grade wireless infrastructure equipment with strict uptime requirements. IC Role / Device Role / Timing Role: Parallel interface flash delivering deterministic boot timing and CFI-compliant auto-detection for multi-vendor board compatibility. Use Value: Page-mode read (15 ns) accelerates POST sequence; RY/BY# pin enables precise timing coordination with host processor reset sequencing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT12TFI020 | Same die, 56-pin TSOP package but industrial-plus grade (–40°C to +105°C); higher tACC (110 ns) | Required for extended temperature operation in outdoor telecom or motor drive enclosures | Select when ambient exceeds +85°C and 110 ns access is acceptable |
| MX29GL128FPTI-90G | Micron 128-MB parallel NOR; 90 ns tACC; no integrated ECC; requires external error management | Lacks hardware ECC and OTP security features; lower cost where safety certification not required | Choose for cost-sensitive consumer applications without functional safety needs |
Compared with S29GL01GT12TFN020, the S29GL01GT12TFI020 trades minor speed reduction for extended thermal robustness, while MX29GL128FPTI-90G offers lower BOM cost at the expense of ECC, OTP, and automotive qualification - making the original optimal for safety-critical industrial and automotive boot memory.
Availability
S29GL01GT12TFN020 is available at Aetrix Electronics and suitable for industrial control systems, automotive ADAS modules, medical imaging devices, and telecom base station BIOS requiring stable component supply and long-term lifecycle support.
Supply support for S29GL01GT12TFN020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and secure microcontrollers, with global manufacturing and R&D centers.
The GL-T family targets high-reliability embedded systems needing deterministic boot performance, integrated data integrity, and long-term flash endurance - specifically designed for industrial automation, automotive, and medical applications demanding AEC-Q100 or extended temperature operation.
FAQ
Is S29GL01GT12TFN020 pin-compatible with earlier S29GL01GP or S29GL01GS series?
No. S29GL01GT uses a revised command set and enhanced CFI table compared to GP/GS generations. Pinout is identical in 56-pin TSOP, but software drivers require modification due to differences in status register layout, ECC reporting, and OTP access protocols. Migration requires validation of all embedded algorithms and protection schemes.
Does this device support byte-write operations without erasing the entire sector?
Yes. S29GL01GT12TFN020 supports single-word programming within an already-erased sector, and also allows multiple writes to the same word location without intermediate erase. This is enabled by its MIRRORBIT™ cell architecture and embedded algorithm controller, which manages bit-level programming under host command control.
What is the function of the SSR0–SSR3 regions in the OTP array?
SSR0–SSR3 are four independent 512-byte sub-regions within the 2048-byte OTP array. SSR0 is permanently locked at factory and typically holds device-specific identifiers. SSR1 and SSR2 are user-lockable via command sequence. SSR3 supports password-based read protection, preventing unauthorized access to sensitive calibration or cryptographic keys stored therein.
Can RY/BY# be used as a general-purpose I/O pin?
No. RY/BY# is a dedicated open-drain status output with internal pull-up; it cannot be configured as an input or driven high by external circuitry. Its sole function is to indicate device busy state during program/erase operations. Using it as a GPIO would violate timing specifications and risk data corruption during critical embedded operations.
S29GL01GT12TFN020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 120 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL01GT12TFN020 FAQ
1.How can I place an order for S29GL01GT12TFN020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT12TFN020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT12TFN020 reliable?
The price and inventory of S29GL01GT12TFN020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT12TFN020 is usually 5 days.
3.What payment methods are accepted for S29GL01GT12TFN020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT12TFN020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT12TFN020?
S29GL01GT12TFN020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT12TFN020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT12TFN020?
For technical support, including S29GL01GT12TFN020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT12TFN020 requirements.
6.How does Aetrix verify that S29GL01GT12TFN020 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT12TFN020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT12TFN020 meets industry standards.
7.What is the process for return or replacement of S29GL01GT12TFN020?
All S29GL01GT12TFN020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT12TFN020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT12TFN020 part is unused and in its original packaging.
Return procedure for S29GL01GT12TFN020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GT12TFN020 Tags
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