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Infineon Technologies S29GL01GT12TFN023
- Part No.:
- S29GL01GT12TFN023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL01GT12TFN023.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,067
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Product details
Overview
S29GL01GT12TFN023 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sectors, and supports industrial temperature range (–40°C to +85°C) in a 56-pin TSOP package. It serves as non-volatile program storage in boot code execution and firmware update subsystems.
For engineers reviewing the S29GL01GT12TFN023 datasheet, S29GL01GT12TFN023 pinout, S29GL01GT12TFN023 application, or S29GL01GT12TFN023 equivalent, key selection criteria include parallel ×16 bus interface timing compliance, sector erase granularity, OTP array configuration, and industrial-grade thermal performance under sustained read/write cycles.
Technical Context
This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both ×8 and ×16 data bus configurations. Its embedded algorithm controller (EAC) manages program, erase, suspend/resume, and automatic ECC operations without host CPU intervention.
The flash array is organized into uniform 128-KB sectors, each independently erasable, and includes a dedicated 2048-byte one-time programmable (OTP) array with four lockable regions (SSR0–SSR3), where SSR0 is factory-locked and SSR3 supports password-based read protection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - supports full boot image and firmware storage for mid-tier embedded controllers |
| Interface type | Asynchronous parallel ×16 - enables direct XIP execution without external buffering or translation logic |
| Random access time | 100 ns at –40°C to +85°C - meets real-time interrupt response requirements in industrial control firmware |
| Page access time | 15 ns - accelerates sequential instruction fetch during boot initialization |
| Write buffer size | 512 bytes - reduces effective programming time by batching up to 256 words per operation |
| ECC capability | Internal hardware single-bit error correction - maintains data integrity over 20-year retention without software overhead |
| Endurance | 100,000 program/erase cycles - suitable for field-updatable firmware with infrequent but critical updates |
| Operating temperature | –40°C to +85°C (Industrial grade) - validated for deployment in uncooled industrial PLC and HMI modules |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP), Type I, 14 mm × 20 mm, 0.55 mm pitch, JEDEC MO-141AC compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 1 Gb linear addressing with byte/word alignment |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports ×8 mode via DQ0–DQ7 when BYTE# = LOW |
| CE# | Chip enable | Active-low device select; controls power state entry and timing reference for tCE access |
| OE# | Output enable | Active-low read strobe; gates output drivers during read cycles with tOE timing constraint |
| WE# | Write enable | Active-low write strobe; initiates program/erase command sequences with setup/hold timing |
| RY/BY# | Ready/Busy indicator | Open-drain status signal; LOW during embedded operations, HIGH when ready for next command |
| RESET# | Hardware reset | Active-low asynchronous reset that halts ongoing operations and returns device to read mode |
| VCC | Core supply | 2.7 V to 3.6 V single supply powering core logic, array, and I/O buffers |
| VIO | I/O supply | 1.65 V to VCC versatile I/O voltage - allows interfacing with 1.8 V, 2.5 V, or 3.3 V controllers |
| BYTE# | Bus width select | Configures ×16 (HIGH) or ×8 (LOW) data bus mode; latched on rising edge of CE# |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage (VIO) | Supports 1.65 V to VCC operation - eliminates level shifters when interfacing with mixed-voltage SoCs |
| 512-byte programming buffer | Enables burst programming of up to 256 words - cuts average firmware update time by >4× vs. single-word writes |
| Hardware ECC engine | Single-bit error correction performed transparently during read - removes need for host-side error management logic |
| Uniform 128-KB sectors | Enables deterministic erase scheduling and wear leveling across 1024 independent sectors |
| OTP array with SSR locking | Four 512-byte lockable regions (SSR0–SSR3); SSR0 factory-locked for secure boot keys, SSR3 password-protected for customer secrets |
Applications
| Industrial PLC Firmware Storage | Automotive Instrument Cluster Boot Memory |
|---|---|
Use Scenario: Storing and executing boot loader and real-time control firmware in programmable logic controllers with no external RAM caching. IC Role / Device Role / Timing Role: Primary non-volatile XIP-capable code memory providing sub-100 ns instruction fetch latency during deterministic scan cycles. Use Value: Eliminates external SRAM dependency for boot code execution while sustaining 100,000-cycle endurance over 15-year equipment lifetime. | Use Scenario: Hosting calibrated display graphics, gauge logic, and safety-critical startup routines in automotive digital instrument clusters. IC Role / Device Role / Timing Role: AEC-Q100 Grade 3 qualified boot memory delivering guaranteed read access within 100 ns at –40°C to +85°C ambient. Use Value: Meets ASIL-B functional safety requirements via hardware ECC and locked OTP region (SSR0) for immutable boot signature verification. |
| Medical Imaging System Configuration Storage | Telecom Base Station FPGA Bitstream Storage |
Use Scenario: Retaining calibration tables, user preferences, and regulatory-compliant operational parameters in portable ultrasound and MRI control units. IC Role / Device Role / Timing Role: Non-volatile parameter store with 20-year data retention and sector-level write protection to prevent accidental overwrite. Use Value: Ensures FDA 21 CFR Part 11 audit trail integrity through ASP-enabled sector lockdown and CFI-verified parameter table access. | Use Scenario: Storing reconfigurable FPGA bitstreams used in remote radio head (RRH) and baseband processing modules. IC Role / Device Role / Timing Role: High-reliability parallel flash acting as master configuration source for Xilinx/Intel FPGAs during cold start and dynamic reconfiguration. Use Value: Supports fast 512-byte buffered programming for field-upgradable bitstreams while maintaining <120 ns access for configuration readout timing closure. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP12TFN020 | Same 1 Gb density and TSOP package, but lacks OTP array and SSR locking features | No hardware-enforced secure boot key storage; unsuitable for ASIL-B or regulated medical use | Select when cost sensitivity outweighs secure boot or long-term parameter immutability requirements |
| MX29GL128FPTI-90G | 128-MB (1 Gb) Macronix part with 90 ns random access, no hardware ECC, and no OTP array | Requires external ECC implementation; limited to non-safety-critical firmware storage | Choose for legacy designs already using MX29GL family toolchains and where BOM consolidation is prioritized |
Compared with S29GL01GP12TFN020 and MX29GL128FPTI-90G, the S29GL01GT12TFN023 uniquely integrates OTP-based secure boot support, hardware ECC, and industrial temperature validation - making it the only option among the three qualified for safety-critical firmware storage with zero software ECC overhead.
Availability
S29GL01GT12TFN023 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot memory, and medical imaging system configuration storage requiring stable component supply across extended product lifecycles.
Supply support for S29GL01GT12TFN023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for industrial, automotive, and IoT applications.
The GL-T family targets high-reliability embedded systems requiring XIP-capable parallel NOR flash with integrated data integrity and security features - specifically designed for boot code, firmware, and configuration storage in safety-aware environments.
FAQ
Does S29GL01GT12TFN023 support both ×8 and ×16 data bus modes?
Yes. The device supports configurable ×8 or ×16 operation via the BYTE# pin: when BYTE# is LOW, DQ0–DQ7 function as an 8-bit bus; when HIGH, all DQ0–DQ15 operate as a 16-bit bus. Address lines A0–A21 remain unchanged in both modes, and word-aligned accesses are required regardless of bus width.
What is the role of the SSR0–SSR3 regions in the OTP array?
SSR0–SSR3 are four 512-byte lockable regions within the 2048-byte OTP array. SSR0 is permanently locked at factory and typically stores immutable boot keys; SSR3 supports password-based read protection for customer-defined secrets. SSR1 and SSR2 are user-lockable via command sequence, enabling tiered security for calibration data or licensing tokens.
How does hardware ECC operate during read cycles?
Hardware ECC runs automatically on every read access: the internal ECC engine checks each 512-byte sector, corrects single-bit errors transparently, and reports uncorrectable multi-bit errors via the Status Register's ECCERR bit. No host software intervention or additional timing overhead is required - correction occurs within standard tACC timing.
Can S29GL01GT12TFN023 be used in automotive applications?
Yes - this specific variant (S29GL01GT12TFN023) is rated for Industrial temperature (–40°C to +85°C) and is AEC-Q100 Grade 3 qualified. It is approved for non-safety-critical automotive applications such as infotainment firmware storage and body control module configuration, but not for ASIL-C/D domains requiring Grade 2 (–40°C to +105°C) qualification.
S29GL01GT12TFN023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 120 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL01GT12TFN023 FAQ
1.How can I place an order for S29GL01GT12TFN023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT12TFN023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT12TFN023 reliable?
The price and inventory of S29GL01GT12TFN023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT12TFN023 is usually 5 days.
3.What payment methods are accepted for S29GL01GT12TFN023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT12TFN023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT12TFN023?
S29GL01GT12TFN023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT12TFN023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT12TFN023?
For technical support, including S29GL01GT12TFN023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT12TFN023 requirements.
6.How does Aetrix verify that S29GL01GT12TFN023 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT12TFN023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT12TFN023 meets industry standards.
7.What is the process for return or replacement of S29GL01GT12TFN023?
All S29GL01GT12TFN023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT12TFN023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT12TFN023 part is unused and in its original packaging.
Return procedure for S29GL01GT12TFN023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GT12TFN023 Tags
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