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Infineon Technologies S29GL01GT12TFVV10
- Part No.:
- S29GL01GT12TFVV10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL01GT12TFVV10.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:134
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Product details
Overview
S29GL01GT12TFVV10 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with MIRRORBIT™ technology, operating at 3.0 V core supply (2.7–3.6 V), featuring 100 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It supports ×16 data bus, 512-byte programming buffer, and uniform 128-KB sector erase - deployed in automotive infotainment boot code storage.
For engineers reviewing the S29GL01GT12TFVV10 datasheet, S29GL01GT12TFVV10 pinout, S29GL01GT12TFVV10 application, or S29GL01GT12TFVV10 equivalent, key selection criteria include industrial-plus temperature grade (–40°C to +105°C), TSOP-56 package compatibility, Versatile I/O (1.65–3.6 V), AEC-Q100 Grade 2 qualification, and CFI-compliant firmware update capability.
Technical Context
This device implements an embedded algorithm controller (EAC) that executes program/erase operations autonomously using command sequences compliant with Common Flash Interface (CFI). Its architecture supports asynchronous read, page-mode access, and suspend/resume for concurrent background operations.
The 45-nm MIRRORBIT™ cell enables high-density non-volatile storage with 100,000 program/erase cycles and 20-year data retention. Hardware ECC operates transparently during read, correcting single-bit errors without software intervention or latency penalty.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - supports full OS image or multi-application firmware storage in space-constrained embedded hosts |
| Random access time | 100 ns at –40°C to +85°C - enables direct XIP execution of boot code without external cache buffering |
| Page access time | 15 ns - accelerates sequential instruction fetch in real-time control loops |
| Programming buffer | 512 bytes - reduces effective write time by 4× vs. single-word programming in firmware OTA updates |
| ECC support | Internal hardware single-bit correction - eliminates need for external error-handling logic in safety-critical systems |
| Operating voltage | VCC = 2.7–3.6 V, VIO = 1.65–VCC - allows interoperability with mixed-voltage SoC interfaces (e.g., 1.8 V I/O, 3.3 V core) |
| Temperature grade | AEC-Q100 Grade 2 (–40°C to +105°C) - qualified for under-hood automotive ECUs requiring extended thermal margin |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP-I, Type I), 14 mm × 20 mm, 0.5 mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 128 MB linear addressing (byte/word boundary aligned) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports ×16 mode only (no ×8 fallback) |
| CE# | Chip enable | Active-low device select; tCE ≤ 100 ns ensures tight timing margin in high-speed microcontroller interfaces |
| OE# | Output enable | Active-low read strobe; tOE ≤ 25 ns enables fast data sampling on shared bus architectures |
| WE# | Write enable | Active-low control for write/program/erase commands; latches command sequences into EAC |
| RY/BY# | Ready/Busy output | Open-drain status indicator; asserts low during embedded operations, enabling non-polling interrupt-driven firmware flow |
| RESET# | Hardware reset | Active-low asynchronous reset; restores device to known state after power-on or brownout recovery |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO = 1.65–3.6 V - eliminates level-shifter requirement when interfacing with 1.8 V or 3.3 V host processors |
| Uniform 128-KB sectors | 1024 independent sectors - enables fine-grained firmware partitioning (e.g., bootloader, app, config, OTA staging) |
| Suspend/Resume capability | Interrupts ongoing erase or program to service urgent read requests - critical for real-time diagnostics in automotive gateways |
| OTP array with SSR lock | 2048-byte one-time-programmable region with four lockable sections (SSR0–SSR3), including factory-locked SSR0 - secures cryptographic keys and calibration data |
| Advanced sector protection | Volatile and non-volatile locking per sector - prevents accidental overwrite during field firmware updates via JTAG or CAN bootloader |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores calibrated gauge graphics, driver-assist UI assets, and fail-safe boot images in digital instrument clusters. IC Role / Device Role / Timing Role: Non-volatile XIP-capable boot memory providing deterministic <100 ns instruction fetch for real-time rendering engine. Use Value: AEC-Q100 Grade 2 qualification ensures uninterrupted operation across –40°C to +105°C ambient, eliminating thermal derating in dashboard modules. | Use Scenario: Holds ladder logic runtime, configuration parameters, and firmware patches in programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: High-reliability firmware archive with 100,000 erase cycles and 20-year retention - withstands decades of scheduled updates in unattended machinery. Use Value: Hardware ECC prevents silent corruption of control logic during voltage transients on factory floor power buses. |
| Medical Imaging Boot Loader | Avionics Data Recorder |
Use Scenario: Stores certified boot firmware and diagnostic self-test routines in portable ultrasound and MRI console subsystems. IC Role / Device Role / Timing Role: Secure, tamper-resistant storage with OTP-locked calibration constants and CFI-compliant interface for regulatory audit traceability. Use Value: SSR3 password-read protection prevents unauthorized extraction of proprietary imaging algorithms during service depot maintenance. | Use Scenario: Retains flight-critical event logs, sensor calibration tables, and black-box recording metadata in airborne data acquisition units. IC Role / Device Role / Timing Role: Radiation-tolerant (qualified per AEC-Q100 stress profiles) non-volatile memory with suspend/resume for uninterrupted logging during power switching events. Use Value: 128-KB uniform sectors allow atomic overwrites of timestamped log segments without erasing adjacent mission-critical data. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT12TFIV10 | Same die, TSOP-56 package, Industrial grade (–40°C to +85°C), no AEC-Q100 qualification | Lacks automotive qualification; unsuitable for under-hood deployment but lower cost for indoor industrial use | Select when thermal range ≤85°C and automotive certification is not required |
| MX29GL128FDTI-90G | 128 MB, 90 ns access, 3.0 V, TSOP-56, no integrated ECC or OTP array | Requires external error handling and lacks secure key storage - increases BOM and firmware complexity | Select only if legacy design mandates Macronix pinout compatibility and ECC is implemented in host MCU |
Compared with S29GL01GT12TFIV10, the VV10 variant adds AEC-Q100 Grade 2 qualification and extended temperature support; versus MX29GL128FDTI-90G, it delivers hardware ECC, OTP security, and faster 15 ns page access - reducing system-level validation effort in safety-critical designs.
Availability
S29GL01GT12TFVV10 is available at Aetrix Electronics and suitable for automotive infotainment, industrial PLC firmware storage, and medical imaging boot loader applications requiring stable component supply across extended lifecycle programs.
Supply support for S29GL01GT12TFVV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions for industrial and transportation markets.
The GL-T family targets automotive and industrial embedded systems needing robust, high-density parallel NOR flash with XIP capability, ECC, and AEC-Q100 compliance - bridging performance and functional safety requirements.
FAQ
Is S29GL01GT12TFVV10 pin-compatible with earlier S29GL01GP or S29GL01GS variants?
No. S29GL01GT uses a revised command set and timing model versus GP/GS generations. Pinout is identical in TSOP-56, but CE#/OE#/WE# timing margins and RY/BY# behavior differ. Migration requires firmware revalidation and may need PCB layout review for signal integrity at 100 ns access.
Does the 512-byte programming buffer support partial-page writes?
Yes. The buffer accepts any multiple of 16-bit words up to 256 words (512 bytes), allowing partial-page programming without erasing unused portions. Each write operation must be aligned to word boundaries and within a single 128-KB sector.
How is the OTP array secured against unauthorized read access?
SSR3 (Sector Security Register 3) supports password-based read protection: a 16-byte password must be written to the SSR3 lock register before read attempts succeed. Without correct password entry, all OTP data reads return 0xFF. SSR0 is factory-locked and permanently read-protected.
Can S29GL01GT12TFVV10 operate in ×8 data bus mode?
No. This device is ×16-only. DQ0–DQ15 are fully functional; DQ8–DQ15 are not masked or disabled in byte mode. Host interface must implement 16-bit data transfers - no software-configurable ×8 fallback is supported per datasheet Section 8.3.
S29GL01GT12TFVV10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 120 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL01GT12TFVV10 FAQ
1.How can I place an order for S29GL01GT12TFVV10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT12TFVV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT12TFVV10 reliable?
The price and inventory of S29GL01GT12TFVV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT12TFVV10 is usually 5 days.
3.What payment methods are accepted for S29GL01GT12TFVV10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT12TFVV10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT12TFVV10?
S29GL01GT12TFVV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT12TFVV10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT12TFVV10?
For technical support, including S29GL01GT12TFVV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT12TFVV10 requirements.
6.How does Aetrix verify that S29GL01GT12TFVV10 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT12TFVV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT12TFVV10 meets industry standards.
7.What is the process for return or replacement of S29GL01GT12TFVV10?
All S29GL01GT12TFVV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT12TFVV10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT12TFVV10 part is unused and in its original packaging.
Return procedure for S29GL01GT12TFVV10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GT12TFVV10 Tags
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