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Infineon Technologies S29GL01GT12TFVV13
- Part No.:
- S29GL01GT12TFVV13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL01GT12TFVV13.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,672
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Product details
Overview
S29GL01GT12TFVV13 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, internal single-bit ECC, uniform 128-KB sectors, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring fast XIP execution and reliable non-volatile data retention.
For engineers reviewing the S29GL01GT12TFVV13 datasheet, S29GL01GT12TFVV13 pinout, S29GL01GT12TFVV13 application, or S29GL01GT12TFVV13 equivalent, key selection criteria include verified 100,000 program/erase cycles, 20-year data retention, TSOP-56 package compatibility, and support for asynchronous read, sector erase, and suspend/resume operations in embedded firmware storage systems.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus configuration and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages program, erase, and status monitoring without external microcontroller intervention.
The architecture integrates hardware-based ECC for single-bit error correction and supports multiple protection mechanisms including volatile/non-volatile sector lock, OTP array with four SSR regions, and CFI-compliant parameter tables for host software identification and configuration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - sufficient for full firmware images and configuration data in industrial HMI and gateway devices |
| Supply voltage (VCC) | 2.7 V to 3.6 V - enables direct integration with 3.3 V logic systems without level-shifting |
| Random access time (tACC) | 100 ns at –40°C to +85°C - meets real-time boot latency requirements for deterministic startup |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch during XIP operation |
| Write buffer size | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| Erase endurance | 100,000 cycles - supports field firmware updates over product lifetime in deployed equipment |
| Data retention | 20 years - ensures long-term reliability of stored calibration and configuration parameters |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP), 14 mm × 20 mm, standard JEDEC MO-142AB footprint with gull-wing leads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit address bus supporting full 128 MB linear addressing with byte/word boundary alignment |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates in ×8 or ×16 mode depending on BYTE# state |
| CE# | Chip enable | Active-low control enabling device for read/write; tCE = 100 ns max defines minimum chip select assertion window |
| OE# | Output enable | Active-low control gating output drivers; tOE = 25 ns max ensures timely data valid window |
| WE# | Write enable | Active-low signal initiating internal program/erase algorithms when combined with valid command sequences |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active internal operation; allows host to poll without continuous bus access |
| BYTE# | Bus width select | Configures data bus as ×8 (BYTE# = low) or ×16 (BYTE# = high); determines DQ0–DQ7 vs. DQ0–DQ15 usage |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O (VIO) | Supports VIO from 1.65 V to VCC - enables interoperability with mixed-voltage SoC interfaces without external translators |
| Hardware ECC | Single-bit error correction implemented in silicon - eliminates need for software ECC overhead in boot ROM path |
| Suspend/Resume | Interruptible program and erase operations - allows high-priority read access during background writes in real-time systems |
| OTP array | 2048-byte one-time programmable space with four lockable SSR regions - secures bootloader keys and device-specific identifiers |
| CFI compliance | Standardized parameter table accessible via address/command sequence - enables automatic driver detection and configuration in Linux MTD and U-Boot |
Applications
| Industrial PLC Firmware Storage | Automotive Gateway Boot Memory |
|---|---|
Use Scenario: Storing boot firmware and runtime configuration in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with ≤100 ns latency. Use Value: Ensures deterministic cold-start within 500 ms while supporting field-upgradable firmware via sector-protected update partitions. | Use Scenario: Holding secure boot loader and communication stack binaries in automotive Ethernet gateways compliant with AEC-Q100 Grade 2. IC Role / Device Role / Timing Role: Trusted boot memory with OTP-locked security keys and hardware ECC for ASIL-B functional safety paths. Use Value: Meets ISO 26262 requirements for fault-tolerant code storage with 20-year retention and 100K-cycle endurance under thermal cycling. |
| Medical Imaging System Configuration | Telecom Base Station FPGA Bitstream |
Use Scenario: Retaining calibration profiles, sensor offsets, and UI language packs in portable ultrasound and MRI control units. IC Role / Device Role / Timing Role: Non-volatile parameter store with sector-level write protection to prevent accidental overwrite during diagnostics. Use Value: Guarantees regulatory-compliant data integrity through hardware-based ECC and 128-KB uniform sector architecture. | Use Scenario: Storing reconfigurable FPGA bitstreams for multi-standard radio processing in 4G/5G base station remote radio units. IC Role / Device Role / Timing Role: High-reliability configuration memory supporting rapid partial reconfiguration with suspend/resume capability. Use Value: Enables <100 ms FPGA reload during RF band switching while maintaining data integrity across 100K+ field updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP12TFIV10 | Same 1 Gb density and TSOP-56 package but rated for industrial-plus (–40°C to +105°C) and lacks OTP array | Used where extended temperature operation is required but secure key storage is not needed | Select when thermal margin exceeds +85°C and SSR-based security is unnecessary |
| MX29GL128FPTI-90G | 128 MB density, 90 ns access, no hardware ECC, no OTP, different command set and CFI layout | Lower-cost alternative for legacy designs without ECC or secure boot requirements | Choose only for cost-sensitive, non-safety-critical applications with existing MXIC driver support |
Compared with S29GL01GP12TFIV10 and MX29GL128FPTI-90G, the S29GL01GT12TFVV13 uniquely combines industrial-grade temperature support, integrated ECC, and factory-lockable OTP-making it optimal for new designs requiring boot integrity, long-term reliability, and field-upgrade security.
Availability
S29GL01GT12TFVV13 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive gateway boot memory, and medical imaging system configuration requiring stable component supply across extended lifecycle programs.
Supply support for S29GL01GT12TFVV13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
The GL-T family targets high-reliability embedded systems needing fast XIP execution and robust non-volatile storage, combining MIRRORBIT™ density advantages with industrial and automotive qualification rigor.
FAQ
Is S29GL01GT12TFVV13 pin-compatible with earlier S29GL01GT variants?
Yes, S29GL01GT12TFVV13 uses the standard 56-pin TSOP package with identical pinout and electrical characteristics as other S29GL01GT devices in the same package variant. Address, data, and control signals map identically, enabling drop-in replacement where temperature grade and OTP requirements align.
Does this device support both ×8 and ×16 data bus modes?
Yes, S29GL01GT12TFVV13 supports configurable ×8 or ×16 operation via the BYTE# pin. When BYTE# is low, DQ0–DQ7 are active for byte-wide transfers; when high, DQ0–DQ15 operate as a full 16-bit bus, allowing flexible integration with 8-bit or 16-bit microcontrollers and SoCs.
What is the function of the SSR0–SSR3 regions in the OTP array?
SSR0–SSR3 are four 512-byte lockable sectors within the 2048-byte OTP array. SSR0 is factory-locked and typically holds device identity; SSR3 supports password-based read protection. SSR1 and SSR2 can be user-locked to store cryptographic keys, calibration data, or serial numbers with irreversible write-once security.
How does the hardware ECC operate during read cycles?
Hardware ECC runs transparently during every read operation: the device checks each 512-byte page for single-bit errors and corrects them in real time before presenting data on DQ lines. No software intervention is required, and corrected data appears identical to uncorrupted reads-ensuring seamless XIP execution and boot reliability.
S29GL01GT12TFVV13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 120 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL01GT12TFVV13 FAQ
1.How can I place an order for S29GL01GT12TFVV13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT12TFVV13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT12TFVV13 reliable?
The price and inventory of S29GL01GT12TFVV13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT12TFVV13 is usually 5 days.
3.What payment methods are accepted for S29GL01GT12TFVV13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT12TFVV13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT12TFVV13?
S29GL01GT12TFVV13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT12TFVV13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT12TFVV13?
For technical support, including S29GL01GT12TFVV13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT12TFVV13 requirements.
6.How does Aetrix verify that S29GL01GT12TFVV13 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT12TFVV13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT12TFVV13 meets industry standards.
7.What is the process for return or replacement of S29GL01GT12TFVV13?
All S29GL01GT12TFVV13 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT12TFVV13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT12TFVV13 part is unused and in its original packaging.
Return procedure for S29GL01GT12TFVV13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GT12TFVV13 Tags
-
M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
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