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Infineon Technologies S29GL01GT13DHNV10
- Part No.:
- S29GL01GT13DHNV10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GT13DHNV10.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,171
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Product details
Overview
S29GL01GT13DHNV10 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sectors, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for network routers requiring fast XIP execution and reliable firmware retention.
For engineers reviewing the S29GL01GT13DHNV10 datasheet, S29GL01GT13DHNV10 pinout, S29GL01GT13DHNV10 application, or S29GL01GT13DHNV10 equivalent, key selection criteria include parallel ×16 bus interface, 100,000 program/erase cycles, OTP array with four lockable SSR regions, CFI compliance, and support for suspend/resume during erase.
Technical Context
This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both 8-bit and 16-bit data bus configurations. Its embedded algorithm controller (EAC) manages program, erase, and status monitoring without external intervention.
The internal hardware ECC operates transparently during read operations and corrects single-bit errors in real time. Sector protection includes volatile and non-volatile methods per sector, plus a dedicated 2048-byte OTP array with factory-locked SSR0 and password-protected SSR3.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Gb (128 MB), enabling full boot image and firmware storage in single-package solution |
| Access Time (tACC) | 100 ns at –40°C to +85°C, supporting real-time XIP execution in embedded controllers |
| Page Access Time (tPACC) | 15 ns, accelerating sequential instruction fetch during boot or firmware update |
| Write Buffer Size | 512 bytes, reducing effective programming time by batching up to 256 words per command |
| ECC Capability | Single-bit error correction via on-die hardware, eliminating need for external ECC logic |
| Endurance | 100,000 program/erase cycles per sector, suitable for field-upgradable systems |
| Data Retention | 20 years at +85°C, ensuring long-term reliability in unattended infrastructure equipment |
Pinout & Package
Package: 56-pin TSOP (Type I, standard thin small outline package) with 0.5 mm pitch, JEDEC MO-141AC compliant, suitable for high-density PCB layouts and reflow soldering.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address Inputs | 22-bit address bus supporting full 128 MB linear addressing with byte/word alignment |
| DQ0–DQ15 | Data I/O (×16 mode) | Bidirectional 16-bit data path; configurable for ×8 mode via BYTE# pin |
| CE# | Chip Enable | Active-low enable controlling device selection in multi-chip memory subsystems |
| OE# | Output Enable | Active-low control for data bus output gating during read operations |
| WE# | Write Enable | Active-low signal initiating internal program or erase algorithms upon command sequence |
| RY/BY# | Ready/Busy Output | Open-drain status indicator showing active operation (low) or completion (high) |
| RESET# | Hardware Reset | Asynchronous reset input forcing device into known state, clearing status registers and aborting operations |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O (VIO) | Independent VIO supply (1.65 V to VCC) allows interfacing with 1.8 V, 2.5 V, or 3.3 V controllers without level shifters |
| Suspend/Resume | Interrupts ongoing program or erase to service higher-priority reads, then resumes from exact point |
| Advanced Sector Protection (ASP) | Per-sector lock/unlock via volatile (SRAM-based) or non-volatile (flash-based) methods for flexible firmware partitioning |
| Common Flash Interface (CFI) | Standardized parameter table enables automatic detection and configuration by bootloader or OS flash drivers |
| OTP Array with SSR Locking | 2048-byte one-time-programmable space divided into four lockable regions, with SSR0 factory-locked and SSR3 password-protected |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader and safety-critical firmware in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Non-volatile boot memory providing deterministic 100 ns random access for XIP execution during cold start. Use Value: 20-year data retention and 100,000-cycle endurance ensure firmware integrity across 15+ year equipment lifecycles without replacement. | Use Scenario: Holding certified boot code and sensor calibration data in automotive ADAS ECUs requiring AEC-Q100 Grade 2 qualification. IC Role / Device Role / Timing Role: Parallel NOR flash with industrial-plus temperature rating (–40°C to +105°C) and hardware ECC for ASIL-B compliance. Use Value: Internal ECC eliminates external error-handling logic, reducing BOM count and board area while meeting ISO 26262 functional safety requirements. |
| Network Router Boot Image | Medical Imaging System Configuration |
Use Scenario: Hosting compressed Linux kernel and root filesystem in carrier-grade edge routers requiring fast boot and field updates. IC Role / Device Role / Timing Role: High-speed parallel interface with 15 ns page access enabling rapid instruction prefetch during boot sequence. Use Value: 512-byte write buffer cuts firmware update time by >4× versus single-word programming, minimizing system downtime during maintenance. | Use Scenario: Storing device-specific calibration tables and regulatory-compliant configuration profiles in FDA-cleared diagnostic imaging equipment. IC Role / Device Role / Timing Role: OTP-secured SSR3 region stores encrypted calibration keys with password read protection to prevent unauthorized access. Use Value: Four-lockable SSR regions allow segregation of factory, service, and user data-ensuring auditability and HIPAA-aligned data governance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP13DHIV10 | Same density and timing, but uses 64-ball LAE BGA (9 mm × 9 mm); no TSOP option | Preferred for space-constrained designs where PCB area is prioritized over manual assembly or rework accessibility | Select when footprint miniaturization outweighs TSOP's ease of prototyping and thermal performance |
| MX29GL128FDTM2I-90G | 128 MB ×16, 90 ns tACC, Macronix; lacks OTP array and SSR locking, no CFI support | Suitable for cost-sensitive consumer applications where firmware security and standardized driver support are not required | Choose only if CFI auto-detection, hardware ECC, and secure OTP features are unnecessary |
Compared with S29GL01GP13DHIV10, this TSOP variant offers superior thermal dissipation and hand-soldering capability; versus MX29GL128FDTM2I-90G, it delivers stronger security, longer data retention, and broader ecosystem compatibility via CFI.
Availability
S29GL01GT13DHNV10 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and network router boot image applications requiring stable component supply, long-lifecycle support, and traceable sourcing.
Supply support for S29GL01GT13DHNV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
The GL-T family targets high-reliability embedded systems needing fast XIP-capable flash with robust data integrity, combining speed of data storage flash with the determinism of boot ROM.
FAQ
What is the function of the RY/BY# pin?
The RY/BY# pin is an open-drain ready/busy status output. It asserts low during internal program, erase, or suspend operations and returns high when the device is idle or ready for the next command. It supports polling-based status checking and can be wire-OR'd with other devices in multi-chip systems.
Does S29GL01GT13DHNV10 support both ×8 and ×16 data bus modes?
Yes - it supports both modes via the BYTE# pin. When BYTE# is low, the device operates in ×16 mode using DQ0–DQ15; when high, it operates in ×8 mode using DQ0–DQ7 only. Address lines remain unchanged, and all accesses maintain byte/word boundary alignment.
How does the Versatile I/O (VIO) feature benefit system design?
VIO allows independent VIO supply (1.65 V to VCC), enabling direct connection to 1.8 V, 2.5 V, or 3.3 V host processors without external level shifters. This reduces component count, simplifies layout, and improves signal integrity in mixed-voltage systems such as industrial gateways with legacy and modern controllers.
Can the OTP array be reprogrammed after initial programming?
No - the 2048-byte OTP array is one-time programmable. Once a bit is set to '0', it cannot be changed back to '1'. Regions SSR0–SSR3 can be individually locked; SSR0 is factory-locked and irreversible, while SSR3 supports password-protected read access to safeguard sensitive calibration or cryptographic keys.
S29GL01GT13DHNV10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 130 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL01GT13DHNV10 FAQ
1.How can I place an order for S29GL01GT13DHNV10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT13DHNV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT13DHNV10 reliable?
The price and inventory of S29GL01GT13DHNV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT13DHNV10 is usually 5 days.
3.What payment methods are accepted for S29GL01GT13DHNV10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT13DHNV10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT13DHNV10?
S29GL01GT13DHNV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT13DHNV10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT13DHNV10?
For technical support, including S29GL01GT13DHNV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT13DHNV10 requirements.
6.How does Aetrix verify that S29GL01GT13DHNV10 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT13DHNV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT13DHNV10 meets industry standards.
7.What is the process for return or replacement of S29GL01GT13DHNV10?
All S29GL01GT13DHNV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT13DHNV10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT13DHNV10 part is unused and in its original packaging.
Return procedure for S29GL01GT13DHNV10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GT13DHNV10 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
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