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Infineon Technologies S29GL01GT13DHNV13
- Part No.:
- S29GL01GT13DHNV13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GT13DHNV13.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,383
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Product details
Overview
S29GL01GT13DHNV13 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It integrates hardware ECC for single-bit error correction, supports 128-KB uniform sector erase, and includes a 512-byte programming buffer - deployed in industrial-grade embedded boot code storage and firmware update storage applications.
For engineers reviewing the S29GL01GT13DHNV13 datasheet, S29GL01GT13DHNV13 pinout, S29GL01GT13DHNV13 application, or S29GL01GT13DHNV13 equivalent, key selection criteria include verified 128-KB sector granularity, industrial temperature range (–40°C to +85°C), TSOP-56 package compatibility, and CFI-compliant command interface for legacy system integration.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus support and byte/word boundary addressing. Its embedded algorithm controller (EAC) executes program and erase operations autonomously, with suspend/resume capability for both functions.
The device uses internal hardware ECC for real-time single-bit error correction during read cycles and supports four lockable 2048-byte OTP regions - including factory-locked SSR0 and password-protected SSR3 - for secure configuration storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - sufficient for full boot image + application firmware in resource-constrained microcontroller systems |
| Access time (tACC) | 100 ns at –40°C to +85°C - enables direct XIP execution without external cache in real-time control systems |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch during boot or firmware patch loading |
| Programming buffer | 512 bytes - reduces effective programming time by up to 4× vs. single-word writes in field firmware updates |
| ECC capability | Single-bit correction per 512-byte sector - maintains data integrity over 20-year retention without host-side correction logic |
| Endurance | 100,000 program/erase cycles - supports frequent OTA updates in industrial gateways and edge controllers |
| Operating voltage | 2.7 V to 3.6 V - compatible with standard 3.3 V supply rails and tolerant of brown-out conditions |
| Temperature grade | Industrial (–40°C to +85°C) - qualified for deployment in factory automation PLCs and motor drives |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 128 MB linear addressing with byte/word boundary alignment |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates in ×8 or ×16 mode via BYTE# pin configuration |
| CE# | Chip enable | Active-low chip select enabling device participation in parallel bus transactions |
| OE# | Output enable | Controls output drivers during read cycles; decouples data bus timing from address setup |
| WE# | Write enable | Initiates write/program/erase commands when asserted with valid address and data |
| RY/BY# | Ready/Busy indicator | Open-drain status signal indicating internal operation completion or suspension |
| RESET# | Hardware reset | Asynchronous active-low input forcing device into known state, clearing pending operations |
| VCC | Core power | 2.7–3.6 V supply powering logic, memory array, and ECC engine |
| VIO | I/O power | 1.65 V to VCC - allows interfacing with 1.8 V, 2.5 V, or 3.3 V host processors without level shifters |
| BYTE# | Bus width select | Configures ×8 (high) or ×16 (low) data bus operation; determines DQ0–DQ7 vs. DQ0–DQ15 usage |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage | VIO range 1.65 V to VCC enables mixed-voltage system integration without external level translation |
| 512-byte programming buffer | Reduces average programming time per sector by buffering up to 512 bytes before internal write execution |
| Hardware ECC engine | On-the-fly single-bit error correction eliminates need for host CPU intervention during read operations |
| Uniform 128-KB sectors | Enables deterministic firmware partitioning - e.g., separate boot loader, kernel, and parameter sectors |
| OTP array with SSR locking | Four 2048-byte one-time-programmable regions allow secure storage of keys, calibration data, or MAC addresses |
Applications
| Industrial PLC Firmware Storage | Automotive Instrument Cluster Boot Memory |
|---|---|
Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers requiring deterministic startup and field-upgradable code. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with ≤100 ns latency. Use Value: Eliminates external SRAM copy step during boot; 128-KB sector erase supports modular firmware updates without full reflash. | Use Scenario: Holding calibrated display graphics, safety-critical boot code, and driver configuration data in automotive digital instrument clusters. IC Role / Device Role / Timing Role: AEC-Q100 grade 3 qualified parallel flash serving as primary boot ROM with hardware ECC for ASIL-B compliance. Use Value: Internal ECC ensures display integrity under EMI stress; OTP regions store factory-calibrated brightness and color profiles. |
| Medical Imaging System Configuration | Telecom Base Station FPGA Bitstream Storage |
Use Scenario: Retaining device-specific calibration tables, sensor compensation coefficients, and regulatory compliance settings across power cycles in diagnostic imaging equipment. IC Role / Device Role / Timing Role: Secure configuration storage with password-protected SSR3 region preventing unauthorized parameter modification. Use Value: Factory-locked SSR0 stores immutable safety watchdog parameters; SSR3 holds user-modifiable calibration data with password enforcement. | Use Scenario: Storing FPGA configuration bitstreams for baseband processing units in 4G/5G radio units where fast, reliable reconfiguration is required after power loss. IC Role / Device Role / Timing Role: High-reliability parallel flash delivering 15 ns page access to minimize FPGA configuration time during cold start. Use Value: 512-byte buffer enables full bitstream load in fewer bus cycles; 20-year data retention guarantees field longevity without refresh. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP13DHVI13 | Same density and core specs, but rated for Industrial Plus (–40°C to +105°C); identical TSOP-56 package | Required for extended-temperature industrial control cabinets or outdoor telecom enclosures | Select when ambient operating temperature exceeds +85°C but no package change is desired |
| MX29GL128FHI-90G | 128 MB density, 90 ns tACC, no integrated ECC, 1.8 V/3.3 V dual VIO support | Lacks hardware ECC; requires host-side error handling; broader voltage flexibility | Choose only if system already implements software ECC and needs wider I/O voltage range |
Compared with S29GL01GP13DHVI13, this part trades extended temperature rating for lower cost in standard industrial environments; versus MX29GL128FHI-90G, it delivers guaranteed ECC protection and tighter timing consistency at the expense of I/O voltage versatility.
Availability
S29GL01GT13DHNV13 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot memory, and medical imaging system configuration requiring stable component supply and long-term lifecycle support.
Supply support for S29GL01GT13DHNV13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and R&D infrastructure.
The GL-T family targets high-reliability embedded systems needing XIP-capable flash with robust data integrity - designed specifically for industrial control, automotive instrumentation, and medical electronics where firmware security and long-term retention are critical.
FAQ
Does S29GL01GT13DHNV13 support both ×8 and ×16 data bus modes?
Yes. The BYTE# pin configures bus width: high for ×8 mode (DQ0–DQ7 active), low for ×16 mode (DQ0–DQ15 active). Address lines A0–A21 remain fully utilized in both configurations, with A0 ignored in ×16 mode per JEDEC specification.
What is the function of the SSR0–SSR3 regions in the OTP array?
SSR0–SSR3 are four 2048-byte one-time-programmable regions. SSR0 is factory-locked and immutable; SSR3 supports password-based read protection. SSR1 and SSR2 are user-lockable for storing calibration data, security keys, or device identifiers without risk of accidental overwrite.
How does the hardware ECC operate during read cycles?
The ECC engine automatically checks each 512-byte sector during read access. If a single-bit error is detected, it is corrected in real time before data is driven onto the DQ bus. No host intervention or additional timing overhead is required, and corrected data is transparently delivered.
Is the Ready/Busy# (RY/BY#) pin compatible with standard microcontroller GPIO inputs?
Yes. RY/BY# is an open-drain output requiring an external pull-up resistor (typically 4.7 kΩ to VIO). It asserts low during internal program/erase operations and goes high upon completion or suspension, directly interfacing with GPIO interrupt or polling inputs on most MCUs without additional logic.
S29GL01GT13DHNV13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 130 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL01GT13DHNV13 FAQ
1.How can I place an order for S29GL01GT13DHNV13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT13DHNV13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT13DHNV13 reliable?
The price and inventory of S29GL01GT13DHNV13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT13DHNV13 is usually 5 days.
3.What payment methods are accepted for S29GL01GT13DHNV13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT13DHNV13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT13DHNV13?
S29GL01GT13DHNV13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT13DHNV13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT13DHNV13?
For technical support, including S29GL01GT13DHNV13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT13DHNV13 requirements.
6.How does Aetrix verify that S29GL01GT13DHNV13 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT13DHNV13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT13DHNV13 meets industry standards.
7.What is the process for return or replacement of S29GL01GT13DHNV13?
All S29GL01GT13DHNV13 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT13DHNV13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT13DHNV13 part is unused and in its original packaging.
Return procedure for S29GL01GT13DHNV13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GT13DHNV13 Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
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AT24C02C-SSHM-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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AT24C08C-STUM-T
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