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Infineon Technologies S29GL01GT13DHNV23
- Part No.:
- S29GL01GT13DHNV23
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GT13DHNV23.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,271
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Product details
Overview
S29GL01GT13DHNV23 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, internal hardware ECC for single-bit error correction, and uniform 128-KB sector erase - deployed in industrial-grade embedded systems requiring reliable code storage and XIP execution.
For engineers reviewing the S29GL01GT13DHNV23 datasheet, S29GL01GT13DHNV23 pinout, S29GL01GT13DHNV23 application, or S29GL01GT13DHNV23 equivalent, key selection criteria include its 128-KB uniform sector architecture, Versatile I/O support (1.65 V–VCC), OTP array with four lockable SSR regions, and AEC-Q100 Grade 2 qualification for automotive control modules.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus configuration and supports byte/word boundary addressing only. Its embedded algorithm controller (EAC) manages program, erase, suspend/resume, and automatic ECC correction without host intervention.
The flash uses address space overlays (ASOs) for Device ID/CFI, Status Register, Data Polling, SSR, and ECC status - enabling standardized software compatibility and robust firmware update handling across boot loaders and real-time OS environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - sufficient for full firmware images and dual-bank OTA updates in industrial controllers |
| Access time (tACC) | 100 ns at –40°C to +85°C - enables deterministic real-time code fetch in XIP applications |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch during burst reads |
| Write buffer size | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| ECC capability | Internal hardware single-bit error correction - eliminates need for external ECC logic in safety-critical boot memory |
| Sector size | Uniform 128 KB - simplifies partitioning for bootloader, kernel, and filesystem in embedded Linux or RTOS |
| Data retention | 20 years - ensures long-term reliability in unattended infrastructure equipment |
| Endurance | 100,000 program/erase cycles - supports frequent field firmware updates over product lifetime |
Pinout & Package
Package: 56-pin TSOP (Type I, standard pitch). Pinout validated per Infineon datasheet Rev. *M, Section 12.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 128-MB linear addressing with byte/word alignment |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus; operates in ×8 or ×16 mode depending on BYTE# state |
| CE# | Chip enable | Active-low chip select; tCE = 100 ns max - defines minimum chip activation latency |
| OE# | Output enable | Controls data bus output timing; tOE = 25 ns max - critical for read setup/hold compliance |
| WE# | Write enable | Initiates write/program operations; latches command sequences into EAC |
| RY/BY# | Ready/Busy indicator | Open-drain status signal; asserts low during embedded program/erase - enables non-polling status monitoring |
| VCC | Core supply | 2.7–3.6 V single supply - powers core logic, array, and EAC; no separate VPP required |
| VIO | I/O supply | 1.65 V to VCC - allows interfacing with 1.8 V, 2.5 V, or 3.3 V host processors |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V–VCC - eliminates level shifters when connecting to mixed-voltage SoCs |
| Hardware ECC engine | Single-bit correction implemented in silicon - reduces BOM cost and firmware overhead vs. software ECC |
| OTP array with SSR locking | 2048-byte one-time-programmable region with four password-protected sectors - secures bootloader keys and calibration data |
| Suspend/Resume capability | Halts active program/erase to service high-priority reads - essential for real-time interrupt response in motor control |
| Common Flash Interface (CFI) | Standardized parameter table accessible via read commands - enables generic flash drivers across toolchains |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing firmware and configuration data in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Non-volatile code storage with XIP capability and deterministic 100 ns read access for real-time task scheduling. Use Value: 20-year data retention and 100,000-cycle endurance ensure firmware integrity over 15+ year deployment without replacement. | Use Scenario: Boot memory for radar processing units requiring AEC-Q100 Grade 2 qualification (–40°C to +105°C). IC Role / Device Role / Timing Role: Secure, fast-access boot image storage with hardware ECC and OTP-locked bootloader signature verification. Use Value: Internal ECC and SSR-based password protection meet ASIL-B functional safety requirements for boot integrity. |
| Medical Imaging System BIOS | Telecom Baseband Processor Code Storage |
Use Scenario: Storing BIOS and FPGA configuration bitstreams in CT/MRI scanner mainboards with strict thermal and reliability constraints. IC Role / Device Role / Timing Role: High-reliability, extended-temperature (–40°C to +125°C) flash for cold-start initialization and fail-safe recovery. Use Value: 120 ns tACC at +125°C and 215 μA standby current minimize thermal load while maintaining boot timing margins. | Use Scenario: Code storage for multi-core baseband processors in 5G small cell radios requiring rapid firmware updates and field patching. IC Role / Device Role / Timing Role: Dual-bank capable flash supporting background erase and seamless OTA updates without service interruption. Use Value: 512-byte write buffer and suspend/resume enable <100 ms firmware patch application during live traffic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP13DHIV23 | Same density and package, but rated for Industrial Plus (–40°C to +105°C) only - lacks Extended (–40°C to +125°C) and AEC-Q100 Grade 2 variants | Not qualified for under-hood automotive use or high-temp medical enclosures | Select when ambient temperature stays ≤ +105°C and automotive qualification is unnecessary |
| MX29GL128FPTI-90G | 128 MB ×16, 90 ns tACC, no integrated ECC, no OTP array, CFI-compliant but no SSR locking | Lacks hardware ECC and secure OTP - requires external error management and key storage | Choose for cost-sensitive designs where firmware integrity is managed in software and security is not mandated |
Compared with S29GL01GP13DHIV23, this part adds extended temperature and automotive qualification; versus MX29GL128FPTI-90G, it delivers integrated ECC, OTP security, and tighter timing - making it optimal for safety- and reliability-critical embedded boot memory.
Availability
S29GL01GT13DHNV23 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS modules, medical imaging BIOS, and telecom baseband processor code storage requiring stable component supply across long-life production cycles.
Supply support for S29GL01GT13DHNV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions for industrial and automotive markets.
The GL-T family targets high-reliability embedded systems needing XIP-capable NOR flash with enhanced data integrity, security, and extended temperature operation - bridging performance gaps between legacy parallel flash and newer serial alternatives.
FAQ
Is S29GL01GT13DHNV23 pin-compatible with earlier S29GL01GT versions?
Yes - it shares identical 56-pin TSOP pinout and electrical interface with all S29GL01GT variants in the same package type. Signal definitions, timing parameters, and command set remain fully backward compatible per Infineon's GL-T family documentation.
Does this device support both ×8 and ×16 data bus modes?
Yes - configured via the BYTE# input: asserted low for ×16 mode (DQ0–DQ15 active), high for ×8 mode (DQ0–DQ7 active). Address lines A0–A21 remain unchanged; word/byte addressing is handled internally without external glue logic.
What is the function of the SSR0–SSR3 regions in the OTP array?
SSR0–SSR3 are four 512-byte lockable sectors within the 2048-byte OTP array. SSR0 is factory-locked and immutable; SSR3 supports password-based read protection. SSR1 and SSR2 are user-lockable for storing calibration data, cryptographic keys, or device-specific identifiers.
Can S29GL01GT13DHNV23 operate with VIO = 1.8 V while VCC = 3.3 V?
Yes - the Versatile I/O feature explicitly supports VIO from 1.65 V to VCC. At VCC = 3.3 V, VIO may be independently set to 1.8 V, enabling direct connection to 1.8 V I/O domains without level translation circuitry.
S29GL01GT13DHNV23 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 130 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL01GT13DHNV23 FAQ
1.How can I place an order for S29GL01GT13DHNV23 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT13DHNV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT13DHNV23 reliable?
The price and inventory of S29GL01GT13DHNV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT13DHNV23 is usually 5 days.
3.What payment methods are accepted for S29GL01GT13DHNV23?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT13DHNV23 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT13DHNV23?
S29GL01GT13DHNV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT13DHNV23 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT13DHNV23?
For technical support, including S29GL01GT13DHNV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT13DHNV23 requirements.
6.How does Aetrix verify that S29GL01GT13DHNV23 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT13DHNV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT13DHNV23 meets industry standards.
7.What is the process for return or replacement of S29GL01GT13DHNV23?
All S29GL01GT13DHNV23 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT13DHNV23, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT13DHNV23 part is unused and in its original packaging.
Return procedure for S29GL01GT13DHNV23:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GT13DHNV23 Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
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AT24C02C-SSHM-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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