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Infineon Technologies S29GL01GT13TFNV10
- Part No.:
- S29GL01GT13TFNV10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL01GT13TFNV10.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:4,712
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Product details
Overview
S29GL01GT13TFNV10 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sectors, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for network routers requiring fast XIP execution and reliable non-volatile firmware retention.
For engineers reviewing the S29GL01GT13TFNV10 datasheet, S29GL01GT13TFNV10 pinout, S29GL01GT13TFNV10 application, or S29GL01GT13TFNV10 equivalent, key selection criteria include parallel ×16 bus interface compatibility, sector erase granularity, embedded algorithm controller behavior, OTP array security configuration, and industrial-grade thermal performance under sustained read/write cycles.
Technical Context
This device implements an asynchronous parallel interface with CE#, OE#, and WE# control signals, supporting both byte (×8) and word (×16) data modes via A0 address line interpretation. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume capability and status reporting via Status Register, Data Polling, or RY/BY# pin.
The internal architecture includes separate 2048-byte one-time programmable (OTP) array with four lockable sectors (SSR0–SSR3), where SSR0 is factory-locked and SSR3 supports password-based read protection. Common Flash Interface (CFI) parameter tables enable host software identification and configuration without hard-coded timing assumptions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - supports full boot image storage for mid-tier embedded Linux systems |
| Interface type | Parallel ×16 (also ×8 capable) - enables direct connection to ARM Cortex-A/M series memory buses without glue logic |
| Access time | 100 ns random / 15 ns page - meets real-time boot latency requirements for industrial PLCs |
| Erase block size | Uniform 128 KB sectors - simplifies firmware update partitioning and wear leveling in bootloader design |
| Write buffer | 512-byte buffer - reduces effective programming time by up to 4× vs. single-word writes |
| Data retention | 20 years - ensures long-term reliability in unattended infrastructure equipment |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over product lifetime |
| Operating temp | –40°C to +85°C (Industrial grade) - validated for deployment in outdoor telecom cabinets |
Pinout & Package
Package: 64-ball LAE fortified BGA (9 mm × 9 mm), RoHS-compliant, lead-free, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 1 Gb linear addressing (A0 selects ×8/×16 mode) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte-wide access when A0 = low |
| CE# | Chip enable | Active-low chip select; controls device power state and command latching |
| OE# | Output enable | Active-low read strobe; gates output drivers during read cycles |
| WE# | Write enable | Active-low write strobe; initiates program/erase command sequences |
| RY/BY# | Ready/Busy | Open-drain status indicator; low during embedded operations, high when idle or ready |
| VCC | Core supply | 2.7–3.6 V main power; powers logic, memory array, and EAC |
| VIO | I/O supply | 1.65 V to VCC; decouples I/O voltage from core for mixed-voltage system interfacing |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC - enables seamless integration with 1.8 V or 3.3 V host processors without level shifters |
| Hardware ECC | On-die single-bit error correction - eliminates need for external ECC logic in safety-critical boot paths |
| OTP array with SSR locking | 2048-byte OTP with four independently lockable sectors - allows secure storage of keys, calibration data, and device identity |
| Suspend/resume capability | Interruptible program/erase - permits high-priority read access during background writes, essential for real-time OS environments |
| Common Flash Interface (CFI) | Standardized parameter table - enables generic flash driver support across multiple vendors and densities |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers deployed in factory automation lines. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with ≤100 ns latency to meet deterministic scan cycle deadlines. Use Value: Uniform 128-KB sectors simplify firmware version management; 20-year data retention ensures operational continuity over extended maintenance intervals. | Use Scenario: Holding certified boot code and sensor calibration data in automotive advanced driver-assistance systems (ADAS) ECUs. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified flash memory serving as primary boot source with hardware ECC for ASIL-B compliance. Use Value: OTP array with password-protected SSR3 secures cryptographic keys; industrial-plus temperature rating (–40°C to +105°C) matches under-hood thermal profiles. |
| Network Router Boot Image | Medical Imaging System Configuration |
Use Scenario: Hosting compressed Linux kernel and initramfs in enterprise-grade Layer 3 switches requiring rapid cold-start recovery. IC Role / Device Role / Timing Role: Parallel ×16 interface delivers >80 MB/s effective read bandwidth for fast decompression and execution from flash. Use Value: 512-byte write buffer accelerates field firmware upgrades; CFI support enables vendor-agnostic bootloader portability. | Use Scenario: Retaining device-specific calibration coefficients, DICOM metadata templates, and regulatory compliance flags in portable ultrasound units. IC Role / Device Role / Timing Role: Secure non-volatile storage with factory-locked SSR0 and user-lockable SSR1–SSR3 for tamper-resistant configuration persistence. Use Value: 100,000 erase cycles accommodate frequent recalibration; extended temperature range (–40°C to +125°C) supports sterilization and battery-operated operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP13TFIV10 | Same density and package but uses older 65-nm process; 110 ns max tACC vs. 100 ns | Lacks Versatile I/O (VIO fixed to VCC); no SSR3 password protection | Select when cost sensitivity outweighs performance and security requirements |
| MX29GL128FPTI-90G | 128 MB ×16, 90 ns tACC, no hardware ECC, no OTP array, JEDEC-standard CFI only | No sector lock or SSR functionality; limited to basic firmware storage without security features | Select for legacy designs requiring pin-for-pin compatibility with older Macronix platforms |
Compared with S29GL01GP13TFIV10 and MX29GL128FPTI-90G, the S29GL01GT13TFNV10 provides superior timing, integrated ECC, and configurable OTP security-making it optimal for new designs demanding robustness, longevity, and firmware integrity in industrial and automotive contexts.
Availability
S29GL01GT13TFNV10 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and network router boot image applications requiring stable component supply across multi-year production cycles.
Supply support for S29GL01GT13TFNV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions for industrial, automotive, and communications markets.
The GL-T family was designed specifically for high-reliability embedded boot code storage, combining XIP performance with data storage density and advanced security features like OTP locking and hardware ECC.
FAQ
Does S29GL01GT13TFNV10 support both ×8 and ×16 data bus widths?
Yes. The device automatically detects bus width via A0 address line: when A0 is low, it operates in ×8 mode (DQ0–DQ7 active); when A0 is high, it operates in ×16 mode (DQ0–DQ15 active). This dual-mode capability eliminates need for external bus-width configuration logic and supports flexible host processor integration.
What is the function of the SSR0–SSR3 regions in the OTP array?
SSR0–SSR3 are four 512-byte lockable sectors within the 2048-byte OTP array. SSR0 is permanently locked at factory; SSR1 and SSR2 support volatile or non-volatile locking; SSR3 supports password-based read protection. These regions store immutable calibration data, cryptographic keys, or device identifiers with configurable access control.
How does the Ready/Busy# (RY/BY#) pin behave during embedded operations?
RY/BY# is an open-drain output that goes low during any embedded operation (program, erase, or suspend) and returns high when the operation completes or is suspended. It provides hardware-level status feedback independent of Status Register polling, enabling efficient interrupt-driven host firmware control without continuous register reads.
Is the 512-byte write buffer usable across sector boundaries?
No. The 512-byte write buffer must be programmed within a single 128-KB sector. Buffer programming is not allowed to span sector boundaries, and attempting to do so results in failed programming. This constraint ensures atomicity and simplifies wear-leveling implementation in host firmware.
S29GL01GT13TFNV10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 130 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL01GT13TFNV10 FAQ
1.How can I place an order for S29GL01GT13TFNV10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT13TFNV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT13TFNV10 reliable?
The price and inventory of S29GL01GT13TFNV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT13TFNV10 is usually 5 days.
3.What payment methods are accepted for S29GL01GT13TFNV10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT13TFNV10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT13TFNV10?
S29GL01GT13TFNV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT13TFNV10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT13TFNV10?
For technical support, including S29GL01GT13TFNV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT13TFNV10 requirements.
6.How does Aetrix verify that S29GL01GT13TFNV10 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT13TFNV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT13TFNV10 meets industry standards.
7.What is the process for return or replacement of S29GL01GT13TFNV10?
All S29GL01GT13TFNV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT13TFNV10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT13TFNV10 part is unused and in its original packaging.
Return procedure for S29GL01GT13TFNV10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GT13TFNV10 Tags
-
M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
Microchip Technology
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
Microchip Technology
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AT24C04C-SSHM-T
Microchip Technology
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24LC01BT-I/SN
Microchip Technology
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24AA02UIDT-I/OT
Microchip Technology
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AT24C08C-STUM-T
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