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Infineon Technologies S29GL01GT13TFNV20
- Part No.:
- S29GL01GT13TFNV20
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL01GT13TFNV20.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:4,268
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Product details
Overview
S29GL01GT13TFNV20 from Infineon Technologies is a 1 Gb (128 MB) parallel NOR flash memory IC with MIRRORBIT™ architecture, designed for embedded code storage and XIP execution in industrial and automotive systems. It operates from 2.7 V to 3.6 V, delivers 100 ns random access time and 15 ns page access time, features a 512-byte write buffer, internal single-bit ECC, and uniform 128-KB sector erase.
For engineers reviewing the S29GL01GT13TFNV20 datasheet, S29GL01GT13TFNV20 pinout, S29GL01GT13TFNV20 application, or S29GL01GT13TFNV20 equivalent, key selection criteria include parallel ×16 bus interface, industrial-plus temperature grade (–40°C to +105°C), TSOP-56 packaging, sector protection granularity, and CFI-compliant command set compatibility.
Technical Context
This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both 8-bit and 16-bit data bus configurations. Its embedded algorithm controller (EAC) manages program, erase, and suspend/resume operations autonomously, while hardware-based ECC corrects single-bit errors during read cycles without software intervention.
The GL-T family uses 45-nm MIRRORBIT™ process technology to achieve high density and low power consumption. It integrates versatile I/O (VIO = 1.65 V to VCC), enabling interoperability with mixed-voltage host systems, and includes a Common Flash Interface (CFI) parameter table for automatic configuration detection by boot loaders and firmware.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - supports full firmware images and large boot code in space-constrained embedded designs |
| Interface type | Asynchronous parallel ×16 - enables direct CPU memory-mapped access without protocol translation |
| Random access time | 100 ns at –40°C to +85°C - meets real-time boot latency requirements for industrial controllers |
| Page access time | 15 ns - accelerates sequential instruction fetch during XIP operation |
| Write buffer size | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| ECC capability | Internal hardware single-bit correction - ensures data integrity without host CPU overhead |
| Endurance | 100,000 program/erase cycles - supports field-updatable firmware in long-lifecycle deployments |
| Data retention | 20 years - guarantees non-volatile storage integrity across product lifetime under rated conditions |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 20.0 mm × 10.16 mm, standard JEDEC MO-142AB footprint with 0.5 mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 1 Gb linear addressing (byte/word aligned) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports ×8 or ×16 mode via BYTE# control |
| CE# | Chip enable | Active-low chip select; controls device participation in bus transactions |
| OE# | Output enable | Active-low signal enabling output drivers during read cycles only |
| WE# | Write enable | Active-low strobe initiating write, program, or erase commands |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling ongoing embedded operations (low = busy) |
| VCC | Core supply | 2.7–3.6 V main power for logic and memory array |
| VIO | I/O supply | 1.65–VCC voltage for interface level-shifting and mixed-voltage compatibility |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O (VIO) | Independent 1.65 V to VCC I/O supply allows seamless integration with 1.8 V, 2.5 V, or 3.3 V host processors |
| 512-byte programming buffer | Enables single-command multi-word programming, reducing host CPU intervention and improving firmware update throughput |
| Hardware ECC | On-the-fly single-bit error correction eliminates need for external error-handling logic or software overhead |
| Uniform 128-KB sectors | Consistent sector sizing simplifies partitioning for bootloader, OS, and application firmware in secure boot architectures |
| Advanced sector protection (ASP) | Volatile and non-volatile lock modes per sector prevent accidental writes during field updates or debug sessions |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing firmware and configuration data in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Non-volatile code storage with XIP capability for deterministic boot and runtime execution. Use Value: 100 ns random access and 20-year data retention ensure reliable operation over 15+ year equipment lifecycles. | Use Scenario: Hosting boot code and safety-critical calibration data for radar and camera modules in ADAS ECUs. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 (–40°C to +105°C) parallel flash for secure, fast-boot memory subsystem. Use Value: Hardware ECC and sector-level ASP meet ISO 26262 ASIL-B functional safety requirements for memory integrity. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
Use Scenario: Storing diagnostic firmware and calibration tables in MRI and CT scanner control units requiring regulatory compliance. IC Role / Device Role / Timing Role: High-reliability, long-retention flash for certified medical device boot and recovery partitions. Use Value: 100,000 erase cycles support frequent field calibration updates without memory wear-out concerns. | Use Scenario: Holding FPGA bitstreams and system configuration parameters in 5G baseband units deployed in outdoor cabinets. IC Role / Device Role / Timing Role: Industrial-grade parallel flash interfacing directly with ARM-based baseband processors. Use Value: Versatile I/O (VIO) enables direct connection to 1.8 V FPGA I/O banks without level shifters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT12TFIV20 | Same density and core specs, but rated for industrial grade (–40°C to +85°C) instead of industrial-plus (–40°C to +105°C) | Lacks extended temperature margin required for under-hood automotive or high-ambient telecom deployments | Select when thermal budget permits lower max operating temperature and cost optimization is prioritized |
| S29GL01GT13TFIV20 | Identical electrical and timing specs, but packaged in 64-ball LAE fortified BGA (9 mm × 9 mm) instead of TSOP-56 | Requires PCB redesign for BGA layout and reflow profile; offers smaller footprint and better thermal performance | Select when board space is constrained and BGA assembly capability is available |
Compared with S29GL01GT13TFNV20, the TSOP-56 variant offers plug-compatible replacement in legacy industrial designs, while the BGA alternative trades ease of assembly for miniaturization, and the industrial-grade version sacrifices thermal margin for cost reduction.
Availability
S29GL01GT13TFNV20 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S29GL01GT13TFNV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for industrial, automotive, and IoT applications.
The GL-T family targets high-reliability embedded systems needing fast, dense, and robust parallel NOR flash for XIP-capable boot and firmware storage in harsh thermal environments.
FAQ
Is S29GL01GT13TFNV20 pin-compatible with earlier S29GL01GP or S29GL01GS series devices?
No. S29GL01GT13TFNV20 belongs to the GL-T generation with updated 45-nm MIRRORBIT™ architecture, different command set timing, and revised CFI parameter structure. It is not backward pin- or software-compatible with GP/GS series, requiring firmware and hardware validation for migration.
Does this device support synchronous burst reads or DDR interface modes?
No. S29GL01GT13TFNV20 implements only asynchronous parallel operation with no clock input. It does not support synchronous burst, DDR, or QSPI interfaces. All read and write operations are controlled solely by CE#, OE#, and WE# timing.
What is the function of the SSR (One-Time Programmable) array in this flash device?
The 2048-byte SSR array contains four lockable regions (SSR0–SSR3) used for storing immutable security keys, calibration data, or device-specific identifiers. SSR0 is factory-locked; SSR3 supports password-protected read access, enabling secure provisioning in trusted execution environments.
Can the S29GL01GT13TFNV20 be operated with VIO = 1.8 V while VCC = 3.3 V?
Yes. The versatile I/O feature explicitly supports independent VIO from 1.65 V to VCC. Operating with VIO = 1.8 V and VCC = 3.3 V is fully compliant and enables direct interfacing with 1.8 V logic families without external level shifters.
S29GL01GT13TFNV20 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 130 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL01GT13TFNV20 FAQ
1.How can I place an order for S29GL01GT13TFNV20 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT13TFNV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT13TFNV20 reliable?
The price and inventory of S29GL01GT13TFNV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT13TFNV20 is usually 5 days.
3.What payment methods are accepted for S29GL01GT13TFNV20?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT13TFNV20 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT13TFNV20?
S29GL01GT13TFNV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT13TFNV20 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT13TFNV20?
For technical support, including S29GL01GT13TFNV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT13TFNV20 requirements.
6.How does Aetrix verify that S29GL01GT13TFNV20 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT13TFNV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT13TFNV20 meets industry standards.
7.What is the process for return or replacement of S29GL01GT13TFNV20?
All S29GL01GT13TFNV20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT13TFNV20, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT13TFNV20 part is unused and in its original packaging.
Return procedure for S29GL01GT13TFNV20:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GT13TFNV20 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
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