Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies S29GL032N11FFIS40

Part No.:
S29GL032N11FFIS40
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
64-LBGA
Datasheet:
AetrixS29GL032N11FFIS40.pdf
Description:
IC FLASH 32MBIT PARALLEL 64FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,015

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

S29GL032N11FFIS40 from Infineon Technologies (formerly Cypress) is a 32-Mbit (4,194,304-byte), 16-bit-wide single-supply MirrorBit Flash memory IC with uniform sector architecture (64 × 64 KB sectors), 90 ns access time, and 100,000 erase cycles per sector - deployed in industrial control firmware storage and boot code retention applications.

For engineers reviewing the S29GL032N11FFIS40 datasheet, S29GL032N11FFIS40 pinout, S29GL032N11FFIS40 application, or S29GL032N11FFIS40 equivalent, key selection criteria include VIO-supported VersatileI/O™ operation (1.65–3.6 V), CFI compliance for host auto-configuration, Secured Silicon Sector with factory-programmed 16-byte ESN, and hardware write protection via WP#/ACC pin.

Technical Context

This device implements a JEDEC-standard command-set-compatible Flash memory core using 110 nm MirrorBit process technology, supporting both byte (via BYTE#) and word-level access. It features dual status reporting via DQ7 Data# Polling and DQ6 Toggle Bit I, plus RY/BY# hardware signaling for program/erase completion detection.

The architecture includes dedicated erase voltage and programming voltage generators, on-chip timers, and a state controller that latches addresses/data during internal operations. Sector erase granularity enables selective reprogramming without disturbing adjacent firmware regions, while persistent and password-based sector protection mechanisms enforce secure boot partitioning.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 32 Mbit (4,194,304 bytes), organized as 2,097,152 × 16-bit words - supports full firmware image storage for mid-complexity microcontrollers.
Access Time 90 ns at VCC = 2.7–3.6 V and VIO = 2.7–3.6 V - enables direct interface with legacy 80 MHz bus systems without wait states.
Erase Endurance 100,000 cycles per sector - ensures field-upgradable firmware partitions retain reliability over 10+ years of maintenance cycles.
Data Retention 20 years at 125 °C - validated for automotive under-hood and industrial high-temperature deployment.
Supply Voltage Single 3.0 V supply (VCC = 2.7–3.6 V); VIO independently configurable 1.65–3.6 V - decouples I/O logic level from core voltage for mixed-signal SoC interfacing.
Page Read Buffer 8-word (16-byte) page read buffer with 25 ns page access - accelerates sequential instruction fetch in boot ROM mode.
Write Buffer 16-word (32-byte) write buffer - reduces multi-word programming overhead by batching writes before internal commit.

Pinout & Package

Package: 48-ball fine-pitch BGA (VBK048, 8.15 × 6.15 mm, 0.8 mm pitch). Ball grid layout conforms to JEDEC MO-245AC standard.

Pin/Terminal Circuit Role Design Meaning
A0–A20 Address Inputs 21-bit address bus supporting full 32 Mbit addressing; A-1 used as DQ15 multiplex in x16 mode.
DQ0–DQ15 Data/Address Multiplexed I/O 16-bit bidirectional data bus; DQ15 doubles as A-1 in x16 configuration - enables compact address decoding.
CE#, OE#, WE# Chip/Output/Write Enable Controls Independent active-low enables allow interleaved read/write arbitration and partial memory mapping in multi-device systems.
WP#/ACC Write Protect / Accelerated Program Input Hardware lock for first/last sector; when driven high with 5.5 V, enables accelerated programming for production throughput.
RY/BY# Ready/Busy Output Open-drain status signal indicating active program/erase - eliminates need for software polling in real-time systems.
RESET# Hardware Reset Input Asynchronous reset terminates ongoing operations and restores device to known state - critical for safe boot recovery.
BYTE# Bus Width Select Configures x16 or x8 data interface; enables compatibility with 8-bit microcontrollers without external demux logic.
VIO I/O Supply Reference Defines input threshold and output drive level independently of VCC - supports mixed-voltage system integration.

Key Features

Feature Design Value
Secured Silicon Sector 128-word (256-byte) factory-locked region with 16-byte electronic serial number - provides immutable device identity for secure boot chain binding.
Advanced Sector Protection Persistent and Password Sector Protection modes - enforce read/write lockdown of boot sectors independent of power cycle or reset events.
Program/Erase Suspend Pause active programming or erasing to service higher-priority reads from other sectors - enables real-time firmware updates without system stall.
CFI Compliance JEDEC JESD68-defined Common Flash Interface - allows host BIOS or bootloader to auto-detect geometry, timing, and command set without hard-coded assumptions.
VersatileI/O™ Control VIO pin sets all input thresholds and output levels - simplifies interface design across 1.8 V, 2.5 V, and 3.3 V host logic families.

Applications

Industrial PLC Firmware Storage Automotive Instrument Cluster Boot Memory

Use Scenario: Nonvolatile storage of ladder logic programs and configuration parameters in programmable logic controllers operating continuously in harsh environments.

IC Role / Device Role / Timing Role: Primary boot and runtime firmware repository with sector-level update capability and hardware write protection against EMI-induced corruption.

Use Value: 20-year data retention at 125 °C and 100,000 erase cycles ensure firmware integrity across extended product lifecycles without field replacement.

Use Scenario: Storing calibrated display drivers and safety-critical boot code in digital instrument clusters subject to automotive temperature cycling (-40 °C to 125 °C).

IC Role / Device Role / Timing Role: Secure boot ROM with Secured Silicon Sector holding cryptographic keys and immutable bootloader signature.

Use Value: Factory-programmed 16-byte ESN enables unique device authentication; persistent sector protection prevents unauthorized modification of safety-critical code.

Medical Diagnostic Equipment Configuration Telecom Base Station FPGA Bitstream Storage

Use Scenario: Retaining calibration coefficients, user preferences, and regulatory-compliant audit logs in portable ultrasound and imaging devices requiring FDA 21 CFR Part 11 compliance.

IC Role / Device Role / Timing Role: Trusted configuration store with password-protected sector access - only authorized service tools can modify calibration data.

Use Value: Password Sector Protection enforces role-based access control; CFI compliance simplifies firmware validation across multiple device generations.

Use Scenario: Storing FPGA configuration bitstreams for remote radio heads and baseband processing units in 4G/5G infrastructure equipment.

IC Role / Device Role / Timing Role: High-reliability configuration memory with fast 90 ns random access and 25 ns page read - minimizes FPGA startup latency after power-on or reset.

Use Value: 16-word write buffer accelerates bitstream reload during field upgrades; RY/BY# signal enables deterministic timing for boot sequence orchestration.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
S29GL032N10TFI010 Same die, 48-pin TSOP package (vs. 48-ball BGA); 110 ns access time (vs. 90 ns); no VIO pin - fixed 3.0 V I/O logic. Limited to PCBs with TSOP footprint and lower-speed buses; lacks VIO flexibility for mixed-voltage designs. Select when board layout constraints prohibit BGA or when cost-sensitive consumer applications tolerate slower access.
MX29GL320EBTI-90G 32 Mbit, 90 ns, 48-pin TSOP; Macronix part with identical JEDEC command set but no Secured Silicon Sector or Password Protection. Cannot support secure boot chains requiring factory-locked identity or password-gated sector writes. Choose for non-security-critical applications where CFI compatibility and basic sector erase suffice, and TSOP mounting is preferred.

Compared with S29GL032N11FFIS40, the TSOP alternatives trade package flexibility and security features for simpler assembly or lower unit cost - whereas the Infineon part delivers BGA space savings, VIO-driven interoperability, and hardware-enforced firmware integrity essential for certified industrial and automotive systems.

Availability

S29GL032N11FFIS40 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot memory, and medical diagnostic equipment configuration requiring stable component supply and long-term lifecycle support.

Supply support for S29GL032N11FFIS40 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and now owns and supports the MirrorBit Flash portfolio, delivering high-reliability nonvolatile memory for mission-critical applications.

The S29GL-N series was designed specifically for industrial, automotive, and medical systems requiring guaranteed data retention, sector-level firmware update capability, and hardware-enforced security - not general-purpose code storage.

FAQ

What is the function of the VIO pin on S29GL032N11FFIS40?

The VIO pin defines input voltage thresholds and output drive levels for all address, control, and data signals - enabling operation with 1.65–3.6 V I/O logic independently of the 2.7–3.6 V VCC supply. This allows seamless interfacing with 1.8 V, 2.5 V, or 3.3 V host processors without level shifters.

Does S29GL032N11FFIS40 support byte-level writes?

No - it supports only word-level (16-bit) writes in x16 mode or byte-level access only via BYTE#-enabled x8 mode, where DQ0–DQ7 carry data and DQ8–DQ15 are unused. True byte programming is not supported; minimum write granularity remains one word (2 bytes) in x16 configuration.

How is the Secured Silicon Sector protected after factory programming?

Once programmed and locked, the 128-word Secured Silicon Sector becomes permanently read-only - no command sequence, voltage condition, or reset event can unlock or rewrite its contents. The 16-byte electronic serial number is factory-laser-fused and accessible only via defined command sequences, ensuring tamper-resistant device identification.

Can S29GL032N11FFIS40 be used in place of older S29GL032P devices?

No - the S29GL032N uses MirrorBit technology and a different command set than the floating-gate-based S29GL032P. Although density and pinout may appear similar, differences in erase algorithms, status reporting (DQ6/DQ7 behavior), and CFI structure prevent drop-in replacement without firmware revision and validation.

S29GL032N11FFIS40 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-N
Package/Case:
64-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
32Mbit
Memory Organization:
4M x 8, 2M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
110ns
Access Time:
110 ns
Voltage - Supply:
1.65V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
64-FBGA (13x11)

S29GL032N11FFIS40 FAQ

1.How can I place an order for S29GL032N11FFIS40 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL032N11FFIS40 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL032N11FFIS40 reliable?

The price and inventory of S29GL032N11FFIS40 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL032N11FFIS40 is usually 5 days.

3.What payment methods are accepted for S29GL032N11FFIS40?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL032N11FFIS40 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL032N11FFIS40?

S29GL032N11FFIS40 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL032N11FFIS40 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL032N11FFIS40?

For technical support, including S29GL032N11FFIS40 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL032N11FFIS40 requirements.

6.How does Aetrix verify that S29GL032N11FFIS40 is sourced from the original manufacturer or authorized distributors?

All S29GL032N11FFIS40 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL032N11FFIS40 meets industry standards.

7.What is the process for return or replacement of S29GL032N11FFIS40?

All S29GL032N11FFIS40 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL032N11FFIS40, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL032N11FFIS40 part is unused and in its original packaging.

Return procedure for S29GL032N11FFIS40:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S29GL032N11FFIS40 Tags

  • S29GL032N11FFIS40
  • S29GL032N11FFIS40 PDF
  • S29GL032N11FFIS40 Datasheet
  • S29GL032N11FFIS40 Specifications
  • S29GL032N11FFIS40 Images
  • Infineon Technologies
  • Infineon Technologies S29GL032N11FFIS40
  • Buy S29GL032N11FFIS40
  • S29GL032N11FFIS40 Price
  • S29GL032N11FFIS40 Distributor
  • S29GL032N11FFIS40 Supplier
  • S29GL032N11FFIS40 Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER