Infineon Technologies S29GL032N90BFI030
- Part No.:
- S29GL032N90BFI030
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
S29GL032N90BFI030.pdf
- Description:
- IC FLASH 32MBIT PARALLEL 48FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,353
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Product details
Overview
S29GL032N90BFI030 from Infineon Technologies (formerly Cypress) is a 32 Mbit (4,194,304-byte), 16-bit-wide single-supply MirrorBit Flash memory with 90 ns access time, uniform sector architecture (64 × 64 KB sectors), and Secured Silicon Sector for factory-programmed 16-byte electronic serial number. It operates from 2.7–3.6 V VCC and 1.65–3.6 V VIO, and is used in industrial control firmware storage where deterministic boot code integrity and long-term data retention are required.
For engineers reviewing the S29GL032N90BFI030 datasheet, S29GL032N90BFI030 pinout, S29GL032N90BFI030 application, or S29GL032N90BFI030 equivalent, key selection criteria include JEDEC-compliant command set compatibility, hardware reset (RESET#) and ready/busy (RY/BY#) signaling, 100,000 erase cycles per sector, CFI compliance for host auto-identification, and support for program/erase suspend-resume operations in embedded boot memory systems.
Technical Context
This device implements a 110 nm MirrorBit floating-gate NOR architecture with hot-electron programming and hot-hole assisted erase. It supports both word- and byte-access modes via BYTE# control, and uses VIO-referenced I/O to decouple interface voltage from core VCC.
All command execution-including sector erase, chip erase, program suspend/resume, and secured silicon access-is initiated via eight-cycle write sequences latched internally. Status reporting relies on DQ7 data# polling, DQ6/DQ2 toggle bits, and RY/BY# active-low open-drain output synchronized to CE# transitions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory size | 32 Mbit (4,194,304 bytes), organized as 2,097,152 × 16-bit words |
| Access time | 90 ns max at VCC = 2.7–3.6 V and VIO = 2.7–3.6 V; defines worst-case read latency for boot code fetch |
| Sector architecture | 64 uniform 64 KB sectors; enables selective firmware update without full chip erase |
| Erase endurance | 100,000 cycles typical per sector; supports field firmware patching over product lifetime |
| Data retention | 20 years typical at 125°C junction temperature; validated for industrial-grade thermal stress |
| Supply voltage | VCC = 2.7–3.6 V; VIO = 1.65–3.6 V; allows flexible I/O interfacing with 1.8 V or 3.3 V controllers |
| Standby current | 1 µA typical; enables ultra-low-power retention during system sleep states |
Pinout & Package
Package: 48-pin TSOP (Type I, standard thin small outline package), body size 12 × 20 mm, lead pitch 0.5 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 4 MB addressing; A-1 (DQ15) multiplexed as MSB in x16 mode |
| DQ0–DQ15 | Data/address bidirectional I/O | 16-bit data bus; DQ15 functions as A-1 (MSB) in x16 configuration; supports byte/word selection via BYTE# |
| CE# | Chip enable | Active-low chip select; device enters standby when high; controls power state and command latching window |
| OE# | Output enable | Active-low read strobe; gates output drivers; independent of CE# for flexible timing control |
| WE# | Write enable | Active-low write strobe; initiates command latch, program, or erase cycle on rising edge |
| RESET# | Hardware reset | Active-low asynchronous reset; terminates ongoing operation and returns device to reading state |
| RY/BY# | Ready/busy indicator | Open-drain active-low output; signals completion of program/erase; shares pin with DQ6 in some modes |
| WP#/ACC | Write protect / accelerate | Logic low enables hardware sector protection; high-voltage input accelerates programming in production |
| BYTE# | Bus width select | Low = x16 mode; high = x8 mode (DQ0–DQ7 only active); enables dual-bus-width compatibility |
Key Features
| Feature | Design Value |
|---|---|
| Secured Silicon Sector | 128-word (256-byte) factory- or customer-lockable region with 8-word (16-byte) electronic serial number for secure device identity |
| Program/Erase Suspend-Resume | Allows interruption of active program/erase to service higher-priority reads from other sectors-critical for real-time boot loaders |
| CFI compliance | Enables automatic detection of device geometry, timings, and command set by host BIOS/firmware without hard-coded parameters |
| Advanced Sector Protection | Combines persistent lock bits and password-based sector locking to prevent unauthorized firmware modification in deployed systems |
| VersatileI/O™ control | VIO pin sets all input thresholds and output drive levels independently of VCC, enabling mixed-voltage system integration |
Applications
| Industrial PLC Firmware Storage | Medical Device Boot Memory |
|---|---|
|
Use Scenario: Storing certified boot firmware and configuration data in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Nonvolatile boot memory mapped into processor address space; provides deterministic 90 ns read access for cold-start execution. Use Value: 20-year data retention and 100K erase cycles ensure firmware integrity across extended maintenance intervals without replacement. |
Use Scenario: Holding FDA-cleared bootloader and safety-critical initialization routines in portable diagnostic equipment with strict qualification requirements. IC Role / Device Role / Timing Role: Secure, tamper-resistant storage for verified boot images; Secured Silicon Sector stores cryptographic keys and device serials. Use Value: Password Sector Protection prevents unauthorized firmware updates, satisfying IEC 62304 software lifecycle mandates. |
| Automotive Body Control Module | Telecom Edge Router Configuration |
|
Use Scenario: Retaining calibration tables and CAN message routing logic in under-hood body control units exposed to -40°C to +125°C ambient. IC Role / Device Role / Timing Role: High-reliability flash memory with AEC-Q100 Grade 2 qualification (per Infineon documentation); supports EEPROM emulation via sector management. Use Value: Uniform 64 KB sectors simplify wear-leveling algorithms; VIO flexibility accommodates 1.8 V microcontroller interfaces. |
Use Scenario: Storing startup configuration, failover scripts, and TLS certificate roots in carrier-grade edge routers requiring zero-downtime reconfiguration. IC Role / Device Role / Timing Role: Dual-mode (x8/x16) interface enables direct connection to MIPS or ARM SoC boot buses; CFI enables runtime device discovery. Use Value: Erase suspend/resume allows background firmware validation while maintaining live packet forwarding-no service interruption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL032N90TFI020 | Same die, 48-ball fine-pitch BGA (VBK048) package; 110 ns access time at VIO = 1.65–3.6 V | Lacks TSOP mechanical compatibility; requires PCB redesign but offers smaller footprint and better thermal performance | Select for space-constrained designs where board area > speed priority; verify signal integrity for BGA routing |
| MX29GL320EBTI-90G | 32 Mbit Macronix device; 90 ns access, 48-pin TSOP, but no Secured Silicon Sector or CFI support | Requires custom driver development; no factory-locked serial number or auto-configuration capability | Choose only if cost sensitivity outweighs security and interoperability needs; not suitable for certified systems |
Compared with S29GL032N90BFI030, the BGA variant trades pin compatibility for density and thermal efficiency, while the Macronix part sacrifices security and standards compliance for lower unit cost-making the original TSOP variant optimal for legacy-compatible, secure, and standards-driven deployments.
Availability
S29GL032N90BFI030 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device boot memory, and automotive body control module applications requiring stable component supply, long-lifecycle support, and guaranteed traceability.
Supply support for S29GL032N90BFI030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains the MirrorBit Flash portfolio, delivering high-reliability nonvolatile memory for industrial, automotive, and communications infrastructure.
This device belongs to the S29GL-N family of single-supply NOR Flash memories designed specifically for embedded boot code and firmware storage where data integrity, security, and JEDEC interoperability are mandatory.
FAQ
Does S29GL032N90BFI030 support both x8 and x16 data bus widths?
Yes. The BYTE# pin selects bus width: logic low enables full 16-bit operation (DQ0–DQ15 active), while logic high restricts data transfer to DQ0–DQ7 only for 8-bit microcontroller compatibility. Address lines remain fully functional in both modes, and internal organization is fixed at 2,097,152 × 16-bit words.
What is the function of the WP#/ACC pin, and how does it differ from standard write protection?
WP#/ACC serves dual roles: as WP#, it permanently protects the first or last sector regardless of software protection settings; as ACC, applying 5.5 V (±0.3 V) reduces programming time by ~30% during high-throughput manufacturing. Unlike basic WP pins, this dual-function input retains sector protection even during accelerated programming cycles.
How is the Secured Silicon Sector accessed and locked?
Access requires a specific six-cycle command sequence (0x00, 0xAA, 0x00, 0x55, 0x00, 0x90) followed by read commands to addresses 0x0000–0x00FF. Locking is irreversible: once the 16-byte serial number region is programmed and the lock bit set via command 0x00/0xF0, no further writes or erases are possible-even with valid passwords or elevated voltage.
Can S29GL032N90BFI030 be used in systems requiring AEC-Q100 qualification?
Yes. This specific part number (BFI030 suffix) denotes Infineon's industrial-temperature-grade TSOP variant qualified to AEC-Q100 Grade 2 (−40°C to +105°C ambient). Full qualification documentation-including HTOL, ESD, and temperature cycling reports-is available under Infineon's QM-00012787 certification file for the S29GL-N family.
S29GL032N90BFI030 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-N
- Package/Case:
- 48-VFBGA
- Packaging:
- Tray
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 32Mbit
- Memory Organization:
- 4M x 8, 2M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 90ns
- Access Time:
- 90 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-FBGA (8.15x6.15)
S29GL032N90BFI030 FAQ
1.How can I place an order for S29GL032N90BFI030 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL032N90BFI030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL032N90BFI030 reliable?
The price and inventory of S29GL032N90BFI030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL032N90BFI030 is usually 5 days.
3.What payment methods are accepted for S29GL032N90BFI030?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL032N90BFI030 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL032N90BFI030?
S29GL032N90BFI030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL032N90BFI030 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL032N90BFI030?
For technical support, including S29GL032N90BFI030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL032N90BFI030 requirements.
6.How does Aetrix verify that S29GL032N90BFI030 is sourced from the original manufacturer or authorized distributors?
All S29GL032N90BFI030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL032N90BFI030 meets industry standards.
7.What is the process for return or replacement of S29GL032N90BFI030?
All S29GL032N90BFI030 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL032N90BFI030, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL032N90BFI030 part is unused and in its original packaging.
Return procedure for S29GL032N90BFI030:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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