Infineon Technologies S29GL064N11FFIS33
- Part No.:
- S29GL064N11FFIS33
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL064N11FFIS33.pdf
- Description:
- IC FLASH 64MBIT PARALLEL 64FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,826
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Product details
Overview
S29GL064N11FFIS33 from Infineon Technologies (formerly Cypress) is a 64 Mbit, 3.0 V single-power-supply MirrorBit Flash memory organized as 4,194,304 words × 16 bits, featuring 128 uniform 64 KB sectors, 90 ns access time, and Secured Silicon Sector with factory-programmable 128-word Electronic Serial Number. It serves as non-volatile program/data storage in boot code execution, firmware update, and embedded control systems.
For engineers reviewing the S29GL064N11FFIS33 datasheet, S29GL064N11FFIS33 pinout, S29GL064N11FFIS33 application, or S29GL064N11FFIS33 equivalent, key selection criteria include sector architecture (uniform vs. boot), VIO voltage range (1.65–3.6 V), CFI compliance, erase endurance (100,000 cycles/sector), and TSOP-48 package compatibility with JEDEC-standard command sets.
Technical Context
This device implements a 110 nm MirrorBit floating-gate NAND architecture with hot-hole erase and hot-electron programming, supporting both word (16-bit) and byte (8-bit via BYTE#) data bus operation. Its command-set architecture is fully JEDEC JESD21C compliant and includes CFI for host auto-configuration.
Hardware features include dedicated RY/BY# status output, RESET# for operation termination and boot initialization, WP#/ACC for accelerated programming and first/last sector protection, and VIO-referenced I/O enabling mixed-voltage system interfacing. Erase suspend/resume and program suspend/resume allow concurrent background operations across protected sectors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 Mbit (4,194,304 × 16-bit words); enables full boot image + application firmware storage in single device |
| Access Time | 90 ns at VCC = 2.7–3.6 V; meets real-time read latency requirements for microcontroller boot fetch |
| Sector Architecture | 128 uniform 32 Kword (64 KB) sectors; simplifies firmware partitioning and OTA update management |
| Erase Endurance | 100,000 cycles per sector; supports field firmware updates over 10+ year product lifecycle |
| Data Retention | 20 years at 125 °C; validated for automotive under-hood and industrial high-temp environments |
| VIO Range | 1.65–3.6 V; allows direct interface to 1.8 V or 3.3 V logic without level shifters |
| Page Read Buffer | 8-word (16-byte); reduces sequential read overhead in instruction fetch loops |
| Write Buffer Size | 16-word (32-byte); cuts multi-word programming time by >50% vs. single-word writes |
Pinout & Package
Package: 48-pin TSOP (Type 1, standard thin small outline package, 12 × 20 mm body, 0.5 mm pitch). Pinout validated per Cypress document 001-98525 Rev. *B, Figure 1 (S29GL064N Models 03/04).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 4 Mword addressing; A21 selects upper/lower 32 MB half |
| DQ0–DQ15 | Data I/O (16-bit) | Bidirectional data bus; DQ15 also functions as A−1 for byte-mode addressing when BYTE# = LOW |
| CE#, OE#, WE# | Chip, Output, Write Enable controls | Independent gating enables interleaved read/write and low-latency command execution |
| WP#/ACC | Write Protect / Accelerated Program input | Logic LOW protects first/last sector; HIGH with 5.5 V enables faster factory programming |
| RESET# | Hardware reset input | Asynchronous active-low signal that aborts ongoing erase/program and restores ready state |
| RY/BY# | Ready/Busy output | Open-drain status flag indicating active programming/erasing; used for polling-free timing control |
| BYTE# | Bus width select | LOW enables 8-bit mode (DQ0–DQ7 only); HIGH enables full 16-bit data path |
| VIO | I/O voltage reference | Sets input threshold and output swing; decouples I/O logic from core VCC (2.7–3.6 V) |
Key Features
| Feature | Design Value |
|---|---|
| Secured Silicon Sector | 128-word (256-byte) factory-lockable region with unique 8-word ESN; prevents cloning and enables secure device identity |
| Advanced Sector Protection | Persistent and Password-based locking; eliminates need for external EEPROM for configuration security |
| Erase/Program Suspend & Resume | Allows interrupting long erase/program cycles to service higher-priority reads; critical for real-time OS integration |
| CFI Compliance | Standardized query structure enables automatic flash detection and driver configuration in Linux/U-Boot |
| Unlock Bypass Mode | Reduces multi-word programming command overhead from 4 to 2 write cycles; improves production throughput |
Applications
| Industrial PLC Firmware Storage | Automotive Instrument Cluster Boot Memory |
|---|---|
Use Scenario: Storing ladder logic, configuration tables, and safety-critical firmware in programmable logic controllers operating continuously at 85 °C ambient. IC Role / Device Role / Timing Role: Non-volatile boot and runtime code storage with guaranteed 20-year data retention and 100K erase cycles. Use Value: Eliminates need for external backup power or supercapacitors during brown-out events due to single 3.0 V supply operation and hardware reset recovery. | Use Scenario: Holding boot loader, gauge graphics assets, and CAN message routing tables in digital instrument clusters requiring ASIL-B compliance. IC Role / Device Role / Timing Role: Primary boot memory mapped to MCU's XIP address space with 90 ns access enabling sub-100 µs startup latency. Use Value: Secured Silicon Sector stores calibrated display offsets and vehicle VIN, preventing unauthorized tampering via factory-programmed ESN binding. |
| Medical Imaging System Configuration | Network Router Boot Image Storage |
Use Scenario: Retaining calibration coefficients, sensor profiles, and regulatory audit logs in portable ultrasound devices with battery-backed operation. IC Role / Device Role / Timing Role: Parameter storage with password-protected sector access ensuring HIPAA-compliant data integrity. Use Value: Password Sector Protection enforces role-based access-clinical staff can update calibration, but service engineers require separate credentials to modify firmware. | Use Scenario: Hosting primary bootloader and fail-safe recovery image in enterprise-grade routers requiring zero-downtime firmware upgrades. IC Role / Device Role / Timing Role: Dual-image storage using uniform sector layout; one sector holds active image, another holds verified update. Use Value: Erase suspend/resume enables background image validation while maintaining packet forwarding-no service interruption during upgrade. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL064S11FFIV10 | Same density and pinout; uses 90 nm process, lower standby current (500 nA vs. 1 µA), no Secured Silicon Sector | Lacks factory-programmable ESN and persistent lock register; unsuitable for device authentication | Select when lowest power consumption is prioritized over secure identity features |
| MX29GL640EHTI-90G | 64 Mbit, 90 ns, 48-pin TSOP; Macronix implementation of JEDEC-compatible command set; no CFI support | Requires custom driver development; lacks autoselect and sector protection flexibility | Select for cost-sensitive designs where vendor lock-in is acceptable and CFI-based tooling is not required |
Compared with S29GL064S11FFIV10 and MX29GL640EHTI-90G, the S29GL064N11FFIS33 uniquely combines CFI compliance, Secured Silicon Sector, and uniform 128-sector architecture-enabling drop-in driver reuse, secure device onboarding, and simplified firmware partitioning in safety-certified systems.
Availability
S29GL064N11FFIS33 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot memory, and medical imaging system configuration requiring stable component supply and long-term lifecycle support.
Supply support for S29GL064N11FFIS33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and secure memory solutions.
The S29GL-N family was originally developed by Cypress Semiconductor and continues under Infineon's Flash memory portfolio, targeting embedded systems requiring high-reliability, JEDEC-compliant, single-supply NOR Flash with advanced security and suspend/resume capabilities.
FAQ
What is the function of the WP#/ACC pin on S29GL064N11FFIS33?
The WP#/ACC pin serves dual roles: when driven LOW, it permanently protects the first or last sector from accidental erase or program; when driven HIGH with 5.5 V, it activates accelerated programming mode, reducing write time by ~30% during manufacturing. This dual functionality eliminates need for external hardware write-protection switches while enabling high-throughput production programming.
Does S29GL064N11FFIS33 support 8-bit data bus operation?
Yes, it supports 8-bit mode via the BYTE# input. When BYTE# is LOW, only DQ0–DQ7 are active as an 8-bit data bus, and DQ15 functions as A−1 for extended addressing. This mode maintains full command compatibility and is commonly used in legacy 8-bit microcontroller interfaces where pin count reduction is critical.
How does the Secured Silicon Sector differ from standard flash sectors?
The Secured Silicon Sector is a dedicated 128-word (256-byte) region with factory-programmable 8-word Electronic Serial Number and permanent lock capability. Once locked, no further writes or erases are possible-even with unlock commands-making it ideal for storing immutable device identifiers, cryptographic keys, or calibration data that must survive field reprogramming.
Can S29GL064N11FFIS33 be used in systems with mixed 1.8 V and 3.3 V logic?
Yes, its VIO pin accepts 1.65–3.6 V, allowing independent I/O voltage referencing. With VIO = 1.8 V and VCC = 3.3 V, the device presents 1.8 V-compatible input thresholds and output levels while maintaining full internal 3.3 V core operation-enabling direct connection to 1.8 V FPGAs or ASICs without level translators.
S29GL064N11FFIS33 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-N
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8, 4M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 110ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL064N11FFIS33 FAQ
1.How can I place an order for S29GL064N11FFIS33 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL064N11FFIS33 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL064N11FFIS33 reliable?
The price and inventory of S29GL064N11FFIS33 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL064N11FFIS33 is usually 5 days.
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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL064N11FFIS33 transactions.
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4.How is shipping managed for S29GL064N11FFIS33?
S29GL064N11FFIS33 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL064N11FFIS33 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL064N11FFIS33?
For technical support, including S29GL064N11FFIS33 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL064N11FFIS33 requirements.
6.How does Aetrix verify that S29GL064N11FFIS33 is sourced from the original manufacturer or authorized distributors?
All S29GL064N11FFIS33 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL064N11FFIS33 meets industry standards.
7.What is the process for return or replacement of S29GL064N11FFIS33?
All S29GL064N11FFIS33 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL064N11FFIS33, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL064N11FFIS33 part is unused and in its original packaging.
Return procedure for S29GL064N11FFIS33:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL064N11FFIS33 Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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