Infineon Technologies S29GL064N11FFIV13
- Part No.:
- S29GL064N11FFIV13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL064N11FFIV13.pdf
- Description:
- IC FLASH 64MBIT PARALLEL 64FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,382
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL064N11FFIV13 from Infineon Technologies (formerly Cypress) is a 64 Mbit, 3.0 V single-power-supply MirrorBit Flash memory organized as 4,194,304 × 16-bit words, featuring 90 ns access time, 100,000 erase cycles per sector, and 20-year data retention. It supports uniform sector architecture with 128 × 64 KB sectors and operates across VIO = 1.65–3.6 V for flexible I/O voltage control - deployed in industrial control firmware storage and boot code retention applications.
For engineers reviewing the S29GL064N11FFIV13 datasheet, S29GL064N11FFIV13 pinout, S29GL064N11FFIV13 application, or S29GL064N11FFIV13 equivalent, key selection criteria include JEDEC software compatibility, Secured Silicon Sector with factory-programmed 128-word ESN, CFI compliance for host auto-configuration, and hardware-accelerated programming via WP#/ACC input.
Technical Context
This device implements a command-set-compatible, single-supply NOR Flash architecture with hot-electron injection programming and hot-hole assisted sector erase. Its VersatileI/O™ control decouples VIO (1.65–3.6 V) from VCC (2.7–3.6 V), enabling mixed-voltage system interfacing without level shifters.
The S29GL064N11FFIV13 integrates Advanced Sector Protection (Persistent and Password modes), Program/Erase Suspend & Resume, and CFI-compliant identification registers. It uses a 110 nm MirrorBit process and supports both 16-bit and byte-wide (via BYTE#) data bus operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 Mbit (4,194,304 × 16-bit words); enables full boot firmware + parameter storage in one device |
| Access Time | 90 ns at VCC = 2.7–3.6 V; meets real-time boot latency requirements for embedded microcontrollers |
| Erase Endurance | 100,000 cycles per sector; supports field firmware updates over 10+ years in industrial gateways |
| Data Retention | 20 years at 125°C; validated for automotive under-hood and industrial high-temp environments |
| VIO Range | 1.65–3.6 V; allows direct interface to 1.8 V or 3.3 V logic without external translators |
| Page Read Buffer | 8-word (16-byte); reduces sequential read latency in configuration table parsing |
| Write Buffer Size | 16-word (32-byte); cuts multi-word programming time by >40% vs. single-word writes |
Pinout & Package
Package: 48-ball fine-pitch BGA (VBK048, 8.15 × 6.15 mm, 0.8 mm pitch). RoHS-compliant, lead-free, moisture-sensitive level 3 (MSL3).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address Inputs | 22-bit address bus supporting full 4M-word addressing; A-1 used as DQ15 in x16 mode |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; DQ15 doubles as A-1 for x16 addressing |
| CE# | Chip Enable | Active-low chip select; enables low-power standby when deasserted |
| OE# | Output Enable | Controls output buffer; allows shared bus operation with other peripherals |
| WE# | Write Enable | Initiates command latching or data write; synchronized with CE# and OE# for JEDEC timing |
| WP#/ACC | Write Protect / Accelerated Program | Low = hardware sector protection; high-voltage pulse = accelerated programming for production throughput |
| RY/BY# | Ready/Busy Output | Open-drain status signal indicating active program/erase; eliminates need for polling overhead |
| RESET# | Hardware Reset | Aborts ongoing operation and returns device to read mode; synchronizes with system power-on reset |
| BYTE# | Bus Width Select | High = x16 mode; low = x8 mode using DQ0–DQ7 only; enables pin-compatible migration |
| VIO | I/O Supply Voltage | Independent voltage reference for all address/control/data pins; isolates core logic from I/O domain |
Key Features
| Feature | Design Value |
|---|---|
| Secured Silicon Sector | 128-word (256-byte) factory-locked region with 8-word ESN; provides immutable device identity for secure boot verification |
| CFI Compliance | JEDEC JESD68-defined parameter tables accessible via command sequence; enables automatic flash detection and driver initialization |
| Program Suspend/Resume | Allows interrupting a sector program to read boot code from another sector; critical for dual-bank firmware update schemes |
| Erase Suspend/Resume | Enables background erase of non-boot sectors while executing from protected boot sectors; ensures zero-downtime updates |
| Unlock Bypass Mode | Reduces multi-word programming to two write cycles instead of four; improves factory programming yield and throughput |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
|
Use Scenario: Storing ladder logic, configuration parameters, and firmware images in programmable logic controllers operating continuously in harsh factory environments. IC Role / Device Role / Timing Role: Nonvolatile boot and runtime code storage with guaranteed 20-year data retention at 85°C ambient. Use Value: Eliminates external EEPROM + SRAM combinations; reduces BOM count and board space while meeting IEC 61131-3 reliability requirements. |
Use Scenario: Holding boot loader and safety-critical sensor fusion firmware for radar/vision ECUs requiring ASIL-B compliance. IC Role / Device Role / Timing Role: Primary boot memory mapped to ARM Cortex-R5's XIP address space with <90 ns instruction fetch latency. Use Value: Secured Silicon Sector provides tamper-proof ESN for cryptographic key binding; Persistent Sector Protection locks boot vector region against corruption. |
| Medical Imaging System Configuration | Telecom Base Station FPGA Bitstream |
|
Use Scenario: Storing calibration coefficients, DICOM protocol stacks, and UI assets in portable ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: Parameter and firmware repository with hardware write protection (WP#) to prevent accidental overwrite during service mode. Use Value: 100,000 erase cycles support field recalibration every 3 months over 10+ years; CFI enables plug-and-play driver loading across OEM platforms. |
Use Scenario: Storing reconfigurable FPGA bitstreams for 5G fronthaul processing units requiring hot-swap capability and remote updates. IC Role / Device Role / Timing Role: Dual-image storage partition (active/inactive) with Erase Suspend enabling seamless failover during bitstream reload. Use Value: 16-word write buffer accelerates partial reconfiguration; RY/BY# signal synchronizes FPGA configuration state machine without CPU polling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NOR Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL064S11FFIV10 | Same density and package, but 110 ns access time and VIO = 1.65–3.6 V only; no Secured Silicon Sector | Lacks factory-programmed ESN and persistent lock bits; unsuitable for secure boot or device authentication | Select only for cost-sensitive, non-security applications where 20 ns slower access is acceptable |
| MX29GL640EHTI-90G | 64 Mbit, 90 ns, 3 V, TSOP-48 package; no CFI support; no Erase/Program Suspend; 55,000 erase cycles | Requires custom driver development; lacks suspend features needed for real-time firmware updates | Consider only for legacy designs migrating from older Macronix parts where BGA footprint change is prohibitive |
Compared with S29GL064S11FFIV10 and MX29GL640EHTI-90G, the S29GL064N11FFIV13 uniquely combines CFI auto-configuration, hardware-accelerated programming, and Secured Silicon for trusted boot - making it the only option among the three qualified for ASIL-B and IEC 62443-3-3 deployments.
Availability
S29GL064N11FFIV13 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system configuration requiring stable component supply across extended product lifecycles.
Supply support for S29GL064N11FFIV13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and now owns the MirrorBit Flash portfolio, delivering high-reliability nonvolatile memory for automotive, industrial, and IoT applications.
The S29GL-N series was designed specifically for mission-critical embedded systems requiring long-term data integrity, secure identity, and field-upgradable firmware - targeting applications where failure modes must be bounded and qualification evidence is mandatory.
FAQ
Is S29GL064N11FFIV13 pin-compatible with earlier S29GL064N variants in the same package?
Yes - the S29GL064N11FFIV13 uses the VBK048 48-ball fine-pitch BGA package and maintains identical pin mapping, electrical characteristics, and command set with prior S29GL064N revisions. No PCB redesign or firmware changes are required for drop-in replacement, provided VIO and timing margins remain within spec.
What is the function of the WP#/ACC pin during normal operation versus programming?
When held low, WP#/ACC permanently protects the first or last sector from program/erase commands - even during accelerated programming. When driven high with 5.5 V (±0.3 V), it enables ACC mode, reducing programming time by ~30% via boosted internal voltage generation. The pin is sampled at command latch time, not continuously monitored.
Does the Secured Silicon Sector support customer programming after factory shipment?
Yes - the Secured Silicon Sector can be programmed and locked by the customer using the documented command sequence (Enter Secured Silicon Sector + Program + Lock). Once locked, the 128-word region becomes permanently read-only; unlocking requires physical device replacement. Factory programming includes a unique 8-word ESN, but customer data may occupy remaining space.
How does the CFI interface simplify host system integration?
The CFI interface provides standardized JEDEC JESD68 register maps readable via standard command sequences, allowing host bootloaders to auto-detect device geometry, timing parameters, and supported features (e.g., suspend, protection modes) without hard-coded assumptions - enabling single firmware image support across multiple flash densities and vendors.
S29GL064N11FFIV13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-N
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8, 4M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 110ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL064N11FFIV13 FAQ
1.How can I place an order for S29GL064N11FFIV13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL064N11FFIV13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL064N11FFIV13 reliable?
The price and inventory of S29GL064N11FFIV13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL064N11FFIV13 is usually 5 days.
3.What payment methods are accepted for S29GL064N11FFIV13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL064N11FFIV13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL064N11FFIV13?
S29GL064N11FFIV13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL064N11FFIV13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL064N11FFIV13?
For technical support, including S29GL064N11FFIV13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL064N11FFIV13 requirements.
6.How does Aetrix verify that S29GL064N11FFIV13 is sourced from the original manufacturer or authorized distributors?
All S29GL064N11FFIV13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL064N11FFIV13 meets industry standards.
7.What is the process for return or replacement of S29GL064N11FFIV13?
All S29GL064N11FFIV13 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL064N11FFIV13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL064N11FFIV13 part is unused and in its original packaging.
Return procedure for S29GL064N11FFIV13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL064N11FFIV13 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

