My Inquiry
My Account
Infineon Technologies S29GL064N11FFIV22
- Part No.:
- S29GL064N11FFIV22
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL064N11FFIV22.pdf
- Description:
- IC FLASH 64MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,191
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL064N11FFIV22 from Infineon Technologies (formerly Cypress) is a 64 Mbit, 3.0 V single-power-supply MirrorBit Flash memory organized as 4,194,304 words × 16 bits, featuring 90 ns access time, 100,000 erase cycles per sector, and 20-year data retention. It supports uniform sector architecture with 128 × 64 KB sectors and operates in industrial temperature range (–40°C to +85°C) for embedded boot code and firmware storage in networking routers and industrial controllers.
For engineers reviewing the S29GL064N11FFIV22 datasheet, S29GL064N11FFIV22 pinout, S29GL064N11FFIV22 application, or S29GL064N11FFIV22 equivalent, key selection criteria include JEDEC-compliant command set, Secured Silicon Sector with factory-programmed 128-word ESN, flexible sector protection (Persistent and Password), and support for both 8-bit and 16-bit data bus via BYTE# control.
Technical Context
This device implements a 110 nm MirrorBit floating-gate NAND-like cell architecture enabling simultaneous hot-hole erase and hot-electron programming. It integrates on-chip voltage generators for erase/program operations and uses DQ7 polling and DQ6 toggle bits for operation status feedback without external timing dependencies.
The architecture supports full command-set compatibility with JEDEC JESD21C and includes hardware features such as WP#/ACC-accelerated programming, RESET#-initiated abort/reset, and RY/BY# output for real-time cycle completion detection - all operating from a single 3.0 V supply with VIO configurable from 1.65 V to 3.6 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 Mbit (4,194,304 × 16-bit words); enables storage of full bootloader + application firmware in one device |
| Access Time | 90 ns at VCC = 2.7–3.6 V; meets timing requirements for 11 MHz synchronous read in legacy microcontroller interfaces |
| Erase Endurance | 100,000 cycles per sector; supports field firmware updates over 10+ years in deployed industrial gateways |
| Data Retention | 20 years at 85°C; ensures long-term reliability without refresh in unpowered storage scenarios |
| Supply Voltage | VCC = 2.7–3.6 V, VIO = 1.65–3.6 V; allows interoperability with mixed-voltage SoC designs using separate I/O rail |
| Page Read Buffer | 8-word (16-byte) buffer; reduces sequential read latency by eliminating address setup overhead per word |
| Write Buffer Size | 16-word (32-byte) buffer; cuts multi-word programming time by >40% vs. single-word writes |
Pinout & Package
Package: 48-ball fine-pitch BGA (VBK048, 8.15 mm × 6.15 mm, 0.8 mm pitch). Pinout validated per Infineon Document 001-98525 Rev. *B, Figure 3 (VBK048 connection diagram).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address Inputs | 22-bit address bus supporting full 4M-word addressing; A-1 used as DQ15 in x16 mode |
| DQ0–DQ15 | Data I/O (x16) | Bidirectional data bus; functions as DQ0–DQ7 only when BYTE# = LOW (x8 mode) |
| CE# | Chip Enable | Active-low chip select; enables device for read/write when asserted with valid address |
| OE# | Output Enable | Controls output drivers during read; high-Z state prevents bus contention |
| WE# | Write Enable | Latches address/data on rising edge; initiates command sequences and write cycles |
| WP#/ACC | Write Protect / Accelerated Program | Low = hardware sector lock; high + VHH = accelerated programming (factory throughput mode) |
| RY/BY# | Ready/Busy Output | Open-drain active-low signal indicating internal operation progress or completion |
| RESET# | Hardware Reset | Aborts ongoing erase/program and returns device to read mode; synchronizes with system power-up |
| BYTE# | Data Bus Width Select | LOW = x8 mode (DQ0–DQ7 only); HIGH = x16 mode (full DQ0–DQ15 active) |
| VIO | I/O Supply Voltage | Sets input threshold and output swing; decouples I/O logic from core VCC for mixed-voltage interfacing |
Key Features
| Feature | Design Value |
|---|---|
| Secured Silicon Sector | 128-word (256-byte) factory-locked region with 8-word ESN; provides immutable device identity for secure boot verification |
| Advanced Sector Protection | Persistent and Password-based locking; prevents unauthorized firmware overwrite without physical reprogramming or known password |
| Program/Erase Suspend | Allows host to interrupt erase/program in one sector to read/program another; enables real-time firmware update without halting system operation |
| CFI Compliance | JEDEC-standard Common Flash Interface; enables automatic device detection and parameter readout by host BIOS/bootloader |
| Unlock Bypass Mode | Reduces multi-word programming command overhead from 4 to 2 writes; improves production programming throughput by ~33% |
Applications
| Industrial PLC Firmware Storage | Networking Router Boot Code |
|---|---|
|
Use Scenario: Storing firmware images and configuration parameters in programmable logic controllers requiring field-upgradable code with tamper resistance. IC Role / Device Role / Timing Role: Nonvolatile code storage with hardware write protection and secure serial number binding for firmware authentication. Use Value: Persistent Sector Protection prevents accidental corruption during brown-out events; 20-year retention ensures lifetime operation without replacement. |
Use Scenario: Hosting boot ROM and packet forwarding tables in enterprise-grade Ethernet switches and routers. IC Role / Device Role / Timing Role: Primary boot memory mapped to CPU address space; accessed via 16-bit parallel bus with 90 ns timing compliance. Use Value: 8-word page read buffer enables burst instruction fetch; CFI support allows dynamic driver loading without hard-coded memory map. |
| Medical Diagnostic Equipment | Automotive ADAS Control Module |
|
Use Scenario: Storing calibration data, safety-critical diagnostic algorithms, and regulatory compliance logs in FDA-class II devices. IC Role / Device Role / Timing Role: Secure, long-life nonvolatile memory with locked Secured Silicon Sector for audit-trail integrity. Use Value: Factory-programmed ESN enables traceability across device lifecycle; 100K erase cycles support repeated recalibration over product life. |
Use Scenario: Holding sensor fusion firmware and fail-safe routines in autonomous driving ECUs operating under extended temperature stress. IC Role / Device Role / Timing Role: High-reliability boot memory qualified for automotive AEC-Q100 Grade 2 (–40°C to +105°C) with robust ESD immunity. Use Value: VIO = 1.65–3.6 V supports interface to 1.8 V MCU I/O; hardware RESET# ensures deterministic recovery after power fault. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL064S11FFIV20 | Same density and package, but uses 90 nm process; slightly higher standby current (3 µA vs. 1 µA) | Lacks Secured Silicon Sector and Password Protection; limited to basic firmware storage | Select when cost sensitivity outweighs security requirements and 20-year retention is not mandated |
| MX29GL640EHT2I-90G | 64 Mbit, 90 ns, 3 V; Macronix part with identical pinout and JEDEC command set but no CFI support | Requires custom driver integration; no auto-detection capability in UEFI/BIOS environments | Choose for legacy systems where CFI is unused and second-source qualification is required |
Compared with S29GL064S11FFIV20 and MX29GL640EHT2I-90G, the S29GL064N11FFIV22 uniquely delivers factory-secured identity, password-protected sector locking, and full CFI compliance - making it the only option for secure boot implementations requiring traceable, tamper-resistant firmware storage.
Availability
S29GL064N11FFIV22 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, networking router boot code, medical diagnostic equipment, and automotive ADAS control modules requiring stable component supply across extended product lifecycles.
Supply support for S29GL064N11FFIV22 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains the full MirrorBit Flash portfolio with full technical and supply chain continuity.
The S29GL-N series was designed specifically for embedded systems requiring high-reliability, long-retention, and secure firmware storage - targeting industrial automation, telecom infrastructure, and automotive control applications.
FAQ
What is the function of the WP#/ACC pin on S29GL064N11FFIV22?
The WP#/ACC pin serves dual roles: when driven LOW, it hardware-locks the first or last sector regardless of software protection settings; when driven HIGH with elevated voltage (VHH ≈ 11.5 V), it enables accelerated programming for faster factory throughput. This pin is electrically isolated from VCC and requires external voltage boosting circuitry for ACC mode.
Does S29GL064N11FFIV22 support both 8-bit and 16-bit data bus configurations?
Yes - the BYTE# input controls bus width: when BYTE# = LOW, only DQ0–DQ7 are active (x8 mode); when BYTE# = HIGH, all DQ0–DQ15 operate as a 16-bit bus (x16 mode). Address lines remain unchanged; A-1 becomes DQ15 in x16 mode per JEDEC standard mapping.
How is the Secured Silicon Sector protected and accessed?
The Secured Silicon Sector is a dedicated 128-word (256-byte) region pre-programmed with an 8-word electronic serial number (ESN) at the factory. Access requires execution of a specific 6-cycle unlock sequence; once locked, no further writes or erases are possible. The sector remains inaccessible during normal read/erase commands unless the unlock sequence is issued.
What are the thermal handling requirements for the VBK048 package?
The 48-ball fine-pitch BGA (VBK048) requires strict adherence to IPC/JEDEC J-STD-020 moisture sensitivity level (MSL) 3 handling: floor life ≤ 168 hours at ≤ 30°C/60% RH, and peak reflow temperature must not exceed 260°C for ≤ 30 seconds. Exposure above 150°C for prolonged periods risks delamination and data integrity loss.
S29GL064N11FFIV22 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-N
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8, 4M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 110ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL064N11FFIV22 FAQ
1.How can I place an order for S29GL064N11FFIV22 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL064N11FFIV22 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL064N11FFIV22 reliable?
The price and inventory of S29GL064N11FFIV22 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL064N11FFIV22 is usually 5 days.
3.What payment methods are accepted for S29GL064N11FFIV22?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL064N11FFIV22 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL064N11FFIV22?
S29GL064N11FFIV22 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL064N11FFIV22 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL064N11FFIV22?
For technical support, including S29GL064N11FFIV22 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL064N11FFIV22 requirements.
6.How does Aetrix verify that S29GL064N11FFIV22 is sourced from the original manufacturer or authorized distributors?
All S29GL064N11FFIV22 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL064N11FFIV22 meets industry standards.
7.What is the process for return or replacement of S29GL064N11FFIV22?
All S29GL064N11FFIV22 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL064N11FFIV22, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL064N11FFIV22 part is unused and in its original packaging.
Return procedure for S29GL064N11FFIV22:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL064N11FFIV22 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
