Infineon Technologies S29GL064N11TFIV23
- Part No.:
- S29GL064N11TFIV23
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL064N11TFIV23.pdf
- Description:
- IC FLASH 64MBIT PARALLEL 56TSOP
- Quantity:
- Payment:

- Shipping:

Inventory:1,400
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL064N11TFIV23 from Infineon Technologies (formerly Cypress) is a 64 Mbit, 3.0 V single-power-supply MirrorBit Flash memory organized as 4,194,304 words (16-bit bus), featuring 90 ns access time, 100,000 erase cycles per sector, and 20-year data retention. It supports uniform sector architecture with 128 × 64 KB sectors and operates in industrial temperature range (–40°C to +85°C), deployed in boot code storage for embedded controllers and firmware update modules.
For engineers reviewing the S29GL064N11TFIV23 datasheet, S29GL064N11TFIV23 pinout, S29GL064N11TFIV23 application, or S29GL064N11TFIV23 equivalent, key selection criteria include JEDEC software compatibility, Secured Silicon Sector with factory-programmed 128-word ESN, VersatileI/O™ voltage flexibility (VIO = 1.65–3.6 V), and hardware-accelerated programming via WP#/ACC pin.
Technical Context
This device implements a command-set-compatible, single-supply NOR Flash architecture with hot-electron injection programming and hot-hole assisted sector erase. It integrates CFI (Common Flash Interface) for host auto-identification and supports both byte- and word-wide configurations via BYTE# control.
Its dual-bus operation enables 8-word page read buffer (25 ns page access) and 16-word write buffer, while hardware features include RY/BY# status output, RESET# reset input, and low-VCC write inhibit. Sector protection combines Persistent and Password-based methods, with Secured Silicon Sector locked at factory or by user.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 Mbit (4,194,304 × 16-bit words), enabling full boot image storage for mid-complexity microcontrollers. |
| Access Time | 90 ns (VCC = 2.7–3.6 V, VIO = 2.7–3.6 V), meeting real-time firmware fetch timing in industrial PLCs. |
| Erase Endurance | 100,000 cycles per sector, supporting field firmware updates over 10+ years in remote telemetry devices. |
| Data Retention | 20 years at +85°C, ensuring long-term reliability in unattended infrastructure equipment. |
| Supply Voltage | VCC = 2.7–3.6 V, VIO = 1.65–3.6 V, allowing direct interface with 1.8 V or 3.3 V I/O domains without level shifters. |
| Package | 48-pin TSOP (Type I), footprint-compatible with legacy board designs using JEDEC MO-142 standard. |
| Operating Temp | –40°C to +85°C, qualified for deployment in automotive body control modules and industrial HMIs. |
Pinout & Package
Package: 48-pin TSOP (Type I), JEDEC MO-142 compliant, 12 mm × 20 mm body, 0.5 mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address Inputs | 22-bit address bus supporting full 4M-word addressing; A-1 (DQ15) used for x16/x8 mode detection. |
| DQ0–DQ15 | Data/Address Multiplexed I/O | 16-bit bidirectional data bus; DQ15 doubles as A-1 for byte/word configuration when BYTE# = low. |
| CE#, OE#, WE# | Chip/Output/Write Enable Controls | Independent active-low enables allow interleaved read/write operations and partial memory mapping. |
| WP#/ACC | Write Protect / Accelerated Program Input | Low = hardware sector lock; high-voltage pulse enables faster factory programming and overrides software protection. |
| RY/BY# | Ready/Busy Output | Open-drain signal indicates active erase/program cycle completion-critical for interrupt-driven firmware updates. |
| RESET# | Hardware Reset Input | Asynchronous reset terminates ongoing operations and restores device to known state, synchronizing with system boot. |
Key Features
| Feature | Design Value |
|---|---|
| Secured Silicon Sector | 128-word (256-byte) factory-lockable region with 8-word ESN-enables secure device identity binding in IoT edge nodes. |
| Program/Erase Suspend | Allows host to pause programming/erasing to service higher-priority reads-essential for real-time OS coexistence. |
| VersatileI/O™ Control | VIO pin sets all I/O voltage thresholds independently of VCC-eliminates external level shifters in mixed-voltage systems. |
| CFI Compliance | Standardized query table enables automatic flash driver initialization-reduces BSP development time for new platforms. |
| Unlock Bypass Mode | Reduces multi-word programming overhead from 4 to 2 write cycles-improves firmware update throughput by ~30%. |
Applications
| Industrial PLC Firmware Storage | Automotive Body Control Module |
|---|---|
|
Use Scenario: Storing and executing boot code and configuration parameters in programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Primary nonvolatile code storage with deterministic 90 ns read latency and hardware reset synchronization. Use Value: 20-year data retention and –40°C to +85°C operation ensure firmware integrity across extended maintenance cycles without recalibration. |
Use Scenario: Holding calibrated sensor lookup tables and actuator control logic in door module ECUs subject to thermal cycling and vibration. IC Role / Device Role / Timing Role: Secure, field-updatable memory with Password Sector Protection guarding calibration data against unauthorized modification. Use Value: Secured Silicon Sector provides tamper-evident device ID, satisfying OEM traceability requirements for Tier-1 automotive supply chain. |
| Medical Diagnostic Equipment Boot ROM | Network Router Boot Image Storage |
|
Use Scenario: Hosting certified boot firmware and safety-critical startup routines in portable ultrasound and imaging systems requiring regulatory compliance. IC Role / Device Role / Timing Role: JEDEC-compatible NOR Flash with CFI support enabling automated driver validation during FDA audit testing. Use Value: 100,000 erase cycles allow repeated firmware validation and revision rollbacks during clinical trial deployments. |
Use Scenario: Storing primary and fallback boot images in enterprise-grade routers where fail-safe recovery is mandatory after OTA updates. IC Role / Device Role / Timing Role: Dual-sector architecture with independent erase capability enables atomic image swap without runtime interruption. Use Value: Uniform 128 × 64 KB sectors simplify partitioning logic and reduce bootloader complexity versus mixed-boot-sector alternatives. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NOR Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL064S11TFIV20 | Same density and package, but uses 90 nm process (vs. 110 nm); 110 ns access time; no Secured Silicon Sector. | Lacks factory-programmed ESN and persistent sector lock-unsuitable for secure device authentication. | Select only when cost sensitivity outweighs security requirements and slower timing is acceptable. |
| MX29GL640EHTI-90G | 64 Mbit, 90 ns, 48-pin TSOP, but requires separate VCC/VIO supplies; no CFI support; 50,000 erase cycles. | No common flash interface or suspend/resume features-increases driver porting effort and limits multitasking capability. | Consider only for legacy designs already committed to Macronix toolchains and where CFI independence is verified. |
Compared with S29GL064S11TFIV20 and MX29GL640EHTI-90G, the S29GL064N11TFIV23 uniquely delivers factory-secured identity, CFI-driven auto-configuration, and full suspend/resume functionality-making it optimal for secure, upgradable, and real-time-constrained embedded systems.
Availability
S29GL064N11TFIV23 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive body control modules, and medical diagnostic boot ROM requiring stable component supply, long-lifecycle support, and qualified industrial temperature grade.
Supply support for S29GL064N11TFIV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains the MirrorBit Flash portfolio with full technical and supply-chain continuity.
The S29GL-N family targets embedded systems requiring reliable, secure, and field-upgradable nonvolatile storage-optimized for boot code, firmware, and configuration data in automotive, industrial, and medical applications.
FAQ
What is the function of the WP#/ACC pin on S29GL064N11TFIV23?
The WP#/ACC pin serves dual roles: when held low, it hardware-locks the first or last sector regardless of software protection settings; when pulsed high (≥VCC + 0.5 V), it enables accelerated programming for reduced factory burn-in time. This pin is electrically isolated from VCC and must be driven with appropriate voltage translation circuitry if interfaced to 1.8 V logic.
Does S29GL064N11TFIV23 support byte-wide data access?
Yes, it supports 8-bit operation via the BYTE# input: when BYTE# is low, DQ0–DQ7 function as an 8-bit data bus with DQ15 acting as A-1 for address extension; when BYTE# is high, the device operates in full 16-bit mode. This dual-width capability eliminates need for external data bus multiplexing in mixed-interface systems.
How is the Secured Silicon Sector programmed and protected?
The Secured Silicon Sector is pre-programmed at factory with a unique 8-word (16-byte) Electronic Serial Number and can be permanently locked by issuing the Program Secured Silicon Sector command followed by the Sector Protect command. Once locked, no further writes or erases are possible-even under accelerated programming conditions-and the ESN remains readable throughout device life.
Can S29GL064N11TFIV23 be used in systems with 1.8 V I/O voltage?
Yes, provided VIO is supplied at 1.65–3.6 V independently of VCC (2.7–3.6 V). With VIO = 1.8 V, all input thresholds and output drive levels conform to 1.8 V logic families, enabling direct connection to FPGA or ASIC I/O banks without level shifters-confirmed in datasheet Section 15 AC Characteristics and Figure 1 pinout.
S29GL064N11TFIV23 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-N
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8, 4M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 110ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL064N11TFIV23 FAQ
1.How can I place an order for S29GL064N11TFIV23 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL064N11TFIV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL064N11TFIV23 reliable?
The price and inventory of S29GL064N11TFIV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL064N11TFIV23 is usually 5 days.
3.What payment methods are accepted for S29GL064N11TFIV23?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL064N11TFIV23 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL064N11TFIV23?
S29GL064N11TFIV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL064N11TFIV23 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL064N11TFIV23?
For technical support, including S29GL064N11TFIV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL064N11TFIV23 requirements.
6.How does Aetrix verify that S29GL064N11TFIV23 is sourced from the original manufacturer or authorized distributors?
All S29GL064N11TFIV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL064N11TFIV23 meets industry standards.
7.What is the process for return or replacement of S29GL064N11TFIV23?
All S29GL064N11TFIV23 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL064N11TFIV23, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL064N11TFIV23 part is unused and in its original packaging.
Return procedure for S29GL064N11TFIV23:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL064N11TFIV23 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

