Infineon Technologies S29GL064S70TFA040
- Part No.:
- S29GL064S70TFA040
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL064S70TFA040.pdf
- Description:
- IC FLASH 64MBIT PARALLEL 48TSOP
- Quantity:
- Payment:

- Shipping:

Inventory:2,019
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL064S70TFA040 from Infineon is a 64 Mb (8 MB) parallel NOR flash memory IC using 65-nm MIRRORBIT™ technology, operating from a single 3.0 V supply with 70 ns access time, 128-word write buffer, and integrated hardware ECC for single-bit error correction. It features uniform 64-KB sectors, industrial temperature range (–40°C to +85°C), and 48-lead TSOP package - deployed in boot firmware storage for industrial controllers.
For engineers reviewing the S29GL064S70TFA040 datasheet, S29GL064S70TFA040 pinout, S29GL064S70TFA040 application, or S29GL064S70TFA040 equivalent, key selection criteria include JEDEC-compliant command set, sector-level erase flexibility, Secure Silicon Region programmability, VIO-controlled I/O voltage range (1.65 V to VCC), and AEC-Q100 Grade 3 qualification status.
Technical Context
This device implements a parallel asynchronous interface with separate CE#, WE#, and OE# controls, supporting both 16-bit word and 8-bit byte configurations via BYTE# input. Its architecture enables simultaneous read/program or read/erase operations through Program Suspend and Erase Suspend features.
Internal hardware ECC operates transparently during read cycles, correcting single-bit errors without host intervention. The Secure Silicon Region provides a factory- or customer-lockable 128-word (256-byte) area with permanent protection enforced by command-sequence-based locking and PPB bit control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 Mb (4,194,304 words × 16 bits), organized as 128 uniform 64-KB sectors |
| Access Time | 70 ns - defines maximum address-to-valid-data delay under specified VCC and load conditions |
| Write Buffer Size | 128 words (256 bytes) - reduces multi-word programming overhead by batching writes |
| ECC Support | On-die hardware single-bit error correction - ensures data integrity without software overhead |
| VIO Range | 1.65 V to VCC - allows I/O voltage independence from core supply for mixed-voltage system interfacing |
| Endurance | 100,000 erase cycles per sector - guarantees long-term field reliability in firmware update scenarios |
| Data Retention | 20 years typical - supports extended product lifecycle without refresh requirements |
Pinout & Package
Package: 48-lead TSOP (Thin Small Outline Package), standard JEDEC MO-142AC footprint, 12 mm × 20 mm × 1.2 mm height, surface-mount compatible.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address Inputs | 22-bit address bus supporting full 4-Mword addressing; latched internally during command execution |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; BYTE# selects 8-bit mode for legacy controller compatibility |
| CE# | Chip Enable | Active-low enable controlling device selection; required assertion for all read/write/erase operations |
| OE# | Output Enable | Active-low control enabling output drivers during read cycles only |
| WE# | Write Enable | Active-low strobe latching address/data/command on rising edge for write/erase sequences |
| RESET# | Hardware Reset | Active-low asynchronous reset terminating ongoing operations and returning device to read mode |
| RY/BY# | Ready/Busy Output | Open-drain status indicator signaling active program/erase cycle completion |
| WP#/ACC | Write Protect / Accelerated Program | Low = protects first/last sector; high-voltage pulse enables accelerated programming for production throughput |
Key Features
| Feature | Design Value |
|---|---|
| Secure Silicon Region | 128-word (256-byte) factory- or user-lockable sector with irreversible protection via command sequence and PPB bit |
| Program/Erase Suspend | Enables real-time interruption of programming or erasing to service higher-priority reads from other sectors |
| Unlock Bypass Mode | Reduces multi-word programming command overhead from 4 to 2 write cycles per data word |
| Advanced Sector Protection | Combines persistent lock bits and password-based sector protection for hierarchical firmware security |
| CFI Compliance | JEDEC-standard Common Flash Interface enables automatic device identification and parameter discovery at system boot |
Applications
| Industrial PLC Firmware Storage | Automotive Instrument Cluster Boot Memory |
|---|---|
Use Scenario: Storing boot code and configuration data in programmable logic controllers requiring field-upgradable firmware with tamper resistance. IC Role / Device Role / Timing Role: Nonvolatile parallel NOR flash providing deterministic 70 ns read access for fast processor boot and runtime code execution. Use Value: Uniform 64-KB sectors and hardware ECC ensure reliable firmware integrity across 100,000+ field updates over 20-year deployment. | Use Scenario: Holding calibrated display assets and safety-critical boot routines in automotive digital instrument clusters meeting AEC-Q100 Grade 3. IC Role / Device Role / Timing Role: Boot memory mapped directly to MCU address space, accessed via parallel bus with RESET#-synchronized initialization. Use Value: Secure Silicon Region stores calibration keys; WP#/ACC pin enables production-line programming while preventing runtime corruption. |
| Medical Diagnostic Equipment BIOS | Network Router Configuration Storage |
Use Scenario: Hosting BIOS and FPGA configuration bitstreams in Class II medical devices where data retention and auditability are regulated. IC Role / Device Role / Timing Role: Primary nonvolatile storage for power-on self-test (POST) routines and hardware initialization sequences. Use Value: 20-year data retention and CFI compliance simplify regulatory documentation; sector erase architecture isolates updates from critical boot code. | Use Scenario: Storing routing tables, CLI scripts, and failover images in carrier-grade edge routers requiring rapid reconfiguration. IC Role / Device Role / Timing Role: Parallel flash interfaced to MIPS or ARM SoC via dedicated memory controller with RY/BY# polling for operation status. Use Value: 128-word write buffer accelerates firmware patching; Erase Suspend allows background image validation during active traffic forwarding. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL064S90TFI020 | 90 ns access time, industrial temperature (–40°C to +85°C), same 48-pin TSOP package | Lacks AEC-Q100 qualification; lower performance margin for timing-critical boot paths | Select when cost sensitivity outweighs 20 ns access time requirement and automotive qualification is unnecessary |
| S29GL064S70TFI020 | Identical 70 ns speed and 48-pin TSOP, but rated only for industrial (not automotive) temperature range | No AEC-Q100 Grade 3 certification; unsuitable for under-hood or dashboard-mounted systems | Choose for industrial HMI or gateway applications where extended temperature is not required |
Compared with S29GL064S70TFA040, the alternatives trade off automotive qualification (AEC-Q100 Grade 3) and/or access speed to reduce cost - making them viable only where environmental stress or boot latency constraints are relaxed.
Availability
S29GL064S70TFA040 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot memory, and medical diagnostic equipment BIOS requiring stable component supply across extended product lifecycles.
Supply support for S29GL064S70TFA040 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and secure memory solutions, with global manufacturing and quality certifications including ISO/TS 16949 and AEC-Q200.
The GL-S MIRRORBIT™ flash product line delivers high-reliability parallel NOR memory for mission-critical boot and firmware storage in automotive, industrial, and medical systems - emphasizing data integrity, long-term retention, and hardware-enforced security.
FAQ
What is the function of the WP#/ACC pin on S29GL064S70TFA040?
The WP#/ACC pin serves dual functions: when held low, it hardware-protects the first or last memory sector against accidental program/erase; when pulsed with elevated voltage (VACC), it enables accelerated programming for faster production-line flashing. This pin remains active even during Secure Silicon Region locking and does not affect internal ECC operation.
Does S29GL064S70TFA040 support byte-wide data access?
Yes - the device supports 8-bit data access when the BYTE# input is asserted low, configuring DQ0–DQ7 as the active data bus while disabling DQ8–DQ15. This mode maintains full command-set compatibility and preserves sector protection settings, enabling integration with legacy 8-bit microcontrollers without external data-width translation.
How does the Secure Silicon Region differ from standard sector protection?
The Secure Silicon Region is a dedicated 128-word (256-byte) area that can be permanently locked via command sequence and PPB bit, preventing any further writes or erases - unlike standard sector protection, which remains reversible via unlock commands. Once locked, this region retains its contents for 20 years and is inaccessible to standard erase commands, even during chip erase.
Is the 70 ns access time guaranteed across the full industrial temperature range?
Yes - the 70 ns access time is specified and tested over the full –40°C to +85°C industrial temperature range at VCC = 3.0 V ±0.3 V and specified capacitive load. This timing includes address setup and hold margins and is validated per JEDEC JESD22-A108 reliability standards, ensuring deterministic boot performance in uncontrolled thermal environments.
S29GL064S70TFA040 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8, 4M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP
S29GL064S70TFA040 FAQ
1.How can I place an order for S29GL064S70TFA040 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL064S70TFA040 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL064S70TFA040 reliable?
The price and inventory of S29GL064S70TFA040 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL064S70TFA040 is usually 5 days.
3.What payment methods are accepted for S29GL064S70TFA040?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL064S70TFA040 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL064S70TFA040?
S29GL064S70TFA040 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL064S70TFA040 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL064S70TFA040?
For technical support, including S29GL064S70TFA040 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL064S70TFA040 requirements.
6.How does Aetrix verify that S29GL064S70TFA040 is sourced from the original manufacturer or authorized distributors?
All S29GL064S70TFA040 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL064S70TFA040 meets industry standards.
7.What is the process for return or replacement of S29GL064S70TFA040?
All S29GL064S70TFA040 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL064S70TFA040, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL064S70TFA040 part is unused and in its original packaging.
Return procedure for S29GL064S70TFA040:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL064S70TFA040 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…

