Infineon Technologies S29GL128P10FFI013

Overview

S29GL128P10FFI013 from Cypress Semiconductor is a 128 Mbit (16 MB), 3.0 V-only page-mode NOR Flash memory fabricated on 90 nm MirrorBit process technology, featuring 128 uniform 64 Kword sectors, 25 ns page access time, and 100,000 erase cycles per sector - deployed in industrial embedded systems for firmware storage and code execution.

For engineers reviewing the S29GL128P10FFI013 datasheet, S29GL128P10FFI013 pinout, S29GL128P10FFI013 application, or S29GL128P10FFI013 equivalent, key selection criteria include VIO-supported Versatile I/O (1.65–VCC), 64-ball Fortified BGA (LAA064) package, WP#/ACC acceleration input, CFI compliance, and Secured Silicon Sector with factory-programmable 128-word serial number.

Technical Context

This device implements a synchronous/asynchronous hybrid interface with dedicated CE#, OE#, and WE# control lines, supporting byte/word configuration via BYTE# input and hardware reset via RESET#. Its internal state machine manages embedded program/erase algorithms with suspend/resume capability.

The 64-ball Fortified BGA package supports 1.0 mm pitch layout and requires no ultrasonic cleaning; electrical operation is defined across VCC = 2.7–3.6 V and VIO = 1.65–VCC, with RY/BY# output signaling algorithm completion and WP#/ACC enabling VHH-accelerated programming or sector write protection.

Key Specifications

Pinout & Package

Package: 64-ball Fortified Ball Grid Array (LAA064), 11 × 13 mm, 1.0 mm pitch, Pb-free (F), industrial temperature grade (I).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar NOR Flash memory applications.

Compared with S29GL128S10FFI010 and MX29GL128FHT2I-90G, the S29GL128P10FFI013 uniquely delivers industrial-grade reliability with VIO flexibility and factory-programmable security - making it optimal for legacy-compatible, high-integrity embedded deployments where timing and physical package match existing PCB layouts.

Availability

S29GL128P10FFI013 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot code, and medical imaging system configuration requiring stable component supply and long-lifecycle support.

Supply support for S29GL128P10FFI013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance, reliable non-volatile memory and programmable system-on-chip solutions for industrial, automotive, and communications markets.

The S29GL-P family targets embedded systems needing robust, code-executable NOR Flash with advanced security, flexible I/O, and long-term data integrity - optimized for firmware storage in mission-critical applications.

FAQ

What is the function of the WP#/ACC pin on S29GL128P10FFI013?

The WP#/ACC pin serves dual functions: at VIL, it protects the highest or lowest address sector from accidental writes; at VHH (12 V), it accelerates programming by enabling unlock bypass mode and reducing per-word programming time to 13.5 µs. It has an internal pull-up, defaulting to VIH when unconnected.

Does S29GL128P10FFI013 support XIP (eXecute-In-Place)?

Yes - its fast 25 ns page access time and asynchronous read capability allow direct code execution from flash without copying to RAM. The device supports standard read commands and RY/BY# status monitoring to coordinate CPU fetch timing during active program/erase operations.

How is the Secured Silicon Sector programmed and locked?

The 128-word Secured Silicon Sector can be programmed and permanently locked either at the factory or by the end customer using specific command sequences. Once locked, the sector becomes read-only and contains a unique 8-word electronic serial number used for device identification and anti-counterfeiting in production traceability systems.

What are the key differences between TSOP and Fortified BGA packages for this device?

The 64-ball Fortified BGA (LAA064) offers higher I/O density, better thermal performance, and improved signal integrity for high-speed designs but requires reflow-only assembly and prohibits ultrasonic cleaning. The 56-pin TSOP variant provides easier prototyping and rework but lacks the mechanical robustness and thermal margin needed for extended industrial operation.