My Inquiry
My Account
Infineon Technologies S29GL128P10FFIS13
- Part No.:
- S29GL128P10FFIS13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL128P10FFIS13.pdf
- Description:
- IC FLASH 128MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,679
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL128P10FFIS13 from Cypress Semiconductor is a 128 Mbit (16 MB), 3.0 V-only page-mode NOR Flash memory fabricated on 90 nm MirrorBit process technology. It features uniform 64 Kword (128 Kbyte) sectors (128 total), 25 ns page access time, 90 ns random access time, and a 32-word/64-byte write buffer for accelerated multi-word programming - deployed in industrial embedded systems requiring reliable nonvolatile storage with sector-level protection.
For engineers reviewing the S29GL128P10FFIS13 datasheet, S29GL128P10FFIS13 pinout, S29GL128P10FFIS13 application, or S29GL128P10FFIS13 equivalent, key selection criteria include VIO-compatible VersatileI/O™ operation (1.65–VCC), CFI compliance, Secured Silicon Sector with factory-programmable ESN, and hardware-accelerated programming via WP#/ACC at VHH.
Technical Context
This device implements a synchronous command-set architecture with dedicated state control logic, erase voltage generator, and PGM voltage generator to execute embedded algorithms for program/erase. Its block diagram includes X/Y decoders, sector switches, and data gating aligned to a 23-bit address bus (A22–A0) supporting byte/word configuration via BYTE#.
It supports three operating voltage modes: Regulated VCC (3.0–3.6 V), Full VCC (2.7–3.6 V), and VersatileIO VIO (1.65–VCC with VCC = 2.7–3.6 V). Write operation status bits and RY/BY# output provide real-time feedback on algorithm completion, while suspend/resume commands enable foreground task interruption during long-duration erase cycles.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 128 Mbit (16 MB) organized as 2,097,152 × 8 or 1,048,576 × 16 |
| Page Access Time | 25 ns - enables high-throughput sequential reads from internal page buffer |
| Random Access Time | 90 ns under regulated VCC - defines worst-case latency for single-word fetches |
| Write Buffer Size | 32 words / 64 bytes - reduces effective programming time by batching writes |
| Sector Architecture | Uniform 64 Kword (128 Kbyte) sectors - 128 sectors total, enabling granular erase control |
| Data Retention | 20 years typical - ensures long-term firmware/data integrity without refresh |
| Erase Endurance | 100,000 cycles per sector - supports frequent field updates in boot code or configuration storage |
Pinout & Package
Package: 64-ball Fortified BGA (LAA064), 11 × 13 mm, 1.0 mm pitch, Pb-free (F), industrial temperature range (–40°C to +85°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A22–A0 | Address Inputs | 23-bit address bus; A22 is MSB for 128 Mbit density |
| DQ15/A-1 | Bi-directional Data / LSB Address | DQ15 in word mode; A-1 (byte mode LSB) when BYTE# = VIL |
| DQ14–DQ0 | Data I/O | 15-bit data bus in word mode; DQ7–DQ0 active in byte mode |
| CE#, OE#, WE# | Chip/Output/Write Enable | Standard asynchronous NOR interface controls; all active-low |
| RY/BY# | Ready/Busy Output | Active-low open-drain signal indicating ongoing program/erase |
| RESET# | Hardware Reset Input | Asynchronous reset that terminates all operations and returns to read mode |
| WP#/ACC | Write Protect / Acceleration | VIL protects outermost sector; VHH enables unlock bypass and faster programming |
| VIO | Versatile I/O Supply | Defines input threshold and output drive level (1.65–VCC); decouples I/O from core VCC |
Key Features
| Feature | Design Value |
|---|---|
| VersatileI/O™ Control | VIO supply (1.65–VCC) independently sets input thresholds and output levels - simplifies interfacing with mixed-voltage SoCs |
| Secured Silicon Sector | 128-word (256-byte) factory- or customer-lockable region with 8-word ESN - provides tamper-resistant device identity |
| Advanced Sector Protection | Persistent lock bits + password method - enables flexible, nonvolatile sector lockdown without external security ICs |
| Suspend/Resume Commands | Pauses erase or program mid-operation to service higher-priority CPU requests - critical for real-time OS environments |
Applications
| Industrial HMI Firmware Storage | Automotive Infotainment Boot Code |
|---|---|
Use Scenario: Storing GUI assets, localization strings, and firmware update images in panel-mounted HMIs operating continuously in factory environments. IC Role / Device Role / Timing Role: Nonvolatile code/data storage with sector-locked bootloader region and fast page reads for UI asset streaming. Use Value: 20-year data retention and 100K erase cycles ensure firmware longevity across equipment lifecycles; 25 ns page access accelerates graphic rendering. | Use Scenario: Holding primary boot loader and fail-safe recovery image in head unit ECUs where power interruption during update must not corrupt boot code. IC Role / Device Role / Timing Role: Secure, field-upgradable boot memory with hardware WP#/ACC acceleration and Secured Silicon Sector for anti-cloning. Use Value: Factory-programmed ESN prevents counterfeit modules; suspend/resume avoids corruption during vehicle battery transients. |
| Medical Diagnostic Device Configuration | Telecom Base Station FPGA Bitstream |
Use Scenario: Storing calibration profiles, user preferences, and regulatory-compliant audit logs in portable ultrasound and ECG devices. IC Role / Device Role / Timing Role: Parameter and log storage with persistent sector protection to prevent accidental overwrite of FDA-mandated settings. Use Value: Uniform 128 KB sectors allow isolated logging partitions; CFI support simplifies host driver development across product generations. | Use Scenario: Loading configurable logic bitstreams into Xilinx/Intel FPGAs during cold start or dynamic reconfiguration in 5G radio units. IC Role / Device Role / Timing Role: High-reliability configuration memory with fast random access (90 ns) for deterministic FPGA startup timing. Use Value: 90 ns tACC meets tight FPGA configuration window requirements; VIO compatibility eases integration with 1.8 V FPGA I/O banks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NOR Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128S10TFI010 | TSOP-56 package (vs. BGA), same 128 Mbit density and 90 ns speed grade | Larger footprint; less suitable for space-constrained telecom or automotive modules | Select when board layout favors through-hole or standard surface-mount assembly with manual rework capability |
| MX29GL128FHT2I-90G | Macronix part; identical 128 Mbit, 90 ns, BGA-64, industrial temp, but lacks Secured Silicon Sector and VersatileI/O™ | No factory-programmable ESN or VIO flexibility - limits use in secure or mixed-voltage designs | Choose only if cost sensitivity outweighs need for hardware-based device identity or I/O voltage decoupling |
Compared with S29GL128S10TFI010, the S29GL128P10FFIS13 offers superior board-area efficiency and thermal performance in dense layouts; versus MX29GL128FHT2I-90G, it delivers differentiated security and voltage-flexible interfacing essential for certified medical and automotive deployments.
Availability
S29GL128P10FFIS13 is available at Aetrix Electronics and suitable for industrial HMI firmware storage, automotive infotainment boot code, and medical diagnostic device configuration requiring stable component supply and long-term lifecycle support.
Supply support for S29GL128P10FFIS13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance, low-power memory and microcontroller solutions for industrial, automotive, and consumer applications.
The S29GL-P family targets embedded systems needing robust, field-upgradable nonvolatile storage with hardware-enforced security and mixed-voltage interoperability - optimized for boot code, firmware, and configuration data in mission-critical environments.
FAQ
What is the function of the VIO pin on the S29GL128P10FFIS13?
VIO sets the input voltage thresholds and output drive levels independently of VCC, supporting 1.65 V to VCC operation. This allows direct interfacing with 1.8 V or 2.5 V host processors while maintaining 3.0 V core operation - eliminating level shifters in mixed-voltage designs and reducing BOM count and layout complexity.
Does the S29GL128P10FFIS13 support CFI (Common Flash Interface)?
Yes, it fully complies with JEDEC JESD68-A CFI specification. The device exposes standardized parameter tables at known addresses, enabling generic flash drivers to auto-detect geometry, timings, and command sets - significantly reducing porting effort across different host platforms and simplifying firmware maintenance.
How does the Secured Silicon Sector work, and can it be programmed in-system?
The Secured Silicon Sector is a dedicated 128-word (256-byte) region containing an 8-word (16-byte) factory-programmable Electronic Serial Number. Customers can also program and permanently lock this region using specific command sequences - providing immutable device identification for anti-counterfeiting, license enforcement, or secure boot key binding in production or field environments.
What is the purpose of the WP#/ACC pin, and how does it affect programming speed?
WP#/ACC serves dual roles: at VIL, it protects the highest or lowest sector; at VHH (typically 9–12 V), it enables Unlock Bypass mode, accelerating single-word programming to 13.5 µs (vs. 60 µs standard) by skipping address/command verification steps - critical for high-throughput manufacturing programming while preserving field safety via hardware write protection.
S29GL128P10FFIS13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-P
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 100ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL128P10FFIS13 FAQ
1.How can I place an order for S29GL128P10FFIS13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128P10FFIS13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128P10FFIS13 reliable?
The price and inventory of S29GL128P10FFIS13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128P10FFIS13 is usually 5 days.
3.What payment methods are accepted for S29GL128P10FFIS13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128P10FFIS13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL128P10FFIS13?
S29GL128P10FFIS13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL128P10FFIS13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL128P10FFIS13?
For technical support, including S29GL128P10FFIS13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128P10FFIS13 requirements.
6.How does Aetrix verify that S29GL128P10FFIS13 is sourced from the original manufacturer or authorized distributors?
All S29GL128P10FFIS13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128P10FFIS13 meets industry standards.
7.What is the process for return or replacement of S29GL128P10FFIS13?
All S29GL128P10FFIS13 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128P10FFIS13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128P10FFIS13 part is unused and in its original packaging.
Return procedure for S29GL128P10FFIS13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL128P10FFIS13 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
