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Infineon Technologies S29GL128S10DHB010
- Part No.:
- S29GL128S10DHB010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL128S10DHB010.pdf
- Description:
- IC FLASH 128MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,905
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Product details
Overview
S29GL128S10DHB010 from Infineon is a 128 Mb (16 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction-used in boot code storage and firmware execution in industrial control systems.
For engineers reviewing the S29GL128S10DHB010 datasheet, S29GL128S10DHB010 pinout, S29GL128S10DHB010 application, or S29GL128S10DHB010 equivalent, key selection criteria include its 128-kbyte uniform sector erase granularity, 512-byte programming buffer, Versatile I/O support (1.65 V to VCC), AEC-Q100 Grade 2/3 qualification options, and TSOP-56 or FBGA packaging variants.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A22), supporting both standard and page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume capability and status reporting via status register, data polling, or RY/BY# pin.
The flash array is organized into uniform 128-kbyte sectors, each individually erasable. Internal hardware ECC corrects single-bit errors on-the-fly during read, while the separate 1024-byte OTP array supports two lockable regions for secure configuration or calibration data storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 128 Mb (16 MB), organized as 1,048,576 × 16-bit words |
| Random access time | 90 ns at VCC = VIO; determines minimum CPU wait-state insertion for reliable read timing |
| Page access time | 15 ns; enables fast sequential reads within 32-byte aligned pages |
| Programming buffer | 512 bytes; allows burst programming of up to 256 words per command, reducing effective write latency |
| ECC capability | Internal hardware single-bit error correction; eliminates need for external ECC logic in boot ROM applications |
| Endurance & retention | 100,000 program/erase cycles and 20-year data retention at 85°C |
| Operating temperature | Industrial (–40°C to +85°C) or Industrial Plus (–40°C to +105°C); validated for extended thermal environments |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP), 14 mm × 20 mm, 0.5 mm pitch, JEDEC MO-141AC compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | Word-aligned address bus; A22 is MSB for 128 Mb (2²³ = 8,388,608 words) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports 16-bit microprocessor interface without byte-lane splitting |
| CE# | Chip enable | Active-low chip select; controls device power state and enables address/data bus contention management |
| OE# | Output enable | Active-low read strobe; gates output drivers independently of CE# for multiplexed bus sharing |
| WE# | Write enable | Active-low control for write/program/erase command latching and data capture |
| RY/BY# | Ready/Busy indicator | Open-drain active-low signal indicating internal operation progress; used for polling-free status monitoring |
| VCC | Core supply | 2.7–3.6 V single supply powering core logic, array, and EAC-no separate VPP required |
| VIO | I/O supply | 1.65–VCC versatile I/O voltage; decouples interface level from core voltage for mixed-voltage system integration |
Key Features
| Feature | Design Value |
|---|---|
| 65 nm MIRRORBIT™ Eclipse technology | Enables higher density and lower power vs. older floating-gate NOR, with improved endurance and retention |
| Asynchronous 32-byte page read | Reduces average read latency in XIP applications by minimizing address setup overhead for sequential instruction fetch |
| Advanced sector protection (ASP) | Supports volatile (lock-down on power-up) and non-volatile (permanent) locking per 128-kbyte sector for firmware partitioning |
| Common Flash Interface (CFI) | Standardized parameter table enabling automatic driver detection and configuration in bootloader or OS flash abstraction layers |
| Secure silicon region (OTP) | 1024-byte one-time-programmable array with dual lockable regions for immutable keys or calibration constants |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot firmware and real-time control code in programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Non-volatile XIP-capable boot memory providing deterministic 90 ns read access for hard real-time task initialization. Use Value: Uniform 128-kbyte sector erase enables safe field firmware updates without corrupting active runtime partitions. | Use Scenario: Hosting boot loader and safety-critical sensor fusion firmware in automotive camera or radar ECUs certified to AEC-Q100 Grade 2. IC Role / Device Role / Timing Role: AEC-Q100 qualified parallel NOR flash serving as primary boot source with hardware ECC for ASIL-B compliance. Use Value: Internal single-bit ECC eliminates external error-handling logic, reducing BOM cost and board area in space-constrained modules. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
Use Scenario: Storing diagnostic BIOS and FPGA configuration bitstreams in portable ultrasound or MRI subsystems requiring long-term data integrity. IC Role / Device Role / Timing Role: High-reliability firmware storage with 20-year data retention and 100,000 erase cycles for infrequent but mission-critical updates. Use Value: Separate 1024-byte OTP array securely stores calibration coefficients and serial IDs, preventing accidental overwrite during field service. | Use Scenario: Holding baseband processor configuration tables and protocol stack parameters in 4G/5G remote radio units exposed to wide ambient temperature swings. IC Role / Device Role / Timing Role: Industrial-plus grade (–40°C to +105°C) parallel flash supporting hot-swap-aware firmware update protocols. Use Value: Versatile I/O (1.65 V to VCC) allows direct interfacing with 1.8 V or 3.3 V FPGAs without level shifters, simplifying PCB routing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128P10TFI010 | Same density and architecture, but uses 64-ball LAE Fortified BGA (9 mm × 9 mm) instead of TSOP-56 | Better thermal performance and smaller footprint; requires PCB redesign for BGA assembly | Select for space-constrained or thermally demanding designs where reflow compatibility is confirmed |
| MX29GL128FHT2I-90G | 128 Mb parallel NOR from Macronix; 90 ns access, but no integrated hardware ECC or Versatile I/O | Lacks on-die ECC and flexible VIO-requires external error handling and level translation in mixed-voltage systems | Choose only if cost sensitivity outweighs reliability and design simplicity requirements |
Compared with S29GL128P10TFI010, the TSOP-56 package offers easier prototyping and legacy board compatibility; versus MX29GL128FHT2I-90G, the Infineon part delivers superior system-level robustness through integrated ECC and wider I/O voltage tolerance.
Availability
S29GL128S10DHB010 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL128S10DHB010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions for industrial and automotive markets.
The GL-S family targets embedded systems needing XIP-capable, high-endurance parallel NOR flash with integrated data integrity features-designed specifically for boot code, firmware, and secure configuration storage in safety-critical applications.
FAQ
Does S29GL128S10DHB010 support execute-in-place (XIP) operation?
Yes. The device supports true XIP operation with 90 ns random access time and 15 ns page-mode reads, enabling microprocessors to execute code directly from flash without copying to RAM. Its asynchronous interface and word-aligned addressing ensure deterministic timing for real-time interrupt response and instruction fetch latency.
What is the function of the Versatile I/O (VIO) feature?
VIO allows independent I/O voltage supply from 1.65 V to VCC, enabling direct interface with 1.8 V or 3.3 V processors without external level shifters. This reduces BOM count and signal integrity risk in mixed-voltage systems such as industrial gateways or automotive domain controllers.
How does the internal ECC work during read operations?
The hardware ECC engine automatically checks each 512-byte sector during read, correcting single-bit errors transparently before data reaches the bus. No software intervention or additional timing overhead is required, and corrected data is delivered with full 16-bit width intact-critical for boot ROM reliability.
Can the 1024-byte OTP array be reprogrammed after initial programming?
No. The OTP array is physically one-time programmable: once a bit is set to '0', it cannot be reset to '1'. Each of the two lockable regions can be permanently secured via dedicated lock bits, ensuring calibration data or cryptographic keys remain immutable throughout the product lifetime.
S29GL128S10DHB010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL128S10DHB010 FAQ
1.How can I place an order for S29GL128S10DHB010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128S10DHB010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128S10DHB010 reliable?
The price and inventory of S29GL128S10DHB010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10DHB010 is usually 5 days.
3.What payment methods are accepted for S29GL128S10DHB010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S10DHB010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL128S10DHB010?
S29GL128S10DHB010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL128S10DHB010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL128S10DHB010?
For technical support, including S29GL128S10DHB010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10DHB010 requirements.
6.How does Aetrix verify that S29GL128S10DHB010 is sourced from the original manufacturer or authorized distributors?
All S29GL128S10DHB010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10DHB010 meets industry standards.
7.What is the process for return or replacement of S29GL128S10DHB010?
All S29GL128S10DHB010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10DHB010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128S10DHB010 part is unused and in its original packaging.
Return procedure for S29GL128S10DHB010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL128S10DHB010 Tags
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STMicroelectronics
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