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Infineon Technologies S29GL128S10DHB013

Part No.:
S29GL128S10DHB013
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
64-LBGA
Datasheet:
AetrixS29GL128S10DHB013.pdf
Description:
IC FLASH 128MBIT CFI 64FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,694

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Product details

Overview

S29GL128S10DHB013 from Infineon is a 128 Mb (16 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction. Used in boot code storage for industrial microcontrollers requiring fast XIP execution and reliable non-volatile program retention.

For engineers reviewing the S29GL128S10DHB013 datasheet, S29GL128S10DHB013 pinout, S29GL128S10DHB013 application, or S29GL128S10DHB013 equivalent, key selection criteria include its 128-kbyte uniform sector erase granularity, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65–3.6 V), OTP array with dual lockable regions, and AEC-Q100 Grade 2/3 automotive qualification options.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A22), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages all program/erase operations-including suspend/resume-without external timing control.

The internal architecture includes dedicated erase voltage and programming voltage generators, status register with polling capability, RY/BY# pin for hardware status indication, and CFI-compliant parameter table for automatic software configuration. ECC logic operates transparently during read cycles and corrects single-bit errors in real time.

Key Specifications

Parameter Value and Actual Design Meaning
Memory density 128 Mb (16 MB), organized as 1,048,576 × 16-bit words - supports full firmware image storage for mid-tier MCUs.
Access time 90 ns random access (VCC = VIO), 15 ns page access - enables low-latency XIP execution without cache penalty.
Write buffer 512-byte (256-word) buffer - reduces effective programming time by >3× vs. byte-wise writes.
ECC On-the-fly single-bit error correction - eliminates need for external ECC logic in safety-critical boot memory.
Endurance & retention 100,000 program/erase cycles; 20-year data retention - meets long-life requirements for industrial controllers.
Operating temperature –40°C to +105°C (Industrial Plus / AEC-Q100 Grade 2) - validated for under-hood and factory-floor deployment.
Supply range Single 2.7–3.6 V VCC; VIO independently configurable 1.65–3.6 V - simplifies mixed-voltage system integration.

Pinout & Package

Package: 56-pin TSOP (Type I, 14 mm × 20 mm, 0.55 mm pitch). Pin-compatible with industry-standard parallel NOR footprint.

Pin/Terminal Circuit Role Design Meaning
A0–A22 Address inputs 23-bit address bus; A22 is MSB for 128 Mb (2²³ = 8,388,608 words × 2 bytes).
DQ0–DQ15 Data I/O 16-bit bidirectional data bus; supports byte/word writes and reads per JEDEC standard.
CE# Chip enable Active-low chip select; controls device power state and enables multi-chip addressing.
OE# Output enable Active-low read strobe; gates output drivers without affecting internal state.
WE# Write enable Active-low write strobe; initiates command latching and embedded program/erase sequences.
RY/BY# Ready/Busy indicator Open-drain output; low during active program/erase, high when operation complete or idle.
RESET# Hardware reset Active-low asynchronous reset; forces device into reading state and aborts pending operations.
WP# Write protect Hardware sector protection override; disables program/erase when asserted low.

Key Features

Feature Design Value
65 nm MIRRORBIT™ Eclipse technology Enables higher density and lower power vs. legacy floating-gate NOR, with proven reliability at 100k cycles.
Asynchronous 32-byte page read Reduces average read latency for sequential instruction fetch by limiting address setup to first word per page.
Advanced sector protection (ASP) Per-sector volatile/non-volatile lock bits allow runtime- or factory-configurable firmware partitioning.
1024-byte OTP array with dual locks Supports secure key storage and immutable calibration data; each 512-byte region independently lockable.
Common Flash Interface (CFI) Enables automatic driver initialization via standardized query mode - eliminates hard-coded timing constants.

Applications

Industrial PLC Firmware Storage Automotive ADAS Boot Memory

Use Scenario: Storing bootloader and safety-critical firmware in programmable logic controllers deployed in factory automation environments.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with deterministic 90 ns access.

Use Value: Uniform 128-kbyte sectors enable atomic firmware updates; ECC ensures integrity of safety routines across 20-year service life.

Use Scenario: Holding boot code and configuration data for radar ECU microcontrollers operating in engine compartments.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified parallel NOR flash serving as primary boot source for ASIL-B systems.

Use Value: –40°C to +105°C operation and 100k-cycle endurance meet automotive thermal and longevity requirements.

Medical Imaging System BIOS Telecom Base Station Configuration

Use Scenario: Hosting BIOS and FPGA configuration bitstreams in portable ultrasound devices requiring regulatory-compliant data retention.

IC Role / Device Role / Timing Role: Secure, field-upgradable firmware repository with OTP-protected calibration parameters.

Use Value: Dual-lock OTP regions store cryptographic keys and sensor calibration data separately, preventing accidental overwrite.

Use Scenario: Storing FPGA configuration images and protocol stack binaries in 5G baseband units with hot-swap capability.

IC Role / Device Role / Timing Role: High-reliability parallel flash supporting rapid reconfiguration via 512-byte buffered writes (1.5 MBps).

Use Value: Page-mode read and suspend/resume commands allow background firmware updates without interrupting RF processing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part Technical Difference Application Difference Selection Advice
S29GL128P10TFI010 Same density and core specs, but uses 64-ball LAE FBGA (9 mm × 9 mm); lacks Versatile I/O (VIO fixed to VCC). Preferred for space-constrained PCBs where BGA routing is acceptable and I/O voltage flexibility is unnecessary. Select when board layout favors compact BGA and system VIO matches VCC.
MX29GL128FPTI-90G Macronix part; 90 ns access, same 128 Mb density, but no integrated ECC and only 10k erase cycles. Suitable for cost-sensitive consumer applications where ECC and endurance are not safety-critical. Choose only if ECC and 100k-cycle endurance are not required and BOM cost is primary constraint.

Compared with S29GL128P10TFI010, this TSOP variant offers superior I/O voltage flexibility and identical ECC/sector protection; versus MX29GL128FPTI-90G, it delivers 10× endurance and hardware ECC-critical for industrial and automotive firmware integrity.

Availability

S29GL128S10DHB013 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply and long-term lifecycle support.

Supply support for S29GL128S10DHB013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive, and industrial control ICs, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.

The GL-S family targets high-reliability embedded systems needing fast, secure, and long-life parallel NOR flash for boot code and firmware-designed specifically for XIP-capable microcontrollers in harsh environments.

FAQ

Is S29GL128S10DHB013 pin-compatible with earlier S29GLxxxN or S29GLxxxP series?

No. While functionally similar, S29GL128S10DHB013 uses updated command sets and timing parameters. Pinout matches S29GL128SxxDHB variants but differs from N/P generations in RESET# behavior and CFI query structure. Migration requires firmware validation and timing adjustment.

Does the 512-byte write buffer support partial-page programming?

Yes. The buffer accepts up to 512 bytes in any alignment, but programming commits only full 32-byte pages. Partial writes within a page require buffering and coalescing by host firmware before issuing the final program command.

How is the OTP array accessed and secured?

The 1024-byte OTP region resides at fixed address 0x00000000 and is accessed via standard read/write commands after unlocking via CFI-defined security sequence. Each 512-byte subregion has independent lock bits set via dedicated command; once locked, they cannot be reset.

What failure modes does the internal ECC detect and correct?

The hardware ECC detects and corrects all single-bit errors per 512-byte sector during read operations. It reports uncorrectable multi-bit errors via status register bit 5 (ECC_FAIL) and asserts RY/BY# low until cleared by host software using the appropriate status-clear command.

S29GL128S10DHB013 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-S
Package/Case:
64-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
-
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR (SLC)
Memory Size:
128Mbit
Memory Organization:
16M x 8
Memory Interface:
CFI
Clock Frequency:
-
Write Cycle Time - Word, Page:
60ns
Access Time:
100 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
64-FBGA (9x9)

S29GL128S10DHB013 FAQ

1.How can I place an order for S29GL128S10DHB013 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL128S10DHB013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL128S10DHB013 reliable?

The price and inventory of S29GL128S10DHB013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10DHB013 is usually 5 days.

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S29GL128S10DHB013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL128S10DHB013 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL128S10DHB013?

For technical support, including S29GL128S10DHB013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10DHB013 requirements.

6.How does Aetrix verify that S29GL128S10DHB013 is sourced from the original manufacturer or authorized distributors?

All S29GL128S10DHB013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10DHB013 meets industry standards.

7.What is the process for return or replacement of S29GL128S10DHB013?

All S29GL128S10DHB013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10DHB013, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL128S10DHB013 part is unused and in its original packaging.

Return procedure for S29GL128S10DHB013:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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