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Infineon Technologies S29GL128S10DHB020
- Part No.:
- S29GL128S10DHB020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL128S10DHB020.pdf
- Description:
- IC FLASH 128MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:600
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Product details
Overview
S29GL128S10DHB020 from Infineon is a 128 Mb (16 MB), 3.0 V core, parallel-interface MIRRORBIT™ Eclipse flash memory with ×16 data bus, 90 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C), used for code storage and XIP execution in embedded microcontroller systems.
For engineers reviewing the S29GL128S10DHB020 datasheet, S29GL128S10DHB020 pinout, S29GL128S10DHB020 application, or S29GL128S10DHB020 equivalent, key selection criteria include 512-byte write buffer throughput (1.5 MBps), uniform 128-kbyte sector erase, hardware ECC for single-bit correction, versatile I/O (1.65 V to VCC), and AEC-Q100 Grade 3 qualification support.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A22), supports both standard and page-mode reads, and uses internal embedded algorithms for program/erase-eliminating host-side timing control. Its dual-voltage I/O (VIO = 1.65 V to VCC) enables interoperability with mixed-voltage SoCs.
The on-die ECC engine performs real-time single-bit error correction during read operations and reports status via dedicated ECC status address space offset (ASO). Sector protection includes volatile lock bits and non-volatile ASP configuration, while the 1024-byte OTP array provides secure boot code storage with two independently lockable regions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 128 Mb (16 MB); supports full firmware image storage for mid-tier MCUs |
| Interface type | Asynchronous parallel ×16; eliminates need for external timing logic or clock routing |
| Random access time | 90 ns at VCC = VIO; meets real-time interrupt latency requirements in safety-critical boot paths |
| Page access time | 15 ns; enables burst instruction fetch within same 32-byte page for XIP performance |
| Write buffer size | 512 bytes; reduces average programming time by >70% vs. single-word writes |
| ECC capability | Hardware single-bit correction; prevents silent data corruption without software overhead |
| Endurance & retention | 100,000 program/erase cycles / 20-year data retention; qualified for industrial lifecycle deployments |
Pinout & Package
Package: 56-pin TSOP (Type I, 400 mil width), JEDEC MO-141AC compliant, lead-free and RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | Word-aligned addressing (23-bit); A22 = MSB for 128 Mb capacity |
| DQ0–DQ15 | Data I/O | Bi-directional ×16 bus; supports 16-bit MCU interface without data multiplexing |
| CE# | Chip enable | Active-low device select; enables partial memory mapping in multi-chip systems |
| OE# | Output enable | Controls data bus drivers during read; allows shared bus arbitration |
| WE# | Write enable | Initiates write/program cycle; latches command sequences on rising edge |
| RY/BY# | Ready/Busy output | Open-drain status indicator; signals completion of embedded erase/program operations |
| RESET# | Hardware reset | Resets internal state machine and aborts ongoing operations; required for power-on initialization |
| VCC | Core supply | 3.0 V ±10%; powers core logic and charge pumps for erase/program |
| VIO | I/O supply | 1.65 V to VCC; decouples interface voltage from core, enabling mixed-signal SoC integration |
Key Features
| Feature | Design Value |
|---|---|
| 65 nm MIRRORBIT™ Eclipse process | Enables higher density and lower active current (60 mA read @ 5 MHz) vs. legacy 90 nm flash |
| Asynchronous page-mode read | Delivers 15 ns access for sequential 32-byte aligned reads-critical for deterministic XIP execution |
| Embedded Algorithm Controller (EAC) | Executes full program/erase internally; relieves host CPU of timing-critical state management |
| Advanced Sector Protection (ASP) | Supports per-sector volatile/non-volatile locking-prevents accidental firmware overwrite in field-upgrade scenarios |
| Secure OTP array | 1024-byte one-time-programmable region with dual lock bits; stores immutable root keys or calibration data |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated gauge graphics, boot loader, and OTA update staging area in AEC-Q100 Grade 3 instrument clusters. IC Role / Device Role / Timing Role: Non-volatile code/data storage with XIP capability and hardware ECC for ASIL-B functional safety compliance. Use Value: 20-year data retention and 100K endurance ensure reliability over vehicle lifetime without refresh cycles. | Use Scenario: Holding firmware, configuration tables, and recipe data in DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: Parallel boot memory mapped to ARM Cortex-M7 or RISC-V host; supports deterministic <90 ns interrupt vector fetch. Use Value: Versatile I/O (1.65 V to 3.3 V) interfaces directly with 1.8 V or 3.3 V I/O domains without level shifters. |
| Medical Diagnostic Imaging Boot | Avionics Display System |
Use Scenario: Secure boot image storage for FPGA configuration and real-time DSP firmware in ultrasound or MRI subsystems. IC Role / Device Role / Timing Role: Primary boot device with OTP-locked secure boot keys and ECC-protected runtime code execution. Use Value: Hardware ECC prevents latent bit flips in radiation-prone environments; certified for industrial temp range (–40°C to +85°C). | Use Scenario: Storing display firmware, font assets, and aircraft parameter lookup tables in DO-254-certified cockpit displays. IC Role / Device Role / Timing Role: High-reliability parallel flash with sector protection to prevent inadvertent reprogramming during in-flight updates. Use Value: Uniform 128-kbyte sectors simplify BOM-controlled firmware partitioning and field update validation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128P10TFI020 | Same density and timing, but 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP option | Preferred for space-constrained PCBs where board area is critical and thermal profile permits BGA reflow | Select when footprint reduction outweighs manual rework constraints of BGA assembly |
| MX29GL128FPTI-90G | Macronix part; 90 ns access, but lacks hardware ECC and OTP array; CFI-compatible command set | Suitable for cost-sensitive consumer applications where ECC is handled in software or not required | Choose only if system-level ECC is implemented externally and OTP security is unnecessary |
Compared with S29GL128P10TFI020, this TSOP variant offers easier prototyping and rework; versus MX29GL128FPTI-90G, it adds silicon-level ECC and secure OTP-critical for industrial and automotive firmware integrity.
Availability
S29GL128S10DHB020 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, and medical imaging systems requiring stable component supply across extended product lifecycles.
Supply support for S29GL128S10DHB020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader focused on power systems, automotive electronics, and security solutions, with global manufacturing and R&D infrastructure.
The GL-S family targets high-reliability embedded systems needing fast XIP-capable flash with integrated data integrity features-designed specifically for automotive, industrial, and medical applications demanding AEC-Q100 or extended temperature operation.
FAQ
What is the maximum operating frequency supported by S29GL128S10DHB020?
The device does not use a clock signal-it operates asynchronously. Its performance is defined by access times: 90 ns random access and 15 ns page access under VCC = VIO conditions. Bus timing depends on host controller setup/hold margins, not internal clock frequency.
Does S29GL128S10DHB020 support 1.8 V I/O operation?
Yes. The versatile I/O feature allows VIO from 1.65 V to VCC. With VCC = 3.0 V, VIO can be set to 1.8 V, enabling direct interface with 1.8 V logic families without level-shifting circuitry.
How is the 1024-byte OTP array protected against accidental programming?
The OTP array has two independent lock bits-one volatile (cleared on power cycle) and one non-volatile (permanent once programmed). Both must be unasserted to allow programming; either lock bit set disables further writes to its respective 512-byte region.
Can S29GL128S10DHB020 replace older S29GL128N devices in existing designs?
Yes, with minor layout review. Pinout is identical in 56-pin TSOP, and command sets are backward compatible. However, GL-S adds hardware ECC and enhanced sector protection-existing firmware may require minor updates to leverage new status register bits and OTP access commands.
S29GL128S10DHB020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL128S10DHB020 FAQ
1.How can I place an order for S29GL128S10DHB020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128S10DHB020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128S10DHB020 reliable?
The price and inventory of S29GL128S10DHB020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10DHB020 is usually 5 days.
3.What payment methods are accepted for S29GL128S10DHB020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S10DHB020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL128S10DHB020?
S29GL128S10DHB020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL128S10DHB020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL128S10DHB020?
For technical support, including S29GL128S10DHB020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10DHB020 requirements.
6.How does Aetrix verify that S29GL128S10DHB020 is sourced from the original manufacturer or authorized distributors?
All S29GL128S10DHB020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10DHB020 meets industry standards.
7.What is the process for return or replacement of S29GL128S10DHB020?
All S29GL128S10DHB020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10DHB020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128S10DHB020 part is unused and in its original packaging.
Return procedure for S29GL128S10DHB020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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