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Infineon Technologies S29GL128S10DHI010
- Part No.:
- S29GL128S10DHI010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL128S10DHI010.pdf
- Description:
- IC FLASH 128MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,300
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Product details
Overview
S29GL128S10DHI010 from Infineon is a 128 Mb (16 MB), 3.0 V core, parallel-interface MIRRORBIT™ Eclipse flash memory with ×16 data bus, 90 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C), used for embedded code storage and firmware boot in microcontroller-based systems.
For engineers reviewing the S29GL128S10DHI010 datasheet, S29GL128S10DHI010 pinout, S29GL128S10DHI010 application, or S29GL128S10DHI010 equivalent, this device supports asynchronous XIP-capable read, 512-byte buffer programming, hardware ECC, uniform 128-kB sector erase, and versatile I/O (1.65 V to VCC) - critical for automotive and industrial firmware storage design.
Technical Context
The S29GL128S10DHI010 implements an asynchronous parallel interface with word-aligned addressing (A0–A22), 32-byte page reads, and embedded algorithm controller (EAC) for autonomous program/erase operations. It integrates internal hardware ECC for single-bit error correction and supports status register polling, data polling, and RY/BY# pin for operation monitoring.
It features Advanced Sector Protection (ASP) with volatile/non-volatile lock options per sector, a dedicated 1024-byte OTP array with two lockable regions, and Common Flash Interface (CFI) compliance for host software compatibility. Operating voltage range is 2.7 V to 3.6 V for VCC and 1.65 V to VCC for VIO.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 128 Mb (16 MB), enabling full firmware image storage for mid-complexity MCUs |
| Random access time (tACC) | 90 ns at VCC = VIO, meeting real-time boot latency requirements |
| Page access time (tPACC) | 15 ns, accelerating sequential instruction fetch in XIP mode |
| Programming buffer size | 512 bytes, reducing effective programming time by batching writes |
| Erase block size | Uniform 128 kB sectors, simplifying firmware update partitioning |
| Data retention | 20 years, ensuring long-term reliability in unpowered storage |
| Endurance | 100,000 program/erase cycles, supporting field firmware updates |
| Operating temperature | –40°C to +85°C (industrial grade), validated for extended ambient deployment |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint, compatible with legacy flash socket designs and automated PCB assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | 23-bit word address bus (A22 = MSB); A0–A3 select byte within 32-byte page |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports 1.65 V to VCC I/O voltage via VIO |
| CE# | Chip enable | Active-low chip select; enables device for read/write/erase when low |
| OE# | Output enable | Active-low control for output drivers during read operations |
| WE# | Write enable | Active-low strobe for write command latching and programming initiation |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active program/erase; high = ready, low = busy |
| RESET# | Hardware reset | Active-low asynchronous reset that halts ongoing operations and clears status |
| VCC | Core supply | 3.0 V nominal (2.7–3.6 V), powers core logic, EAC, and voltage generators |
| VIO | I/O supply | Independent I/O rail (1.65–VCC), enabling mixed-voltage system interfacing |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous page-mode read | 32-byte aligned page access with 15 ns intra-page timing, optimizing XIP execution speed |
| Hardware ECC engine | On-the-fly single-bit error correction without CPU overhead or external logic |
| 512-byte write buffer | Reduces average programming time by up to 4× vs. single-word programming |
| Uniform 128-kB sector architecture | Enables deterministic firmware update scheduling and wear leveling in bootloader code |
| Advanced Sector Protection (ASP) | Volatile and non-volatile locking per sector prevents accidental erase/write in production |
| Dedicated 1024-byte OTP array | Two independently lockable regions for secure key storage or calibration data |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot code and GUI assets for digital dashboards with AEC-Q100 compliance requirements. IC Role / Device Role / Timing Role: Non-volatile firmware storage with XIP-capable read for fast startup and deterministic interrupt response. Use Value: 90 ns random access and 15 ns page mode meet ASIL-B timing constraints for safety-critical boot sequences. |
Use Scenario: Holding field-upgradable ladder logic and configuration data in programmable logic controllers deployed in factory environments. IC Role / Device Role / Timing Role: High-reliability code/data storage with 100,000-cycle endurance and 20-year retention. Use Value: Uniform 128-kB sectors simplify firmware delta updates and reduce downtime during maintenance. |
| Medical Diagnostic Equipment Boot ROM | Networking Edge Router Configuration |
Use Scenario: Secure boot image storage in FDA-regulated imaging devices requiring traceable firmware integrity. IC Role / Device Role / Timing Role: Primary boot memory with hardware ECC and OTP-protected calibration constants. Use Value: Internal ECC ensures bit-error resilience without software intervention, meeting IEC 62304 data integrity requirements. |
Use Scenario: Persistent storage of routing tables, security certificates, and failover configurations in carrier-grade edge routers. IC Role / Device Role / Timing Role: Parallel flash for fast configuration reload after power loss or reboot. Use Value: Versatile I/O (1.65–3.6 V) interfaces directly with 1.8 V or 3.3 V SoC buses without level shifters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128S10TFI010 | Same die, 64-ball LAE Fortified BGA (9 mm × 9 mm), no TSOP package | Used where board space is constrained and BGA reflow is available | Select for compact, high-density layouts; requires BGA routing and rework capability |
| MX29GL128FPTI-90G | Macronix 128 Mb parallel NOR, 90 ns tACC, but lacks hardware ECC and OTP array | Lower-cost alternative where ECC is handled in software or not required | Choose only if external ECC management is acceptable and OTP security is unnecessary |
Compared with S29GL128S10DHI010, the TSOP-packaged Infineon variant offers superior reliability features (hardware ECC, OTP, ASP) over Macronix' MX29GL128F, while the LAE-BGA variant trades package form factor for identical functionality - making the DHI010 optimal for legacy-compatible, serviceable industrial designs.
Availability
S29GL128S10DHI010 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical diagnostic boot systems, and networking edge routers requiring stable component supply across extended product lifecycles.
Supply support for S29GL128S10DHI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and non-volatile memory solutions with global manufacturing and quality certification (IATF 16949, ISO 9001).
The GL-S family targets high-reliability embedded systems needing XIP-capable, high-endurance parallel NOR flash - designed specifically for automotive, industrial, and medical applications demanding long-term data integrity and AEC-Q100 compliance.
FAQ
Does S29GL128S10DHI010 support execute-in-place (XIP) operation?
Yes, it supports true XIP operation due to its fast 90 ns random access time and asynchronous page-mode read capability. The device delivers instructions directly to the processor without copying to RAM, enabling deterministic boot and real-time interrupt response in MCU-based systems.
What is the function of the VIO pin, and can it be tied to VCC?
VIO sets the I/O buffer voltage level (1.65 V to VCC) and may be tied to VCC for 3.3 V operation or to a lower rail (e.g., 1.8 V) for mixed-voltage interfacing. It must not float and must remain within specification during all operating modes to ensure signal integrity and timing compliance.
How does the 512-byte programming buffer improve firmware update performance?
The buffer allows up to 512 bytes to be loaded before initiating a single embedded program operation, reducing overhead from repeated command sequences. This cuts effective programming time by ~75% versus single-word writes, accelerating field firmware updates and reducing system downtime.
Is the OTP array accessible after permanent lock, and what happens on power cycle?
Once permanently locked via the OTP lock command, the 1024-byte OTP array becomes read-only and retains lock state across power cycles. Unlocking is impossible; only factory provisioning or one-time initialization during manufacturing is supported - ensuring cryptographic key or calibration data immutability.
S29GL128S10DHI010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL128S10DHI010 FAQ
1.How can I place an order for S29GL128S10DHI010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128S10DHI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128S10DHI010 reliable?
The price and inventory of S29GL128S10DHI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10DHI010 is usually 5 days.
3.What payment methods are accepted for S29GL128S10DHI010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S10DHI010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL128S10DHI010?
S29GL128S10DHI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL128S10DHI010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL128S10DHI010?
For technical support, including S29GL128S10DHI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10DHI010 requirements.
6.How does Aetrix verify that S29GL128S10DHI010 is sourced from the original manufacturer or authorized distributors?
All S29GL128S10DHI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10DHI010 meets industry standards.
7.What is the process for return or replacement of S29GL128S10DHI010?
All S29GL128S10DHI010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10DHI010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128S10DHI010 part is unused and in its original packaging.
Return procedure for S29GL128S10DHI010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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