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Infineon Technologies S29GL128S10DHI013
- Part No.:
- S29GL128S10DHI013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL128S10DHI013.pdf
- Description:
- IC FLASH 128MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,180
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Product details
Overview
S29GL128S10DHI013 from Infineon is a 128 Mb (16 MB), 3.0 V core, parallel-interface MIRRORBIT™ Eclipse flash memory with ×16 data bus, 90 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C), used for firmware storage and XIP execution in embedded controllers and networking equipment.
For engineers reviewing the S29GL128S10DHI013 datasheet, S29GL128S10DHI013 pinout, S29GL128S10DHI013 application, or S29GL128S10DHI013 equivalent, key selection criteria include 512-byte write buffer throughput (1.5 MBps), internal single-bit ECC, uniform 128-kbyte sector erase, ASP protection, and Versatile I/O support (1.65 V to VCC).
Technical Context
This device implements asynchronous parallel NOR flash architecture with hardware-based ECC correction and embedded algorithm controller (EAC) managing program/erase operations. It supports page-mode reads (32-byte aligned, 15 ns subsequent access) and buffer programming of up to 512 bytes per command, enabling efficient firmware updates.
The GL-S family uses 65-nm MIRRORBIT™ Eclipse process and integrates CFI-compliant parameter tables, status register polling, RY/BY# signaling, and suspend/resume capability for both program and erase - critical for real-time system responsiveness during non-volatile memory operations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 128 Mb (16 MB); supports full firmware image storage for mid-tier microcontrollers and network processors. |
| Random Access Time | 90 ns at VCC = VIO; enables direct XIP execution without external cache penalty in real-time systems. |
| Page Access Time | 15 ns; allows rapid sequential reads within 32-byte pages, improving boot code fetch efficiency. |
| Write Buffer Size | 512 bytes; reduces effective programming time by batching writes, critical for field firmware upgrades. |
| ECC Support | Internal hardware single-bit error correction; eliminates need for external ECC logic in safety-critical designs. |
| Endurance & Retention | 100,000 program/erase cycles and 20-year data retention; meets long-lifecycle requirements for industrial gateways and automotive ECUs. |
| Operating Voltage | VCC = 2.7–3.6 V, VIO = 1.65–VCC; simplifies power design with flexible I/O rail compatibility. |
| Temperature Grade | Industrial (–40°C to +85°C); qualified for deployment in uncontrolled ambient environments like factory automation panels. |
Pinout & Package
Package: 56-pin TSOP (Type I, 14 mm × 20 mm, 0.5 mm pitch). Pinout validated per Infineon datasheet Rev. *U (2024-06-25), Section 12.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | 23-bit address bus supporting 128 Mb density (2²³ × 16 bits); A22 is MSB for word-aligned addressing. |
| DQ0–DQ15 | Data I/O bus | 16-bit bidirectional data path; supports simultaneous read/write of one word (2 bytes) per cycle. |
| CE# | Chip enable | Active-low chip select; controls device activation and power state; tCE = 90 ns max determines minimum bus turnaround. |
| OE# | Output enable | Active-low read strobe; gates output drivers; tOE = 25 ns defines data hold timing relative to clockless interface. |
| WE# | Write enable | Active-low write control; initiates program/erase commands; synchronized with address/data setup/hold windows. |
| RY/BY# | Ready/Busy indicator | Open-drain status signal; low during embedded operations; enables polling-free interrupt-driven firmware flow control. |
| RESET# | Hardware reset | Active-low asynchronous reset; terminates ongoing program/erase and returns device to read mode within 100 µs. |
| VCC / VIO / VSS | Power terminals | VCC (2.7–3.6 V) powers core logic; VIO (1.65–VCC) sets I/O voltage; separate VSS pins reduce noise coupling in high-speed parallel buses. |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous Page Read | 32-byte aligned page access with 15 ns subsequent word latency improves boot-time instruction fetch speed over standard NOR. |
| 512-Byte Write Buffer | Enables single-command programming of up to 512 bytes, reducing host CPU overhead and bus arbitration conflicts during firmware update. |
| Hardware ECC Engine | On-die single-bit error correction eliminates external ECC ICs and associated PCB area, BOM cost, and latency in safety-certified systems. |
| Advanced Sector Protection | Volatile and non-volatile lock bits per 128-kbyte sector allow runtime reconfiguration and permanent lockdown of bootloader regions. |
| Secure OTP Array | 1024-byte one-time-programmable space with two lockable regions stores cryptographic keys or calibration data immune to field reprogramming. |
| CFI Compliance | Standardized Common Flash Interface table enables automatic driver detection and configuration in Linux U-Boot and RTOS BSPs. |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing and executing boot code and real-time control firmware in programmable logic controllers deployed in factory floors with wide ambient temperature swings. IC Role / Device Role / Timing Role: Non-volatile XIP-capable flash memory providing deterministic 90 ns random read access for hard real-time task initialization. Use Value: Eliminates external SRAM caching requirement while meeting IEC 61131-3 cycle-time constraints via fast page-mode reads and hardware ECC reliability. | Use Scenario: Holding boot firmware and sensor calibration data for radar processing units in Level 2+ ADAS systems operating across –40°C to +105°C automotive grade 2 conditions. IC Role / Device Role / Timing Role: AEC-Q100 qualified parallel NOR flash serving as primary boot device with secure OTP for cryptographic key storage. Use Value: Meets ISO 26262 ASIL-B requirements through 100K-cycle endurance, 20-year retention, and hardware ECC for fault-tolerant startup sequences. |
| Networking Equipment Configuration | Medical Imaging System BIOS |
Use Scenario: Storing FPGA configuration bitstreams and protocol stack binaries in enterprise switches requiring field-upgradable firmware with rollback capability. IC Role / Device Role / Timing Role: Dual-sector protected flash enabling atomic firmware updates using sector swap techniques without service interruption. Use Value: Advanced sector protection (ASP) and suspend/resume commands allow safe background updates while maintaining packet forwarding latency under 10 µs. | Use Scenario: Hosting BIOS and diagnostic self-test routines in portable ultrasound machines where data integrity and long-term reliability are mandated by FDA 510(k) clearance. IC Role / Device Role / Timing Role: Industrial-grade flash with 20-year data retention and internal ECC ensuring consistent boot behavior after 10+ years of clinical deployment. Use Value: OTP array secures device-specific calibration coefficients against tampering, satisfying IEC 62304 software lifecycle requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128P10TFI010 | Same density and core voltage but uses 64-ball LAE FBGA (9 mm × 9 mm); lacks Versatile I/O (VIO fixed to VCC). | Preferred for space-constrained PCBs where BGA routing is feasible and I/O voltage flexibility is unnecessary. | Select when board layout favors compact BGA and system uses single 3.3 V rail for both core and I/O. |
| MX29GL128FPTI-90G | Micron part with identical 128 Mb density, 90 ns access, and TSOP package; no integrated ECC or OTP array. | Requires external ECC logic and separate secure storage for keys; lower BOM cost but higher system integration effort. | Choose for cost-sensitive applications where ECC is handled in software or external ASIC and security requirements are minimal. |
Compared with S29GL128P10TFI010 and MX29GL128FPTI-90G, the S29GL128S10DHI013 uniquely combines TSOP compatibility, Versatile I/O, on-die ECC, and OTP in a single industrial-grade package-reducing design complexity for firmware-critical embedded systems.
Availability
S29GL128S10DHI013 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and networking equipment configuration requiring stable component supply across extended product lifecycles.
Supply support for S29GL128S10DHI013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and automotive qualification expertise.
The GL-S family targets embedded systems needing XIP-capable, high-endurance flash with integrated data integrity features - designed specifically for industrial control, automotive ECU, and telecom infrastructure applications.
FAQ
Is S29GL128S10DHI013 pin-compatible with earlier S29GL128N or S29GL128P variants?
No. S29GL128S10DHI013 uses a 56-pin TSOP package with updated pin assignments for Versatile I/O and enhanced status signaling. It is not mechanically or electrically pin-compatible with S29GL128N (48-pin TSOP) or S29GL128P (64-ball FBGA). Board redesign is required for migration.
Does this device support execute-in-place (XIP) operation without external buffering?
Yes. With 90 ns random access time and page-mode read capability, S29GL128S10DHI013 enables true XIP execution directly from flash for ARM Cortex-M or RISC-V cores. No external SRAM cache is needed for deterministic boot or ISR vector fetch, provided bus timing margins are met.
What is the role of the 1024-byte OTP array, and can it be reprogrammed?
The OTP array provides 1024 bytes of one-time-programmable memory split into two independently lockable regions. Once programmed and locked, contents cannot be erased or rewritten. It is intended for immutable data such as cryptographic keys, calibration constants, or device serial numbers in regulated medical or automotive systems.
How does the Versatile I/O feature affect system power design?
Versatile I/O allows VIO to operate independently from VCC across 1.65 V to VCC, enabling direct interfacing with 1.8 V, 2.5 V, or 3.3 V logic families without level shifters. This simplifies mixed-voltage board design and reduces component count, especially when connecting to FPGAs or low-voltage microcontrollers.
S29GL128S10DHI013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL128S10DHI013 FAQ
1.How can I place an order for S29GL128S10DHI013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128S10DHI013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128S10DHI013 reliable?
The price and inventory of S29GL128S10DHI013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10DHI013 is usually 5 days.
3.What payment methods are accepted for S29GL128S10DHI013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S10DHI013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL128S10DHI013?
S29GL128S10DHI013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL128S10DHI013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL128S10DHI013?
For technical support, including S29GL128S10DHI013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10DHI013 requirements.
6.How does Aetrix verify that S29GL128S10DHI013 is sourced from the original manufacturer or authorized distributors?
All S29GL128S10DHI013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10DHI013 meets industry standards.
7.What is the process for return or replacement of S29GL128S10DHI013?
All S29GL128S10DHI013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10DHI013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128S10DHI013 part is unused and in its original packaging.
Return procedure for S29GL128S10DHI013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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