Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL128S10DHI020

Name: S29GL128S10DHI020
Brand: Infineon Technologies
SKU: S29GL128S10DHI020
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: S29GL128S10DHI020

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL128S10DHI020.pdf

Description:: IC FLASH 128MBIT PARALLEL 64FBGA

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:4,400

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

S29GL128S10DHI020 from Infineon is a 128 Mb (16 MB), 3.0 V core, parallel-interface MIRRORBIT™ Eclipse flash memory with ×16 data bus, 90 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C). It integrates hardware ECC for single-bit error correction, 128-kbyte uniform sector erase, and a 512-byte write buffer-enabling fast embedded code storage and firmware update in microcontroller boot loaders.

For engineers reviewing the S29GL128S10DHI020 datasheet, S29GL128S10DHI020 pinout, S29GL128S10DHI020 application, or S29GL128S10DHI020 equivalent, this device supports XIP-capable read operations, Versatile I/O (1.65 V to VCC), suspend/resume during program/erase, OTP array with dual lockable regions, and CFI-compliant software interface for system-level flash management.

Technical Context

The S29GL128S10DHI020 implements an asynchronous parallel interface with word-aligned addressing (A0–A22), supporting both standard and page-mode reads. Its embedded algorithm controller (EAC) executes autonomous program and erase sequences without host CPU intervention, while internal voltage generators supply precise PGM and erase voltages.

Hardware ECC operates transparently during read cycles, correcting single-bit errors on-the-fly using dedicated logic and spare bits per sector. Sector protection is configurable via volatile (SRAM-based) and non-volatile (flash-based) methods, and the 1024-byte OTP array provides secure storage for calibration data or device identifiers.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	128 Mb (16 MB), organized as 1,048,576 × 16-bit words - sufficient for full bootloader + firmware image in resource-constrained MCU systems.
Random access time	90 ns at VCC = VIO - enables direct execution (XIP) from flash with minimal CPU stall cycles in real-time applications.
Page access time	15 ns - accelerates sequential instruction fetch within 32-byte aligned pages, improving effective throughput over standard reads.
Write buffer size	512 bytes (256 words) - reduces total programming time by batching writes, critical for field firmware updates with limited downtime.
ECC capability	Single-bit error correction per 512-byte sector - ensures data integrity without software overhead in long-life industrial deployments.
Endurance & retention	100,000 program/erase cycles and 20-year data retention - validated for automotive and industrial control systems requiring multi-decade reliability.
Operating voltage	VCC = 2.7 V to 3.6 V; VIO = 1.65 V to VCC - allows interoperability with mixed-voltage SoCs and low-power microcontrollers.
Temperature grade	Industrial (–40°C to +85°C) - qualified for use in factory automation, motor drives, and outdoor edge nodes without derating.

Pinout & Package

Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141B footprint. Compatible with automated SMT assembly and reflow profiles per J-STD-020.

Pin/Terminal	Circuit Role	Design Meaning
A0–A22	Address inputs	23-bit word address bus (A0 LSB, A22 MSB); A22 = 1 for top 128-kB sector - defines 1,048,576-word address space.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports high-speed page reads and buffer programming with no external latch required.
CE#	Chip enable	Active-low chip select; controls device power state and enables command decoding - essential for multi-flash memory mapping.
OE#	Output enable	Active-low read strobe; gates output drivers during read cycles - used for timing-critical XIP or burst read synchronization.
WE#	Write enable	Active-low write strobe; initiates command latching and embedded program/erase algorithms - must meet tCE/tWE setup/hold timing.
RY/BY#	Ready/Busy indicator	Open-drain status output; low during active program/erase - enables polling-free interrupt-driven flash management in RTOS environments.
RESET#	Hardware reset	Active-low asynchronous reset; forces device into known state and aborts ongoing operations - critical for safe recovery after brown-out.
WP#	Write protect	Active-low hardware sector lock; disables program/erase on protected sectors independent of software commands - prevents accidental corruption.

Key Features

Feature	Design Value
Asynchronous page-mode read	32-byte aligned page access with 15 ns cycle time - cuts instruction fetch latency by >80% vs. random access in boot code execution.
Embedded Algorithm Controller (EAC)	Fully autonomous program/erase sequencing - eliminates host CPU involvement and simplifies driver development for bare-metal or RTOS firmware.
Versatile I/O (VIO)	Independent VIO supply (1.65 V to VCC) - enables direct interfacing with 1.8 V or 3.3 V logic without level shifters in heterogeneous SoC designs.
Advanced Sector Protection (ASP)	Volatile and non-volatile locking per 128-kB sector - supports secure boot partitioning and field-upgrade-safe firmware layout.
Secure OTP array	1024-byte one-time-programmable region with two independently lockable sections - stores cryptographic keys or unique device IDs with irreversible write protection.
Common Flash Interface (CFI)	Standardized parameter table accessible via read commands - enables generic flash drivers across multiple vendors and densities in scalable BOM strategies.

Applications

Industrial PLC Firmware Storage

Automotive ECU Boot Memory

Use Scenario: Storing boot code and safety-critical firmware in programmable logic controllers operating in harsh factory environments.

IC Role / Device Role / Timing Role: Non-volatile XIP-capable code storage with deterministic 90 ns read latency and hardware ECC for SIL-2 compliance.

Use Value: Eliminates need for external RAM copy during boot, reduces BOM count, and ensures firmware integrity over 20+ years of operation.

Use Scenario: Holding bootloader and diagnostic firmware in engine control units subject to AEC-Q100 Grade 3 qualification.

IC Role / Device Role / Timing Role: Primary boot flash with 100,000-cycle endurance and –40°C to +85°C operation - meets automotive functional safety requirements.

Use Value: Supports secure firmware updates via CAN FD without compromising runtime code execution or violating ASIL-B timing constraints.

Medical Imaging System Configuration

Network Router Boot Image

Use Scenario: Retaining calibration tables, sensor profiles, and regulatory configuration data in portable ultrasound and MRI subsystems.

IC Role / Device Role / Timing Role: OTP-backed secure storage with dual-lockable regions - isolates factory-set parameters from field-modifiable settings.

Use Value: Prevents unauthorized modification of FDA-cleared calibration data while enabling authorized service updates via authenticated commands.

Use Scenario: Hosting primary boot image and fail-safe recovery firmware in enterprise-grade Layer 3 switches and SD-WAN appliances.

IC Role / Device Role / Timing Role: High-reliability parallel flash with suspend/resume during erase - enables zero-downtime firmware upgrades under live traffic.

Use Value: Reduces maintenance window duration by >65% compared to legacy serial NOR, with guaranteed 20-year data retention for unattended deployments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL128P10TFI010	Same density and architecture but uses 64-ball LAE Fortified BGA (9 mm × 9 mm); lacks OTP array and ASP non-volatile lock mode.	Preferred for space-constrained PCBs where TSOP footprint is prohibitive; unsuitable for secure boot requiring OTP key storage.	Select when board area is critical and security features are handled externally; verify thermal profile compatibility with BGA reflow.
MX29GL128FHT2I-90G	Micron 128 Mb parallel NOR with 90 ns access, but no integrated ECC, no OTP, and only volatile sector protection.	Lower-cost option for non-safety-critical consumer gateways; requires external ECC or software mitigation for bit-rot resilience.	Choose for cost-sensitive, short-lifecycle products where 20-year retention and hardware ECC are not mandated.

Compared with S29GL128P10TFI010 and MX29GL128FHT2I-90G, the S29GL128S10DHI020 uniquely delivers OTP-based secure storage, non-volatile sector locking, and transparent hardware ECC - making it the only choice for certified industrial and automotive boot memory where data integrity and tamper resistance are design requirements.

Availability

S29GL128S10DHI020 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ECUs, medical imaging subsystems, and network infrastructure requiring stable component supply across extended product lifecycles.

Supply support for S29GL128S10DHI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D and manufacturing infrastructure.

The GL-S family targets high-reliability embedded systems requiring XIP-capable flash with industrial/automotive qualification, combining speed, density, and data integrity features absent in legacy parallel NOR devices.

FAQ

Does S29GL128S10DHI020 support execute-in-place (XIP) operation?

Yes. The device supports true XIP with 90 ns random access time and 15 ns page-mode read, enabling direct CPU instruction fetch without copying to RAM. Its asynchronous interface and deterministic timing comply with ARM Cortex-M and Power Architecture boot requirements, and the embedded algorithm controller ensures seamless background erase without stalling execution.

What is the function of the Versatile I/O (VIO) feature?

VIO allows independent voltage supply (1.65 V to VCC) to the I/O buffers, decoupling logic-level compatibility from core voltage. This enables direct connection to 1.8 V FPGA I/O banks or 3.3 V microcontroller buses without external level shifters, reducing signal integrity risk and PCB layer count in mixed-voltage designs.

How does the hardware ECC work during read operations?

Internal ECC logic automatically checks each 512-byte sector during read, correcting single-bit errors in real time using spare bits stored alongside user data. No software intervention or additional read cycles are required, and corrected data is delivered transparently to the host bus - critical for maintaining uptime in always-on industrial controllers.

Can the OTP array be reprogrammed after initial programming?

No. The 1024-byte OTP array is permanently programmable once; each of its two lockable regions can be individually secured via fuse blow command. After locking, no further writes are possible - ensuring cryptographic keys or calibration constants remain immutable throughout the device's operational life.

S29GL128S10DHI020 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 128Mbit

Memory Organization:: 8M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL128S10DHI020 FAQ

1.How can I place an order for S29GL128S10DHI020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL128S10DHI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL128S10DHI020 reliable?

The price and inventory of S29GL128S10DHI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10DHI020 is usually 5 days.

3.What payment methods are accepted for S29GL128S10DHI020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S10DHI020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL128S10DHI020?

S29GL128S10DHI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL128S10DHI020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL128S10DHI020?

For technical support, including S29GL128S10DHI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10DHI020 requirements.

6.How does Aetrix verify that S29GL128S10DHI020 is sourced from the original manufacturer or authorized distributors?

All S29GL128S10DHI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10DHI020 meets industry standards.

7.What is the process for return or replacement of S29GL128S10DHI020?

All S29GL128S10DHI020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10DHI020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL128S10DHI020 part is unused and in its original packaging.

Return procedure for S29GL128S10DHI020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

2026-08-11 LDO Regulator: Dropout Voltage, Noise, PSRR and Power Dissipation

LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…

2026-08-06 Conditional Access Module: CAM, CI/CI+ and DVB Security

Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…

2026-08-03 Electronic Component Obsolescence: EOL Risks, Replacement Options and Last-Time Buy Strategy

Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.