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Infineon Technologies S29GL128S10DHI023
- Part No.:
- S29GL128S10DHI023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL128S10DHI023.pdf
- Description:
- IC FLASH 128MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,381
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Product details
Overview
S29GL128S10DHI023 from Infineon is a 128 Mb (16 MB), 3.0 V core, parallel-interface MIRRORBIT™ Eclipse flash memory with ×16 data bus, 90 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C), used for XIP-capable firmware storage in microcontroller boot loaders and embedded systems requiring non-volatile code execution.
For engineers reviewing the S29GL128S10DHI023 datasheet, S29GL128S10DHI023 pinout, S29GL128S10DHI023 application, or S29GL128S10DHI023 equivalent, this device supports asynchronous read, sector erase, buffer programming up to 512 bytes, hardware ECC, and versatile I/O (1.65 V to VCC) - critical for legacy parallel NOR flash migration and industrial HMI firmware storage.
Technical Context
The S29GL128S10DHI023 implements an asynchronous parallel interface with word-aligned addressing (A0–A22), supporting both single-word and 32-byte page reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume capability and status reporting via RY/BY#, data polling, or status register.
It integrates internal hardware ECC for single-bit error correction and uses uniform 128-kbyte sectors with advanced sector protection (volatile/non-volatile lock). The device operates across VCC = 2.7–3.6 V and VIO = 1.65–VCC, enabling interoperability with mixed-voltage SoC interfaces without level shifters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 128 Mb (16 MB) - sufficient for full MCU boot image + configuration data in space-constrained industrial controllers |
| Random Access Time | 90 ns at VCC = VIO - enables direct XIP execution from flash without performance penalty in real-time firmware |
| Page Access Time | 15 ns - allows rapid sequential reads within 32-byte aligned pages, accelerating firmware initialization |
| Programming Buffer | 512 bytes - reduces effective programming time by batching writes, critical for field firmware updates |
| ECC Support | Internal hardware single-bit correction - eliminates need for external ECC logic in safety-critical applications |
| Endurance & Retention | 100,000 program/erase cycles / 20 years data retention - meets long-lifecycle requirements of industrial automation equipment |
| Operating Temp | –40°C to +85°C (Industrial grade) - validated for deployment in uncontrolled ambient environments |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-142AB footprint, compatible with legacy PCB layouts using parallel NOR flash.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address Inputs | Word-aligned address bus (23 pins); A22 is MSB for 128 Mb (2²³ × 16 bits) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte/word access per control signals |
| CE# | Chip Enable | Active-low chip select; controls device power state and command latching |
| OE# | Output Enable | Active-low read strobe; gates output drivers during read cycles |
| WE# | Write Enable | Active-low write strobe; initiates program/erase command sequences |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low = operation in progress, high = ready |
| WP# | Write Protect | Hardware sector protection enable; prevents accidental program/erase when asserted |
| VCC | Core Supply | 3.0 V core voltage (2.7–3.6 V range); powers logic, array, and EAC |
| VIO | I/O Supply | Independent I/O voltage (1.65–VCC); decouples interface voltage from core |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous Page Read | 32-byte aligned page access with 15 ns intra-page timing - accelerates firmware startup and interrupt vector fetches |
| 512-Byte Programming Buffer | Reduces average programming time by >60% vs. single-word writes - essential for OTA update efficiency |
| Hardware ECC Engine | Single-bit error correction performed transparently in silicon - removes software overhead and improves reliability |
| Versatile I/O Voltage | VIO range 1.65 V to VCC - eliminates external level shifters when interfacing with 1.8 V or 3.3 V host processors |
| Uniform 128-kB Sectors | 128 identically sized sectors simplify BOM management and firmware partitioning across product variants |
Applications
| Industrial HMI Boot Storage | Automotive Instrument Cluster Firmware |
|---|---|
Use Scenario: Storing boot loader and GUI firmware in panel-mounted HMIs deployed in factory environments with wide thermal swings. IC Role / Device Role / Timing Role: Non-volatile XIP-capable code storage with deterministic 90 ns read latency for real-time UI response. Use Value: Eliminates external RAM copy step during boot; leverages 20-year data retention for maintenance-free operation over equipment lifetime. | Use Scenario: Holding calibrated display firmware and driver logic in automotive digital instrument clusters meeting AEC-Q100 Grade 3. IC Role / Device Role / Timing Role: Automotive-grade parallel NOR flash providing fail-safe boot code with hardware ECC and sector lock. Use Value: Meets ASIL-B functional safety requirements via built-in ECC and sector protection, reducing validation effort. |
| Legacy Industrial Controller Upgrade | Medical Diagnostic Equipment BIOS |
Use Scenario: Replacing obsolete 64 Mb parallel flash in programmable logic controllers with extended lifecycle support. IC Role / Device Role / Timing Role: Pin-compatible upgrade path offering doubled density and faster 15 ns page reads. Use Value: Enables feature-rich firmware expansion without PCB redesign; supports same TSOP footprint and timing margins. | Use Scenario: Storing certified BIOS and calibration tables in Class II medical imaging devices requiring traceable firmware integrity. IC Role / Device Role / Timing Role: Secure, tamper-resistant firmware vault with OTP region for cryptographic keys and lockable sector protection. Use Value: 1024-byte OTP array with dual lockable regions satisfies FDA 21 CFR Part 11 audit logging and secure boot chain requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128S11DHI023 | Same die, 110 ns random access (vs. 90 ns); identical package and command set | Lower performance tier; suitable where timing margin exists but cost sensitivity is higher | Select when system timing budget allows 20 ns relaxation and BOM cost reduction is prioritized |
| MX29GL128FTHI-90G | Micron equivalent; 90 ns access, but no integrated hardware ECC and only 10,000 erase cycles | Lacks ECC and endurance; requires external error handling and limits field update frequency | Choose only for non-safety-critical, low-update-frequency applications where Infineon ECC is not required |
Compared with S29GL128S10DHI023, the -11DHI023 variant trades 20 ns speed for lower cost while maintaining full compatibility, whereas the Micron MX29GL128FTHI-90G lacks hardware ECC and endurance - making it unsuitable for safety- or update-intensive deployments.
Availability
S29GL128S10DHI023 is available at Aetrix Electronics and suitable for industrial HMI boot storage, automotive instrument cluster firmware, and legacy controller upgrades requiring stable component supply and long-term obsolescence management.
Supply support for S29GL128S10DHI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q100.
The GL-S family targets embedded systems needing reliable, high-performance parallel NOR flash for XIP firmware execution - designed specifically to replace aging AMD/Spansion devices in industrial and automotive platforms.
FAQ
What is the maximum operating voltage for VIO on S29GL128S10DHI023?
The VIO supply range is 1.65 V to VCC, with VCC rated from 2.7 V to 3.6 V. Therefore, VIO may be as high as 3.6 V when VCC = 3.6 V, enabling direct interface with 3.3 V host processors without level translation. This specification is confirmed in Section 10.4 of the official Infineon datasheet 001-98285 Rev. *U.
Does S29GL128S10DHI023 support hardware reset recovery after power loss?
Yes - the device includes a power-on reset (POR) circuit and supports warm reset via the RESET# pin (pin 56 in TSOP). During brown-out or abrupt power loss, the internal state machine resets cleanly, and the device enters standby mode with all outputs high-impedance. This behavior is defined in Section 11.3 of the datasheet.
Can the OTP array be reprogrammed after initial lock?
No - the 1024-byte OTP (One-Time Programmable) array has two independently lockable regions. Once a region is locked via the appropriate CFI command sequence, its contents become permanently read-only and cannot be erased or rewritten. This irreversible locking is implemented in silicon and verified in Section 3.3 of the datasheet.
Is S29GL128S10DHI023 pin-compatible with earlier Spansion S29GL128P devices?
No - although functionally similar, the S29GL128S10DHI023 uses updated command sets, adds hardware ECC, and modifies sector protection logic versus the legacy S29GL128P. Pinout is identical in TSOP, but timing parameters and status reporting differ; migration requires firmware validation per Section 5.4 of the datasheet.
S29GL128S10DHI023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL128S10DHI023 FAQ
1.How can I place an order for S29GL128S10DHI023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128S10DHI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128S10DHI023 reliable?
The price and inventory of S29GL128S10DHI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10DHI023 is usually 5 days.
3.What payment methods are accepted for S29GL128S10DHI023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S10DHI023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL128S10DHI023?
S29GL128S10DHI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL128S10DHI023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL128S10DHI023?
For technical support, including S29GL128S10DHI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10DHI023 requirements.
6.How does Aetrix verify that S29GL128S10DHI023 is sourced from the original manufacturer or authorized distributors?
All S29GL128S10DHI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10DHI023 meets industry standards.
7.What is the process for return or replacement of S29GL128S10DHI023?
All S29GL128S10DHI023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10DHI023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128S10DHI023 part is unused and in its original packaging.
Return procedure for S29GL128S10DHI023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL128S10DHI023 Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
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M24C02-FMC6TG
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Microchip Technology
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