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Infineon Technologies S29GL128S10DHIV10

Name: S29GL128S10DHIV10
Brand: Infineon Technologies
SKU: S29GL128S10DHIV10
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL128S10DHIV10

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL128S10DHIV10.pdf

Description:: IC FLASH 128MBIT PARALLEL 64FBGA

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Product details

Overview

S29GL128S10DHIV10 from Infineon is a 128 Mb (16 MB) parallel NOR flash memory IC with 3.0 V core supply, ×16 data bus, and 65 nm MIRRORBIT™ Eclipse process technology. It delivers 90 ns random access time and 15 ns page access time, supports 512-byte buffer programming, internal single-bit ECC, and uniform 128-kbyte sector erase - deployed in automotive instrument clusters for firmware storage and boot code execution.

For engineers reviewing the S29GL128S10DHIV10 datasheet, S29GL128S10DHIV10 pinout, S29GL128S10DHIV10 application, or S29GL128S10DHIV10 equivalent, key selection criteria include industrial-plus temperature grade (–40°C to +105°C), Versatile I/O (1.65 V to VCC), AEC-Q100 Grade 2 qualification, OTP array support, and CFI-compliant interface for bootloader compatibility.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A22), supporting both standard and page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume capability and status reporting via status register, data polling, or RY/BY# pin.

The architecture integrates hardware-based ECC for single-bit error correction and detection, plus Advanced Sector Protection (ASP) with volatile/non-volatile lock options per sector. The 1024-byte OTP array contains two independently lockable regions for secure configuration or calibration data storage.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	128 Mb (16 MB) - supports full firmware images for mid-tier microcontrollers
Random Access Time	90 ns at VCC = VIO - enables fast XIP execution without external cache
Page Access Time	15 ns - accelerates sequential instruction fetch within 32-byte aligned pages
Programming Buffer	512 bytes - reduces effective programming time by up to 4× vs. single-word writes
Erase Unit	Uniform 128-kbyte sectors - simplifies firmware update partitioning and wear leveling
Endurance & Retention	100,000 cycles / 20 years - meets long-life requirements for automotive ECUs
Operating Temp	–40°C to +105°C (Industrial Plus) - qualified for under-hood applications
I/O Voltage Range	VIO = 1.65 V to VCC - interoperable with mixed-voltage SoC interfaces

Pinout & Package

Package: 56-pin TSOP (Thin Small Outline Package), JEDEC standard MO-141AC, body size 18.4 mm × 10.16 mm, 0.5 mm pitch.

Pin/Terminal	Circuit Role	Design Meaning
A0–A22	Address Inputs	Word-aligned address lines; A22 is MSB for 128 Mb (2²³ words)
DQ0–DQ15	Data I/O	16-bit bidirectional bus; supports high-speed read/write with Versatile I/O voltage scaling
CE#	Chip Enable	Active-low enable controlling device selection; tCE = 90 ns max for full VCC operation
OE#	Output Enable	Active-low control for data output gating; tOE = 25 ns max
WE#	Write Enable	Active-low signal initiating write/program commands; latched on rising edge of CE#
RY/BY#	Ready/Busy Output	Open-drain status indicator; low during embedded program/erase operations
RESET#	Hardware Reset	Active-low asynchronous reset; forces device into reading state and clears internal state
VCC	Core Supply	3.0 V ±0.3 V supply powering core logic and flash array (2.7–3.6 V operational range)
VIO	I/O Supply	Independent I/O rail (1.65–3.6 V); decouples interface voltage from core for mixed-signal SoCs
WP#	Write Protect	Hardware sector protection enable; active-low input disabling program/erase when asserted

Key Features

Feature	Design Value
Hardware ECC	Single-bit error correction with automatic detection - eliminates need for external ECC logic in safety-critical boot paths
Buffer Programming	Up to 512-byte burst writes - cuts firmware update time by >70% compared to byte-wise programming
Suspend/Resume	Interruptible program/erase operations - enables real-time response to host interrupts during flash updates
Advanced Sector Protection	Volatile and non-volatile locking per 128-kbyte sector - supports secure OTA update rollback and factory calibration lockdown
Common Flash Interface	CFI-compliant parameter table - ensures bootloader compatibility across vendor-agnostic flash drivers
OTP Array	1024-byte one-time-programmable region with dual lockable sections - stores immutable keys or trim values without risking overwrite

Applications

Automotive Instrument Cluster

Industrial PLC Firmware Storage

Use Scenario: Storing boot code, GUI assets, and calibration tables in digital dashboards operating at 105°C ambient.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP-capable read performance and AEC-Q100 Grade 2 qualification.

Use Value: 90 ns random access and 15 ns page mode enable responsive UI rendering without external RAM caching.

Use Scenario: Holding firmware images and configuration data in programmable logic controllers deployed in factory automation cabinets.

IC Role / Device Role / Timing Role: Field-upgradable firmware repository with sector-level protection against accidental corruption during maintenance.

Use Value: Uniform 128-kbyte sectors and ASP allow selective reprogramming of application modules while preserving I/O driver partitions.

Medical Diagnostic Display

Avionics Data Logger

Use Scenario: Hosting boot firmware and regulatory-compliant diagnostic algorithms in portable ultrasound devices requiring data integrity certification.

IC Role / Device Role / Timing Role: Safety-assured code storage with hardware ECC and 20-year data retention for FDA Class II device lifecycle.

Use Value: Internal single-bit ECC eliminates soft-error-induced boot failures without software overhead or external DRAM parity.

Use Scenario: Recording flight-critical configuration parameters and event logs in airborne systems where power loss may occur mid-write.

IC Role / Device Role / Timing Role: Robust non-volatile storage with suspend/resume capability and hardware reset recovery.

Use Value: Program/erase suspend allows immediate response to aircraft power management signals, preventing partial writes during brownout events.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL128S11DHIV10	Same density and package; slower 110 ns random access (vs. 90 ns)	Lower-cost option where boot timing margin exceeds 20 ns	Select when system clock budget permits relaxed tACC and cost sensitivity outweighs performance gain
MX29GL128FHI-90G	Micron 128 Mb parallel NOR; 90 ns tACC but no integrated ECC or OTP array	Requires external ECC logic and separate secure storage for keys	Choose only if existing design already implements ECC in firmware and does not require OTP-based calibration lockdown

Compared with S29GL128S11DHIV10, the S29GL128S10DHIV10 provides tighter timing for time-critical boot sequences; versus MX29GL128FHI-90G, it delivers integrated reliability features (ECC, OTP, ASP) that reduce BOM count and validation effort in safety-certified systems.

Availability

S29GL128S10DHIV10 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical diagnostic displays, and avionics data loggers requiring stable component supply across extended temperature and long product lifecycles.

Supply support for S29GL128S10DHIV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and trusted security solutions, with global manufacturing and R&D infrastructure.

The GL-S family targets high-reliability embedded systems requiring deterministic boot performance, field-upgradable firmware, and AEC-Q100-compliant non-volatile storage - especially in automotive, industrial, and medical applications.

FAQ

Is S29GL128S10DHIV10 pin-compatible with earlier S29GL128P or S29GL128N devices?

No. S29GL128S10DHIV10 uses a 56-pin TSOP package with updated pinout for Versatile I/O (VIO) and enhanced reset behavior. It is not mechanically or electrically compatible with legacy P/N variants due to relocated WP#, RESET#, and RY/BY# pins and revised timing specifications.

Does this device support execute-in-place (XIP) operation?

Yes. The S29GL128S10DHIV10 supports true XIP with 90 ns random access and 15 ns page-mode reads, enabling direct CPU instruction fetch from flash without copying to RAM - verified in Infineon's GL-S XIP Application Note AN229244.

What is the function of the STB pin on this device?

The STB (Strobe) pin is not present on S29GL128S10DHIV10. It appears only on certain BGA variants (e.g., LAE/LAA packages) for advanced timing control. The 56-pin TSOP version omits STB; all timing is managed via CE#, OE#, and WE# with standard asynchronous protocols.

Can the OTP array be reprogrammed after initial programming?

No. The 1024-byte OTP array is permanently programmable - once a bit is set to '0', it cannot be changed back to '1'. Each of the two lockable regions can be individually secured via dedicated lock bits, preventing further writes even after partial programming.

S29GL128S10DHIV10 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 128Mbit

Memory Organization:: 8M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL128S10DHIV10 FAQ

1.How can I place an order for S29GL128S10DHIV10 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL128S10DHIV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL128S10DHIV10 reliable?

The price and inventory of S29GL128S10DHIV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10DHIV10 is usually 5 days.

3.What payment methods are accepted for S29GL128S10DHIV10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S10DHIV10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL128S10DHIV10?

S29GL128S10DHIV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL128S10DHIV10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL128S10DHIV10?

For technical support, including S29GL128S10DHIV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10DHIV10 requirements.

6.How does Aetrix verify that S29GL128S10DHIV10 is sourced from the original manufacturer or authorized distributors?

All S29GL128S10DHIV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10DHIV10 meets industry standards.

7.What is the process for return or replacement of S29GL128S10DHIV10?

All S29GL128S10DHIV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10DHIV10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL128S10DHIV10 part is unused and in its original packaging.

Return procedure for S29GL128S10DHIV10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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