My Inquiry
My Account
Infineon Technologies S29GL128S10DHIV13
- Part No.:
- S29GL128S10DHIV13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL128S10DHIV13.pdf
- Description:
- IC FLASH 128MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,495
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL128S10DHIV13 from Infineon is a 128 Mb (16 MB), 3.0 V core, parallel-interface MIRRORBIT™ Eclipse flash memory with ×16 data bus, 90 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C). It integrates hardware ECC for single-bit error correction, 128-kbyte uniform sector erase, and a 512-byte write buffer-enabling fast embedded code storage and firmware updates in microcontroller boot loaders.
For engineers reviewing the S29GL128S10DHIV13 datasheet, S29GL128S10DHIV13 pinout, S29GL128S10DHIV13 application, or S29GL128S10DHIV13 equivalent, key selection criteria include asynchronous parallel interface timing compliance, OTP array availability for secure configuration, Versatile I/O voltage support (1.65 V to VCC), and AEC-Q100 grade 3 qualification for automotive control modules.
Technical Context
This device implements an asynchronous parallel interface with CE#, OE#, and WE# control signals, supporting both standard word programming and multi-word buffered writes up to 512 bytes. Its internal Embedded Algorithm Controller (EAC) manages all program/erase operations-including suspend/resume-and enforces status monitoring via status register, data polling, and RY/BY# pin.
The flash array is organized into uniform 128-kbyte sectors, each individually erasable, with Advanced Sector Protection (ASP) enabling volatile and non-volatile lock/unlock per sector. The integrated 1024-byte OTP array contains two lockable regions for immutable device configuration or security keys.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 128 Mb (16 MB), organized as 1,048,576 × 16-bit words |
| Random access time | 90 ns at VCC = VIO = 3.0 V - determines minimum instruction fetch latency in XIP applications |
| Page access time | 15 ns - enables rapid sequential reads within 32-byte aligned pages for burst code execution |
| Write buffer size | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| ECC capability | Internal hardware single-bit error correction - eliminates need for external ECC logic in safety-critical boot storage |
| Endurance & retention | 100,000 program/erase cycles and 20-year data retention - validated for long-life industrial firmware storage |
| Operating temperature | –40°C to +85°C (Industrial grade) - qualified for use in motor control, PLC, and gateway MCU systems |
Pinout & Package
Package: 56-pin TSOP (Type I, 400 mil width), JEDEC MO-141AC compliant. Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | 23-bit address bus; A22 is MSB for 128 Mb (2²³ = 8,388,608 words × 2 bytes) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte/word writes per CE#/WE# strobe |
| CE# | Chip enable | Active-low chip select; device enters standby when high; controls power state transitions |
| OE# | Output enable | Active-low read strobe; gates output drivers without affecting internal state or timing |
| WE# | Write enable | Active-low write strobe; initiates command latching or data loading during programming/erase |
| RY/BY# | Ready/Busy indicator | Open-drain active-low signal indicating ongoing embedded operation (program/erase) |
| RESET# | Hardware reset | Active-low asynchronous reset that halts all operations and returns device to read mode |
| VCC | Core supply | 3.0 V ±0.3 V supply for core logic and flash array; supports 2.7–3.6 V operation range |
| VIO | I/O supply | Independent 1.65–3.6 V I/O rail enabling interfacing with mixed-voltage host controllers |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous page-mode read | 32-byte aligned page access with 15 ns cycle time - accelerates linear code execution without cache |
| 512-byte write buffer | Reduces average programming time by >60% vs. single-word writes - critical for field firmware updates |
| Hardware ECC engine | On-the-fly single-bit correction with no software overhead - meets IEC 61508 SIL-2 data integrity requirements |
| Advanced Sector Protection (ASP) | Volatile/non-volatile locking per 128-kbyte sector - enables secure bootloader + application partitioning |
| 1024-byte OTP array | Two independently lockable 512-byte regions - stores immutable calibration data or cryptographic keys |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot code and calibrated lookup tables in AEC-Q100 grade 3 ECU modules. IC Role / Device Role / Timing Role: Non-volatile XIP-capable boot memory with deterministic 90 ns read latency and OTP-secured calibration data. Use Value: Enables safe, certified boot sequence with hardware ECC protection against bit flips in harsh EMI environments. |
Use Scenario: Holding firmware images and configuration parameters in DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: Parallel flash memory with sector-level erase granularity and ASP for field-upgradable runtime code. Use Value: Supports over-the-air firmware patching via 512-byte buffered writes while maintaining 20-year data retention under thermal cycling. |
| Medical Imaging System Boot Loader | Telecom Base Station Configuration Memory |
Use Scenario: Hosting secure boot loader and FPGA configuration bitstreams in Class II medical devices. IC Role / Device Role / Timing Role: Trusted boot memory with locked OTP region for cryptographic root-of-trust keys. Use Value: Meets FDA cybersecurity guidance via hardware-enforced write-protection of immutable security assets. |
Use Scenario: Storing radio parameter sets and protocol stack configurations in outdoor 4G/5G base station units. IC Role / Device Role / Timing Role: High-reliability parallel flash with –40°C to +85°C operation and 100K-cycle endurance. Use Value: Ensures uninterrupted configuration persistence across extended temperature excursions and frequent reprogramming events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128S10TFIV10 | Same die, 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP package; identical timing and features | Preferred for space-constrained PCBs where board area is prioritized over socket-based prototyping | Select when footprint miniaturization and automated assembly outweigh manual debug accessibility |
| MX29GL128FHT2I-90G | Macronix 128 Mb parallel NOR; 90 ns access; no integrated ECC; requires external error handling logic | Lower-cost alternative where ECC is implemented in host MCU or not required for application data integrity | Choose only if system-level ECC is already deployed and BOM cost reduction is primary driver |
Compared with S29GL128S10TFIV10, the TSOP variant offers easier prototyping and thermal management; versus MX29GL128FHT2I-90G, it delivers built-in ECC and ASP-reducing host firmware complexity and improving functional safety compliance.
Availability
S29GL128S10DHIV13 is available at Aetrix Electronics and suitable for automotive engine control units, industrial PLCs, medical imaging boot loaders, and telecom base station configuration storage requiring stable component supply across extended product lifecycles.
Supply support for S29GL128S10DHIV13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certifications including ISO/TS 16949 and IATF 16949.
The GL-S family targets high-reliability embedded systems requiring deterministic XIP performance, long-term firmware storage, and hardware-enforced security-designed specifically for automotive, industrial, and medical applications demanding AEC-Q100 or extended temperature operation.
FAQ
Does S29GL128S10DHIV13 support both 3.3 V and 1.8 V I/O interfaces?
Yes. Its Versatile I/O feature supports VIO from 1.65 V to VCC, enabling direct connection to 1.8 V or 3.3 V host processors without level shifters. This is confirmed in Section 8.3 of the datasheet and validated across all operating modes including read, program, and erase.
Can the 1024-byte OTP array be reprogrammed after initial lock?
No. Once either 512-byte OTP region is permanently locked via the dedicated lock command, its contents become read-only and irreversible. The unlock command is only valid before lock activation and does not restore write capability after locking.
What is the maximum sustained write throughput using the 512-byte buffer?
At 1.5 MBps (per datasheet Section "Typical program and erase rates"), the buffer achieves ~768 KB/s sustained throughput accounting for command overhead and inter-burst delays. This rate assumes optimal host timing and continuous buffer fills without wait states.
Is hardware reset (RESET#) required before power-up initialization?
No. Power-on reset (POR) is fully automatic and self-contained. RESET# is optional and used only for synchronous recovery from unknown states or to abort ongoing operations-its assertion is not needed for normal startup sequencing.
S29GL128S10DHIV13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL128S10DHIV13 FAQ
1.How can I place an order for S29GL128S10DHIV13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128S10DHIV13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128S10DHIV13 reliable?
The price and inventory of S29GL128S10DHIV13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10DHIV13 is usually 5 days.
3.What payment methods are accepted for S29GL128S10DHIV13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S10DHIV13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL128S10DHIV13?
S29GL128S10DHIV13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL128S10DHIV13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL128S10DHIV13?
For technical support, including S29GL128S10DHIV13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10DHIV13 requirements.
6.How does Aetrix verify that S29GL128S10DHIV13 is sourced from the original manufacturer or authorized distributors?
All S29GL128S10DHIV13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10DHIV13 meets industry standards.
7.What is the process for return or replacement of S29GL128S10DHIV13?
All S29GL128S10DHIV13 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10DHIV13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128S10DHIV13 part is unused and in its original packaging.
Return procedure for S29GL128S10DHIV13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL128S10DHIV13 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…
