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Infineon Technologies S29GL128S10DHIV23
- Part No.:
- S29GL128S10DHIV23
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL128S10DHIV23.pdf
- Description:
- IC FLASH 128MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,334
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Product details
Overview
S29GL128S10DHIV23 from Infineon is a 128 Mb (16 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction. It is used in boot code storage for industrial microcontrollers requiring fast XIP execution and reliable non-volatile program retention.
For engineers reviewing the S29GL128S10DHIV23 datasheet, S29GL128S10DHIV23 pinout, S29GL128S10DHIV23 application, or S29GL128S10DHIV23 equivalent, key selection criteria include its 128-kbyte uniform sector erase granularity, 512-byte programming buffer throughput (1.5 MBps), Versatile I/O support (1.65 V to VCC), and AEC-Q100 Grade 2 qualification (–40°C to +105°C).
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A22), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages autonomous program/erase operations, suspend/resume capability, and status reporting via status register, data polling, or RY/BY# pin.
The internal architecture includes a dedicated ECC engine correcting single-bit errors on-the-fly during read, a 1024-byte OTP array with dual lockable regions, and Advanced Sector Protection enabling volatile/non-volatile locking per 128-kbyte sector - critical for secure firmware partitioning in automotive ECUs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 128 Mb (16 MB), organized as 1,048,576 × 16-bit words |
| Random Access Time | 90 ns at VCC = VIO, enabling fast instruction fetch in XIP applications |
| Page Access Time | 15 ns for subsequent 32-byte aligned reads within same page |
| Programming Buffer | 512 bytes max per operation, achieving 1.5 MBps effective write rate |
| Erase Granularity | Uniform 128-kbyte sectors, simplifying firmware update partitioning |
| Data Retention | 20 years at 85°C, validated for long-life industrial deployments |
| Endurance | 100,000 program/erase cycles per sector, supporting field firmware updates |
| I/O Voltage Range | VIO = 1.65 V to VCC, allowing direct interfacing with 1.8 V or 3.3 V logic |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, JEDEC MO-141AC compliant, lead-free and RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address Inputs | Word-aligned address bus; A22 is MSB for 128 Mb (2²³ = 8,388,608 words) |
| DQ0–DQ15 | Data Input/Output | 16-bit bidirectional data bus; supports byte/word writes per command sequence |
| CE# | Chip Enable | Active-low enable controlling device selection; tCE = 90 ns max access timing |
| OE# | Output Enable | Active-low control for data output gating; tOE = 25 ns max access timing |
| WE# | Write Enable | Active-low signal initiating internal program/erase algorithms when CE# and OE# are high |
| RY/BY# | Ready/Busy Output | Open-drain status indicator: low = busy, high = ready for next command |
| RESET# | Hardware Reset | Active-low input forcing device into reset state; required for power-on initialization |
| VCC | Core Supply | 2.7–3.6 V single supply powering core logic, EAC, and memory array |
| VIO | I/O Supply | 1.65–VCC voltage for interface buffers, decoupled from VCC for mixed-voltage systems |
| WP# | Write Protect | Hardware sector protection enable; tied low to prevent accidental program/erase |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC Engine | On-die single-bit error correction with automatic detection and correction during read, eliminating need for external ECC logic |
| 512-Byte Programming Buffer | Enables burst programming of up to 512 bytes in one command, reducing host CPU overhead vs. byte-by-byte writes |
| Versatile I/O Interface | Independent VIO supply (1.65 V to VCC) allows seamless integration with 1.8 V controllers and 3.3 V peripherals |
| Suspend/Resume Capability | Allows interrupting active program or erase to service higher-priority read requests, essential for real-time OS environments |
| 1024-Byte OTP Array | Two independently lockable 512-byte regions for storing immutable keys, calibration data, or security credentials |
Applications
| Automotive Powertrain ECU | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot loader and calibrated engine control maps in diesel ECU requiring AEC-Q100 Grade 2 operation (–40°C to +105°C). IC Role / Device Role / Timing Role: Non-volatile XIP-capable code storage with deterministic 90 ns read latency for real-time instruction fetch. Use Value: Hardware ECC ensures integrity of safety-critical firmware across 20-year vehicle lifetime without software intervention. | Use Scenario: Holding firmware and configuration data in modular programmable logic controllers deployed in factory automation cabinets. IC Role / Device Role / Timing Role: High-reliability parallel flash providing 100,000 erase cycles for field-upgradable control logic. Use Value: Uniform 128-kbyte sectors simplify over-the-air update partitioning and rollback recovery without partial-sector corruption risk. |
| Medical Imaging System Boot ROM | Telecom Base Station Control Memory |
Use Scenario: Secure boot image storage in FDA-cleared MRI subsystems where data retention and tamper resistance are mandated. IC Role / Device Role / Timing Role: OTP-protected secure silicon region stores cryptographic keys; sector protection prevents unauthorized firmware modification. Use Value: Dual-lock OTP regions enable separation of manufacturer keys and customer-specific calibration data with independent write locks. | Use Scenario: Storing FPGA configuration bitstreams and baseband processor firmware in outdoor 5G remote radio units operating at extended temperature. IC Role / Device Role / Timing Role: Parallel interface with 15 ns page-mode access accelerates FPGA reconfiguration during maintenance windows. Use Value: 1.5 MBps buffer programming enables full 16 MB firmware reload in <11 seconds, minimizing service downtime. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128P10TFIV20 | Same density and core specs, but uses 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP option | Preferred for space-constrained PCBs where board area is prioritized over manual assembly or socket compatibility | Select when footprint miniaturization outweighs need for through-hole or socket-based prototyping |
| MX29GL128FPTI-90G | Macronix part with identical 128 Mb density, 90 ns access, and 1.65–3.6 V I/O range; lacks integrated ECC and OTP array | Requires external ECC handling and separate secure storage for keys; lower cost but higher system-level validation burden | Select only if firmware integrity is managed in software and OTP functionality is not required |
Compared with S29GL128P10TFIV20, the S29GL128S10DHIV23 offers TSOP packaging for easier rework and legacy system compatibility; versus MX29GL128FPTI-90G, it provides on-die ECC and OTP - reducing BOM count and enhancing functional safety compliance without software overhead.
Availability
S29GL128S10DHIV23 is available at Aetrix Electronics and suitable for automotive powertrain modules, industrial PLCs, medical imaging subsystems, and telecom base station control requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL128S10DHIV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and secure memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q200.
The GL-S family targets high-reliability embedded systems needing deterministic XIP performance, robust data retention, and hardware-assisted security - especially in automotive, industrial, and medical applications demanding AEC-Q100 or extended-temperature qualification.
FAQ
Is S29GL128S10DHIV23 pin-compatible with earlier S29GL128N or S29GL128P variants?
No. While functionally similar, S29GL128S introduces updated command set timing, enhanced ECC behavior, and revised sector protection registers. Pinout matches S29GL128P in TSOP package, but firmware must be validated against Rev. *U datasheet due to differences in status register bit definitions and OTP lock sequencing.
Does this device support Quad SPI or other serial interfaces?
No. S29GL128S10DHIV23 is strictly a parallel-interface NOR flash with 16-bit DQ bus and asynchronous control signals (CE#, OE#, WE#). It does not implement SPI, QSPI, or HyperBus protocols - those require separate Infineon GL-T or Semper families.
What is the purpose of the STB pin listed in the block diagram but not in the pin table?
STB (Strobe) is an internal signal used only during wafer test and not bonded out to the 56-pin TSOP package. It is absent from the final device pinout and has no user-accessible function; design schematics should omit any connection to STB.
Can the Versatile I/O feature operate with VIO = 1.8 V while VCC = 3.3 V?
Yes. The device explicitly supports VIO from 1.65 V to VCC, so 1.8 V I/O with 3.3 V core is fully compliant and commonly used to interface with 1.8 V FPGAs or low-power microcontrollers while maintaining full 3.3 V memory array performance.
S29GL128S10DHIV23 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL128S10DHIV23 FAQ
1.How can I place an order for S29GL128S10DHIV23 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128S10DHIV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128S10DHIV23 reliable?
The price and inventory of S29GL128S10DHIV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10DHIV23 is usually 5 days.
3.What payment methods are accepted for S29GL128S10DHIV23?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S10DHIV23 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL128S10DHIV23?
S29GL128S10DHIV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL128S10DHIV23 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL128S10DHIV23?
For technical support, including S29GL128S10DHIV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10DHIV23 requirements.
6.How does Aetrix verify that S29GL128S10DHIV23 is sourced from the original manufacturer or authorized distributors?
All S29GL128S10DHIV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10DHIV23 meets industry standards.
7.What is the process for return or replacement of S29GL128S10DHIV23?
All S29GL128S10DHIV23 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10DHIV23, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128S10DHIV23 part is unused and in its original packaging.
Return procedure for S29GL128S10DHIV23:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL128S10DHIV23 Tags
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