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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL128S10DHSS10

Name: S29GL128S10DHSS10
Brand: Infineon Technologies
SKU: S29GL128S10DHSS10
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL128S10DHSS10

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL128S10DHSS10.pdf

Description:: IC FLASH 128MBIT PARALLEL 64FBGA

Quantity:: RFQ Add To RFQ list

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Inventory:2,322

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Product details

Overview

S29GL128S10DHSS10 from Infineon is a 128 Mb (16 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, and 15 ns page access time. It features hardware ECC for single-bit correction, 128-kbyte uniform sectors, and 512-byte programming buffer - deployed in automotive instrument clusters requiring fast XIP boot code execution and robust data retention.

For engineers reviewing the S29GL128S10DHSS10 datasheet, S29GL128S10DHSS10 pinout, S29GL128S10DHSS10 application, or S29GL128S10DHSS10 equivalent, this device supports asynchronous read, sector erase suspend/resume, OTP lockable regions, CFI compliance, and AEC-Q100 Grade 2 (–40°C to +105°C) operation - critical for functional safety-critical firmware storage.

Technical Context

The S29GL128S10DHSS10 implements an embedded algorithm controller (EAC) that executes autonomous program/erase operations without host CPU intervention. Its MIRRORBIT™ Eclipse 65 nm architecture enables simultaneous bit-line sensing for faster page reads and reduced power per operation.

It supports three status monitoring methods - status register polling, data polling, and RY/BY# pin assertion - and integrates dedicated logic for automatic ECC generation and correction during read cycles, ensuring data integrity without software overhead.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	128 Mb (16 MB); sufficient for full bootloader + OS kernel + configuration tables in automotive ECUs
Random Access Time	90 ns at VCC = VIO; enables sub-11 MHz synchronous interface timing for legacy microcontroller buses
Page Access Time	15 ns; allows burst reads of 32-byte aligned pages with minimal address setup overhead
Programming Buffer	512 bytes; reduces effective programming time by >3× vs. single-word writes in firmware update routines
ECC Support	Hardware single-bit error correction; eliminates need for external ECC logic or software correction layers
Endurance & Retention	100,000 program/erase cycles and 20-year data retention; validated for lifetime use in unattended industrial gateways
Operating Temperature	–40°C to +105°C (AEC-Q100 Grade 2); qualified for under-hood automotive applications

Pinout & Package

Package: 56-pin TSOP (Type I, standard thickness). Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.1.

Pin/Terminal	Circuit Role	Design Meaning
A0–A22	Address inputs	23-bit word address bus; A22 is MSB for 128 Mb (2²³ × 16 bits)
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports byte/word writes via WE# and BYTE# control
CE#	Chip enable	Active-low chip select; enables device for read/write when OE# and WE# are also asserted appropriately
OE#	Output enable	Controls output drivers during read; high-Z state prevents bus contention during write/erase
WE#	Write enable	Initiates write cycles; latches command sequences and data on rising edge
RY/BY#	Ready/Busy indicator	Open-drain active-low signal; asserts low during embedded erase/program, enabling hardware wait-state management
WP#	Write protect	Hardware sector protection override; disables program/erase when pulled low, independent of software locks
VCC	Core supply	3.0 V ±0.3 V supply for logic and array; powers internal voltage generators for program/erase
VIO	I/O supply	1.65 V to VCC; decouples I/O voltage from core, enabling interfacing with 1.8 V or 3.3 V controllers

Key Features

Feature	Design Value
Asynchronous Page Read	32-byte aligned page access with 15 ns cycle time - accelerates sequential instruction fetch in XIP mode
Embedded Algorithm Controller (EAC)	Autonomous sector erase and buffer programming - offloads timing-critical flash management from host MCU
Advanced Sector Protection (ASP)	Volatile and non-volatile locking per 128-kbyte sector - enables secure bootloader partitioning and field-upgrade isolation
Secure Silicon Region (OTP)	1024-byte one-time-programmable array with two lockable regions - stores cryptographic keys or calibration data irreversibly
Common Flash Interface (CFI)	Standardized parameter table accessible via read commands - enables generic flash drivers across toolchains and OSes

Applications

Automotive Instrument Cluster

Industrial PLC Firmware Storage

Use Scenario: Storing boot code, GUI assets, and real-time gauge rendering logic in digital dashboards.

IC Role / Device Role / Timing Role: Primary XIP-capable firmware memory with deterministic 90 ns read latency for MCU instruction fetch.

Use Value: Enables zero-wait-state execution from flash, reducing BOM cost versus SRAM+SPI flash combinations.

Use Scenario: Holding firmware images, configuration databases, and diagnostic logs in programmable logic controllers.

IC Role / Device Role / Timing Role: Non-volatile program storage with sector-level erase suspend for safe field updates during runtime.

Use Value: Supports concurrent I/O and background erase via RY/BY# signaling, eliminating system downtime during maintenance.

Medical Imaging Bootloader

Avionics Data Logger

Use Scenario: Hosting certified bootloader and FPGA configuration bitstreams in portable ultrasound systems.

IC Role / Device Role / Timing Role: Secure, ECC-protected boot memory with OTP-locked signature verification keys.

Use Value: Meets IEC 62304 Class C requirements via hardware ECC and immutable key storage.

Use Scenario: Recording flight-critical sensor metadata and event-triggered snapshots in black box recorders.

IC Role / Device Role / Timing Role: High-endurance data archive with 100,000 erase cycles and 20-year retention at 85°C.

Use Value: Eliminates periodic media replacement; certified for DO-160 environmental stress profiles.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL128S11DHSS10	Same density and package, but 110 ns random access (vs. 90 ns); no OTP region	Lacks secure silicon region; unsuitable for key storage or certified bootloader use	Select only if ECC and CFI are sufficient and OTP is not required
MX29GL128FPTI-90G	Macronix 128 Mb parallel NOR; 90 ns access, but no hardware ECC or ASP	Requires external ECC handling and software-based sector locking	Choose for cost-sensitive designs where host MCU can manage error correction and protection

Compared with S29GL128S10DHSS10, the S29GL128S11DHSS10 trades speed and security for lower cost, while MX29GL128FPTI-90G shifts ECC and protection responsibility to firmware - making the original optimal for safety-certified, high-integrity firmware storage.

Availability

S29GL128S10DHSS10 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging bootloaders, and avionics data loggers requiring stable component supply across extended temperature and long product lifecycles.

Supply support for S29GL128S10DHSS10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and trusted security solutions, with global manufacturing and qualification infrastructure.

The GL-S family targets automotive and industrial applications requiring AEC-Q100 qualification, hardware ECC, and robust firmware storage - designed specifically for functional safety (ISO 26262 ASIL-B capable) and long-term reliability.

FAQ

What is the purpose of the Versatile I/O (VIO) feature?

The Versatile I/O feature allows independent supply voltage (1.65 V to VCC) for the DQ pins, enabling direct interfacing with 1.8 V or 3.3 V microcontrollers without level shifters. This simplifies board design and improves signal integrity in mixed-voltage systems while maintaining full 16-bit data throughput.

Does S29GL128S10DHSS10 support true XIP (eXecute-In-Place)?

Yes - its 90 ns random access time and asynchronous page read architecture allow direct instruction fetch from flash without copying to RAM. The device supports full XIP operation across its entire address space, including boot sectors protected by Advanced Sector Protection and OTP-locked regions.

How does the hardware ECC work during read operations?

On every read access, internal ECC circuitry computes a syndrome over the 512-bit data + parity field. If a single-bit error is detected, it is corrected transparently before data reaches the DQ bus; the status register flags correction events, and no software intervention is required for recovery.

Can sector erase be suspended and resumed mid-operation?

Yes - the S29GL128S10DHSS10 supports suspend/resume for both program and erase operations. Issuing a suspend command halts the current sector erase, allowing immediate read access to other sectors; resume restores the erased sector's state and continues the operation without data loss or timing penalty.

S29GL128S10DHSS10 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 128Mbit

Memory Organization:: 8M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL128S10DHSS10 FAQ

1.How can I place an order for S29GL128S10DHSS10 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL128S10DHSS10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL128S10DHSS10 reliable?

The price and inventory of S29GL128S10DHSS10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10DHSS10 is usually 5 days.

3.What payment methods are accepted for S29GL128S10DHSS10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S10DHSS10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL128S10DHSS10?

S29GL128S10DHSS10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL128S10DHSS10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL128S10DHSS10?

For technical support, including S29GL128S10DHSS10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10DHSS10 requirements.

6.How does Aetrix verify that S29GL128S10DHSS10 is sourced from the original manufacturer or authorized distributors?

All S29GL128S10DHSS10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10DHSS10 meets industry standards.

7.What is the process for return or replacement of S29GL128S10DHSS10?

All S29GL128S10DHSS10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10DHSS10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL128S10DHSS10 part is unused and in its original packaging.

Return procedure for S29GL128S10DHSS10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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