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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL128S10DHSS20

Name: S29GL128S10DHSS20
Brand: Infineon Technologies
SKU: S29GL128S10DHSS20
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL128S10DHSS20

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL128S10DHSS20.pdf

Description:: IC FLASH 128MBIT PARALLEL 64FBGA

Quantity:: RFQ Add To RFQ list

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Product details

Overview

S29GL128S10DHSS20 from Infineon is a 128 Mb (16 MB), ×16 asynchronous parallel NOR flash memory with 3.0 V core supply, 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across –40°C to +85°C (industrial grade) and supports sector erase of uniform 128-kbyte sectors in embedded boot code storage applications.

For engineers reviewing the S29GL128S10DHSS20 datasheet, S29GL128S10DHSS20 pinout, S29GL128S10DHSS20 application, or S29GL128S10DHSS20 equivalent, key selection criteria include its 512-byte programming buffer, Versatile I/O (1.65 V–VCC), CFI-compliant interface, OTP array with dual lockable regions, and AEC-Q100 Grade 3 qualification for automotive control modules.

Technical Context

The S29GL128S10DHSS20 implements MIRRORBIT™ Eclipse architecture on 65 nm process, enabling simultaneous bit-line sensing for higher density and lower power versus traditional floating-gate NOR. Its embedded algorithm controller (EAC) manages autonomous program/erase operations with suspend/resume capability and status reporting via RY/BY#, data polling, or status register.

It uses asynchronous read with 32-byte page alignment: initial word access reads full 32-byte page (90 ns), subsequent intra-page accesses take only 15 ns. The device supports both full-VCC and Versatile I/O modes, allowing independent VIO (1.65 V–VCC) for mixed-voltage system interfacing without level shifters.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	128 Mb (16 MB), organized as 1,048,576 × 16-bit words - supports full boot image storage for mid-tier microcontrollers.
Random Access Time	90 ns at VCC = VIO - enables direct XIP execution from flash in real-time firmware without external cache penalty.
Page Access Time	15 ns - accelerates sequential instruction fetch within same 32-byte aligned page, reducing effective read latency.
Programming Buffer	512 bytes - allows single-command write of up to 256 words, cutting typical firmware update time by >3× vs. byte-by-byte programming.
ECC Support	On-die hardware single-bit error correction - eliminates need for external ECC logic or software overhead in safety-critical systems.
Sector Erase Size	Uniform 128 kbyte sectors - simplifies firmware partitioning (e.g., separate bootloader, app, config sectors) with deterministic erase timing (477 kBps).
Data Retention	20 years - ensures long-term reliability in unattended industrial gateways and automotive ECUs without refresh cycles.
Endurance	100,000 program/erase cycles - supports field-upgradable firmware with robust over-the-air (OTA) update resilience.

Pinout & Package

This device is packaged in a 56-pin TSOP (Thin Small Outline Package) with standard JEDEC MO-141AC footprint, 14 mm × 20 mm body, 0.5 mm lead pitch, and surface-mount configuration suitable for automated PCB assembly.

Pin/Terminal	Circuit Role	Design Meaning
A0–A22	Address Inputs	23-bit address bus supporting 128 Mb addressing (2²³ × 16 bits); A22 is MSB for this density.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports ×16 word-wide transfers; compatible with 32-bit microcontroller data interfaces via multiplexing.
CE#	Chip Enable	Active-low chip select; controls device power state - deassertion places flash in low-power standby (100 µA).
OE#	Output Enable	Active-low read strobe; gates output drivers during read - enables shared bus arbitration with other peripherals.
WE#	Write Enable	Active-low control for write/program/erase commands; must be synchronized with address/data setup/hold per AC specs.
RY/BY#	Ready/Busy Output	Open-drain status indicator - low during embedded operations (program/erase), high when ready for next command.
RESET#	Hardware Reset	Active-low asynchronous reset - forces device into known state and aborts ongoing operations without requiring power cycle.
VCC	Core Supply	3.0 V ±0.3 V supply (2.7–3.6 V) powering core logic, EAC, and internal voltage generators for program/erase.
VIO	I/O Supply	Independent I/O voltage (1.65 V–VCC) enabling direct interface to 1.8 V, 2.5 V, or 3.3 V controllers without level translation.
WP#	Write Protect	Hardware sector protection enable - when asserted, blocks program/erase of protected sectors regardless of software commands.

Key Features

Feature	Design Value
65 nm MIRRORBIT™ Eclipse Technology	Doubles bit density per cell vs. conventional NOR, enabling 128 Mb in compact TSOP package while reducing active current (60 mA read @ 5 MHz).
512-byte Programming Buffer	Reduces average programming time per kilobyte by 65% compared to single-word writes, critical for fast field firmware updates.
Hardware ECC Engine	Corrects single-bit errors on-the-fly during read; eliminates soft-error-induced crashes in mission-critical automotive and industrial firmware.
Advanced Sector Protection (ASP)	Supports volatile (power-on default) and non-volatile (permanent) locking per 128-kbyte sector - secures bootloader against accidental overwrite.
1024-byte OTP Array	Two independently lockable 512-byte regions store immutable keys, calibration data, or device IDs - prevents cloning and enables secure provisioning.
Common Flash Interface (CFI)	Standardized parameter table enables automatic driver detection and configuration in RTOS/bootloader environments without hard-coded timing.

Applications

Automotive Instrument Cluster

Industrial PLC Firmware Storage

Use Scenario: Storing calibrated gauge graphics, firmware, and vehicle-specific configuration in digital dashboards.

IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable code execution and OTA-updatable application partitions.

Use Value: 90 ns random access enables real-time rendering of animated UI elements; AEC-Q100 Grade 3 rating ensures operation at 105°C junction temperature.

Use Scenario: Holding ladder logic runtime, I/O mapping tables, and safety firmware in programmable logic controllers.

IC Role / Device Role / Timing Role: Primary firmware storage with sector-level write protection to prevent corruption during brown-out events.

Use Value: Hardware ECC prevents silent data corruption in long-life deployments; 20-year retention guarantees firmware integrity over 15+ year product lifecycle.

Medical Diagnostic Imaging Boot Loader

Telecom Base Station Configuration

Use Scenario: Securely storing certified boot loader and cryptographic keys for FDA-cleared imaging equipment.

IC Role / Device Role / Timing Role: Trusted boot source with OTP-locked root-of-trust keys and ASP-protected bootloader region.

Use Value: Dual-lockable OTP array meets IEC 62304 security requirements; 100,000 erase cycles support regulatory re-certification updates.

Use Scenario: Storing FPGA bitstreams, radio calibration profiles, and protocol stacks in 4G/5G remote radio units.

IC Role / Device Role / Timing Role: High-reliability configuration memory interfaced to FPGA via ×16 parallel bus with minimal glue logic.

Use Value: 15 ns page access accelerates FPGA reconfiguration; Versatile I/O (1.8 V VIO) matches FPGA I/O bank voltage without level shifters.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL128P10TFIR20	Same density and timing, but uses 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP option; lacks OTP array.	Better suited for space-constrained RF modules where board area is premium and OTP not required.	Select when footprint reduction outweighs need for hardware-based key storage or legacy TSOP compatibility.
MX29GL128FPTI-90G	128 Mb ×16 NOR flash with 90 ns access, but no on-die ECC, no OTP, and only 10,000 erase cycles; wider VCC range (2.7–3.6 V same).	Acceptable for cost-sensitive consumer electronics where ECC and long-term endurance are non-critical.	Choose only if system-level ECC is implemented externally and lifetime field updates are infrequent.

Compared with S29GL128P10TFIR20, the S29GL128S10DHSS20 offers TSOP compatibility and OTP security; versus MX29GL128FPTI-90G, it delivers 10× endurance, hardware ECC, and secure provisioning - essential for automotive and industrial certification.

Availability

S29GL128S10DHSS20 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical diagnostic boot loaders, and telecom base station configuration requiring stable component supply, long-lifecycle support, and AEC-Q100 compliance.

Supply support for S29GL128S10DHSS20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and high-reliability memory solutions for industrial and automotive markets.

The GL-S family targets embedded systems needing XIP-capable, high-endurance NOR flash with integrated data integrity features - designed specifically for automotive ECUs, industrial controllers, and medical devices demanding 20-year data retention and AEC-Q100 qualification.

FAQ

Does S29GL128S10DHSS20 support both 3.3 V and 1.8 V I/O interfaces?

Yes - its Versatile I/O feature allows VIO to operate from 1.65 V to VCC. With VCC = 3.0 V, VIO can be set to 1.8 V, 2.5 V, or 3.0 V independently, enabling direct connection to 1.8 V FPGAs or 2.5 V microcontrollers without external level shifters.

Can the OTP array be programmed multiple times?

No - the 1024-byte OTP (One-Time Programmable) array consists of two 512-byte lockable regions. Each byte can be programmed only once; after programming, the region is permanently locked via dedicated lock bits, preventing further writes or erasure.

What happens during power loss while a sector erase is in progress?

The device retains partial erase state and reports "erasing" status on next power-up. It requires explicit resume command or full sector re-erase to recover - no automatic rollback. This behavior is defined in the Embedded Algorithm Controller (EAC) specification and requires host firmware handling.

Is the RY/BY# pin electrically compatible with 5 V logic systems?

No - RY/BY# is an open-drain output referenced to VIO, not VCC. When VIO = 1.8 V, its high-level output is ~1.8 V, making it incompatible with 5 V TTL inputs without pull-up to 5 V and level translation. Direct 5 V interface risks damage or misread states.

S29GL128S10DHSS20 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 128Mbit

Memory Organization:: 8M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: 0°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL128S10DHSS20 FAQ

1.How can I place an order for S29GL128S10DHSS20 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL128S10DHSS20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL128S10DHSS20 reliable?

The price and inventory of S29GL128S10DHSS20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10DHSS20 is usually 5 days.

3.What payment methods are accepted for S29GL128S10DHSS20?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S10DHSS20 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL128S10DHSS20?

S29GL128S10DHSS20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL128S10DHSS20 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL128S10DHSS20?

For technical support, including S29GL128S10DHSS20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10DHSS20 requirements.

6.How does Aetrix verify that S29GL128S10DHSS20 is sourced from the original manufacturer or authorized distributors?

All S29GL128S10DHSS20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10DHSS20 meets industry standards.

7.What is the process for return or replacement of S29GL128S10DHSS20?

All S29GL128S10DHSS20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10DHSS20, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL128S10DHSS20 part is unused and in its original packaging.

Return procedure for S29GL128S10DHSS20:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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