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Infineon Technologies S29GL128S10DHV010
- Part No.:
- S29GL128S10DHV010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL128S10DHV010.pdf
- Description:
- IC FLASH 128MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,682
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Product details
Overview
S29GL128S10DHV010 from Infineon is a 128 Mb (16 MB), 3.0 V core, parallel-interface MIRRORBIT™ Eclipse flash memory with ×16 data bus, 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across –40°C to +105°C (Industrial Plus grade), supports 100,000 program/erase cycles, and features a 512-byte write buffer for accelerated programming in embedded boot code storage applications.
For engineers reviewing the S29GL128S10DHV010 datasheet, S29GL128S10DHV010 pinout, S29GL128S10DHV010 application, or S29GL128S10DHV010 equivalent, this device delivers deterministic asynchronous read timing, sector-level erase control, OTP array security, and Versatile I/O support (1.65 V–3.6 V) - critical for automotive infotainment boot loaders, industrial PLC firmware storage, and telecom baseband configuration memory.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A22), 32-byte page-aligned reads, and hardware-managed ECC that corrects single-bit errors on-the-fly during read operations. Its embedded algorithm controller (EAC) executes autonomous program and sector-erase sequences without host intervention.
The GL-S architecture separates command decoding, status monitoring (via RY/BY#, status register, and data polling), and voltage generation (for PGM/erase) into dedicated logic blocks. Sector protection uses both volatile (lock bits) and non-volatile (ASP) methods, and the 1024-byte OTP array includes two independently lockable regions for secure key or calibration storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 128 Mb (16 MB); supports full firmware image storage for mid-tier microcontrollers |
| Random access time (tACC) | 90 ns at VCC = VIO; enables fast XIP execution from flash without external cache |
| Page access time (tPACC) | 15 ns; allows rapid sequential reads within 32-byte aligned pages |
| Write buffer size | 512 bytes; reduces effective programming time by batching up to 256 words per operation |
| ECC capability | Single-bit error correction via internal hardware; eliminates need for software ECC overhead |
| Endurance & retention | 100,000 program/erase cycles; 20-year data retention at +85°C - validated for long-life industrial deployment |
| Operating temperature | –40°C to +105°C (Industrial Plus grade); qualified for under-hood automotive and factory-floor environments |
Pinout & Package
Package: 56-ball VBU Fortified BGA (9 mm × 7 mm, 0.8 mm pitch), RoHS-compliant, lead-free, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | Word-aligned address bus (23 pins); A22 is MSB for 128 Mb (223 × 16-bit = 16 MB) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte/word writes and reads with no external data multiplexing |
| CE# | Chip enable | Active-low chip select; controls device power state and enables command latching |
| OE# | Output enable | Active-low read strobe; gates output drivers without affecting internal state or timing |
| WE# | Write enable | Active-low write strobe; initiates command loading or data programming when CE# and OE# are inactive |
| RY/BY# | Ready/Busy indicator | Open-drain output; low during embedded program/erase; used for hardware flow control |
| VCC | Core supply | 3.0 V ±0.3 V supply for logic and memory array; powers all internal voltage generators |
| VIO | I/O supply | 1.65 V to 3.6 V; independent of VCC, enabling direct interfacing with 1.8 V or 3.3 V controllers |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous page-mode read | 32-byte aligned page access with 15 ns cycle time - accelerates sequential instruction fetch in XIP systems |
| Hardware ECC engine | On-die single-bit correction with no latency penalty or host CPU involvement - improves system reliability without software overhead |
| Uniform 128-kB sectors | 128 identically sized, independently erasable sectors - simplifies firmware update partitioning and wear leveling |
| Versatile I/O (VIO) | Independent 1.65–3.6 V I/O rail - eliminates level shifters when interfacing with mixed-voltage SoCs or FPGAs |
| OTP array with dual lock | 1024-byte one-time-programmable region split into two lockable sections - supports secure key injection and calibration data binding |
Applications
| Automotive Infotainment Boot Loader | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot code and OS kernel for head-unit MCU requiring cold-start execution within 500 ms. IC Role / Device Role / Timing Role: Non-volatile XIP-capable flash providing deterministic 90 ns random reads and 15 ns page reads to meet boot latency budgets. Use Value: Eliminates external SRAM copy step; supports AEC-Q100 Grade 2 qualification (–40°C to +105°C) for under-dash deployment. |
Use Scenario: Holding field-upgradable ladder logic and motion control firmware in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: High-endurance (100K cycles), sector-erasable memory enabling safe over-the-air updates without full reflash downtime. Use Value: Uniform 128-kB sectors simplify update partitioning; hardware ECC ensures integrity of safety-critical control code. |
| Telecom Baseband Configuration Memory | Medical Imaging System Parameter Storage |
Use Scenario: Retaining RF calibration tables, channel profiles, and protocol stacks in 4G/5G small cell baseband processors. IC Role / Device Role / Timing Role: Parallel flash with CFI-compliant interface enabling automatic driver detection and configuration during power-on initialization. Use Value: Versatile I/O (1.65–3.6 V) interfaces directly with 1.8 V FPGA fabric; OTP array secures calibration keys against tampering. |
Use Scenario: Storing FDA-approved imaging parameters, sensor calibration coefficients, and diagnostic logs in portable ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: Long-retention (20 years @ +85°C), AEC-Q100-equivalent industrial-grade flash ensuring data integrity over equipment lifetime. Use Value: Hardware ECC prevents silent corruption of critical calibration data; sector protection prevents accidental overwrite during service mode. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128S10TFI010 | Same die, 56-pin TSOP-56 package; no BGA mechanical footprint compatibility | Lacks VBU BGA's board space efficiency and thermal performance; suitable for legacy PCB redesigns only | Select for through-hole prototyping or cost-sensitive consumer designs where BGA assembly is unavailable |
| MX29GL128FPTI-90G | Macronix 128 Mb parallel NOR; 90 ns tACC but no integrated ECC or OTP array | Requires external ECC implementation and lacks secure key storage - increases firmware complexity and security risk | Choose only if strict cost constraints outweigh reliability and security requirements |
Compared with S29GL128S10DHV010, the TSOP variant trades board-area efficiency for assembly simplicity, while the Macronix alternative sacrifices on-die ECC and OTP security - making the Infineon VBU BGA version optimal for space-constrained, safety-aware embedded systems.
Availability
S29GL128S10DHV010 is available at Aetrix Electronics and suitable for automotive infotainment boot loaders, industrial PLC firmware storage, and telecom baseband configuration memory requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL128S10DHV010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with leadership in flash memory for mission-critical embedded systems.
The GL-S family targets high-reliability embedded applications demanding XIP performance, robust data integrity, and extended temperature operation - specifically engineered for automotive, industrial, and telecom infrastructure where firmware persistence and security are non-negotiable.
FAQ
Does S29GL128S10DHV010 support execute-in-place (XIP) operation?
Yes. The device supports true XIP with 90 ns random access and 15 ns page-mode reads, enabling direct instruction execution from flash without copying to RAM. Its asynchronous interface and deterministic timing allow tight integration with ARM Cortex-M and RISC-V cores requiring low-latency boot code access.
What is the function of the VIO pin, and how does it differ from VCC?
VIO supplies power exclusively to input/output buffers and operates independently from VCC (core logic/memory array supply). It accepts 1.65 V to 3.6 V, allowing direct interface with 1.8 V or 3.3 V host processors without level shifters - unlike VCC, which must be 3.0 V ±0.3 V for proper internal voltage generation and memory operation.
How is the 512-byte write buffer utilized during programming?
The buffer accepts up to 256 words (512 bytes) in a single burst write, then executes internal programming autonomously. Host software issues one buffer-load command followed by a program-confirm command; the device manages timing, verify, and ECC write internally - reducing host CPU overhead and improving effective throughput to 1.5 MBps.
Can the OTP array be reprogrammed after locking?
No. Once either of the two 512-byte OTP regions is locked via the appropriate command sequence, its contents become permanently immutable. Locking is irreversible and enforced by on-die fuses; unlocked regions remain programmable until explicitly locked, supporting phased key injection and calibration workflows.
S29GL128S10DHV010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL128S10DHV010 FAQ
1.How can I place an order for S29GL128S10DHV010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128S10DHV010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128S10DHV010 reliable?
The price and inventory of S29GL128S10DHV010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10DHV010 is usually 5 days.
3.What payment methods are accepted for S29GL128S10DHV010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S10DHV010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL128S10DHV010?
S29GL128S10DHV010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL128S10DHV010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL128S10DHV010?
For technical support, including S29GL128S10DHV010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10DHV010 requirements.
6.How does Aetrix verify that S29GL128S10DHV010 is sourced from the original manufacturer or authorized distributors?
All S29GL128S10DHV010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10DHV010 meets industry standards.
7.What is the process for return or replacement of S29GL128S10DHV010?
All S29GL128S10DHV010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10DHV010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128S10DHV010 part is unused and in its original packaging.
Return procedure for S29GL128S10DHV010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL128S10DHV010 Tags
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M24C02-WMN6TP
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