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Infineon Technologies S29GL128S10DHV013
- Part No.:
- S29GL128S10DHV013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL128S10DHV013.pdf
- Description:
- IC FLASH 128MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,248
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Product details
Overview
S29GL128S10DHV013 from Infineon is a 128 Mb (16 MB), 3.0 V core, parallel-interface MIRRORBIT™ Eclipse flash memory with ×16 data bus, 90 ns random access time, 15 ns page access time, and 128-kbyte uniform sector erase architecture. It operates across –40°C to +85°C (industrial grade) and supports embedded boot code storage in microcontroller-based systems requiring XIP capability and high reliability.
For engineers reviewing the S29GL128S10DHV013 datasheet, S29GL128S10DHV013 pinout, S29GL128S10DHV013 application, or S29GL128S10DHV013 equivalent, key selection criteria include its 512-byte write buffer throughput (1.5 MBps), internal hardware ECC for single-bit error correction, versatile I/O (1.65 V to VCC), and AEC-Q100 grade 3 qualification for automotive control modules.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A22), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume functionality and status reporting via RY/BY# pin, status register, or data polling.
The flash array uses 65 nm MIRRORBIT™ Eclipse technology with uniform 128-kbyte sectors, OTP array (1024 bytes, two lockable regions), and advanced sector protection (volatile/non-volatile). It delivers 100,000 program/erase cycles and 20-year data retention under industrial temperature conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 128 Mb (16 MB); supports full firmware image storage for mid-tier MCUs |
| Interface Type | Asynchronous parallel ×16; enables direct XIP execution without external buffering |
| Random Access Time | 90 ns at VCC = VIO; meets real-time boot latency requirements for industrial controllers |
| Page Access Time | 15 ns; accelerates sequential instruction fetch within same 32-byte aligned page |
| Write Buffer Size | 512 bytes; reduces effective programming time by batching up to 256 words per operation |
| ECC Support | Internal hardware single-bit error correction; eliminates need for external ECC logic |
| Endurance & Retention | 100,000 program/erase cycles / 20 years data retention; validated for long-life embedded deployments |
Pinout & Package
Package: 56-ball VBU Fortified BGA (9 mm × 7 mm, 0.8 mm pitch), RoHS-compliant, industrial temperature grade (–40°C to +85°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address Inputs | 23-bit word address bus; A22 is MSB for 128 Mb (2²³ × 16 bits) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports 1.65 V to VCC versatile I/O voltage range |
| CE# | Chip Enable | Active-low device select; controls power state and command latching timing (tCE = 90 ns) |
| OE# | Output Enable | Active-low read strobe; gates output drivers during asynchronous read (tOE = 25 ns) |
| WE# | Write Enable | Active-low control for write/program operations; used with CE# and OE# to define bus cycle type |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low during embedded program/erase, high when idle or ready |
| RESET# | Hardware Reset | Active-low asynchronous reset; forces device into reading state and clears internal state machines |
| VCC | Core Supply | 3.0 V supply (2.7–3.6 V); powers core logic, array, and EAC - no separate VPP required |
| VIO | I/O Supply | Independent I/O voltage (1.65–VCC); allows interfacing with 1.8 V or 3.3 V host buses |
| WP# | Write Protect | Hardware sector protection enable; active-low input that locks protected sectors against accidental writes |
Key Features
| Feature | Design Value |
|---|---|
| 65 nm MIRRORBIT™ Eclipse process | Enables higher density and lower power vs. legacy 90 nm flash; reduces die size and leakage current |
| 512-byte programming buffer | Improves effective write speed to 1.5 MBps - 3× faster than single-word programming |
| Uniform 128-kbyte sectors | Simplifies firmware partitioning and OTA update management with deterministic erase granularity |
| Internal hardware ECC | Corrects single-bit errors on-the-fly without CPU intervention or software overhead |
| OTP array with dual lockable regions | Secures bootloader keys or calibration data; each 512-byte region independently lockable permanently |
Applications
| Industrial PLC Firmware Storage | Automotive Body Control Module (BCM) |
|---|---|
Use Scenario: Storing boot firmware and configuration tables in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Non-volatile XIP-capable code storage; provides sub-100 ns instruction fetch latency for deterministic real-time task scheduling. Use Value: Eliminates external SRAM copy step during boot; reduces BOM count and improves system-level MTBF via 20-year data retention. | Use Scenario: Holding calibrated sensor parameters and low-level driver code in AEC-Q100 grade 3 BCMs operating at –40°C to +85°C. IC Role / Device Role / Timing Role: Automotive-grade flash memory with hardware write protection and ECC; ensures functional safety compliance for ASIL-B subsystems. Use Value: Prevents corruption of critical calibration data during vehicle power cycling; supports ISO 26262 diagnostic coverage via status register monitoring. |
| Medical Diagnostic Imaging Boot Loader | Network Router Boot Image Storage |
Use Scenario: Hosting secure boot loader and FPGA configuration bitstreams in portable ultrasound and MRI control units. IC Role / Device Role / Timing Role: Trusted boot source with OTP-locked cryptographic keys; verified via CFI parameter table and hardware reset recovery. Use Value: Meets IEC 62304 Class C software requirements through tamper-resistant storage and 100,000-cycle endurance for field updates. | Use Scenario: Storing primary and fallback U-Boot images and Linux kernel in carrier-grade edge routers with hot-swap power supplies. IC Role / Device Role / Timing Role: High-reliability parallel flash with suspend/resume during power transients; maintains data integrity during brown-out events. Use Value: Enables zero-downtime firmware rollback using dual-sector mapping and sector protection, reducing mean time to repair (MTTR). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128P10TFV010 | Same density and core voltage, but 48-pin TSOP package and no VBU BGA footprint compatibility | Limited to space-constrained PCBs without BGA assembly capability; lacks 56-ball VBU mechanical robustness | Select only if TSOP rework infrastructure exists and thermal cycling demands are moderate |
| MX29GL128FPTI-90G | Macronix part with 90 ns access, but no integrated ECC and only 10,000 erase cycles | Requires external error handling logic; unsuitable for safety-critical or high-update-frequency use cases | Consider only for cost-sensitive non-safety applications where firmware update frequency is low |
Compared with S29GL128P10TFV010 and MX29GL128FPTI-90G, the S29GL128S10DHV013 offers superior reliability (100K cycles, ECC, OTP), automotive qualification, and BGA packaging optimized for vibration-prone environments - making it the preferred choice for industrial and automotive firmware storage.
Availability
S29GL128S10DHV013 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive body control modules, and medical diagnostic imaging boot loader applications requiring stable component supply, long-term lifecycle support, and AEC-Q100 compliance.
Supply support for S29GL128S10DHV013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and R&D centers.
The GL-S family targets high-reliability embedded systems needing fast XIP performance and robust data retention; designed specifically for automotive, industrial, and medical applications demanding AEC-Q100 or extended temperature operation.
FAQ
Does S29GL128S10DHV013 support 1.8 V I/O interfaces?
Yes. Its versatile I/O feature supports VIO from 1.65 V to VCC, enabling direct connection to 1.8 V host processors without level shifters. This is confirmed in the datasheet's "Versatile I/O feature" section and electrical specifications table under DC characteristics.
What is the function of the STB pin on this device?
The STB (Strobe) pin is not present on S29GL128S10DHV013. This pin appears only on earlier S29GL-S series variants (e.g., S29GLxxxN). The VBU BGA package for this part uses DQ15–DQ0, A0–A22, CE#, OE#, WE#, RY/BY#, RESET#, WP#, VCC, VIO, and GND - no STB signal is allocated or defined.
Can this flash be used for Execute-in-Place (XIP) operation?
Yes. The GL-S family is explicitly designed for XIP operation, with 90 ns random access time and page-mode reads enabling efficient instruction fetch directly from flash. The datasheet states it "combines the best features of eXecute-In-Place (XIP) and data storage flash memories" and confirms asynchronous read timing suitable for CPU bus interfacing.
Is the OTP array one-time programmable per byte or per region?
The 1024-byte OTP array is divided into two independently lockable 512-byte regions. Programming is byte-wise, but once a region is locked (via dedicated command sequence), all bytes in that region become permanently read-only. Locking is irreversible and hardware-enforced, as specified in Section 3.3 of the datasheet.
S29GL128S10DHV013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL128S10DHV013 FAQ
1.How can I place an order for S29GL128S10DHV013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128S10DHV013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128S10DHV013 reliable?
The price and inventory of S29GL128S10DHV013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10DHV013 is usually 5 days.
3.What payment methods are accepted for S29GL128S10DHV013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S10DHV013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL128S10DHV013?
S29GL128S10DHV013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL128S10DHV013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL128S10DHV013?
For technical support, including S29GL128S10DHV013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10DHV013 requirements.
6.How does Aetrix verify that S29GL128S10DHV013 is sourced from the original manufacturer or authorized distributors?
All S29GL128S10DHV013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10DHV013 meets industry standards.
7.What is the process for return or replacement of S29GL128S10DHV013?
All S29GL128S10DHV013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10DHV013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128S10DHV013 part is unused and in its original packaging.
Return procedure for S29GL128S10DHV013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL128S10DHV013 Tags
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