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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL128S10DHV020

Name: S29GL128S10DHV020
Brand: Infineon Technologies
SKU: S29GL128S10DHV020
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL128S10DHV020

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL128S10DHV020.pdf

Description:: IC FLASH 128MBIT PARALLEL 64FBGA

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Product details

Overview

S29GL128S10DHV020 from Infineon is a 128 Mb (16 MB), 3.0 V core, parallel-interface MIRRORBIT™ Eclipse flash memory with ×16 data bus, 90 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C). It integrates hardware ECC for single-bit error correction, 128-kbyte uniform sector erase, and a 512-byte write buffer-enabling fast in-system programming for boot code storage in embedded microcontroller applications.

For engineers reviewing the S29GL128S10DHV020 datasheet, S29GL128S10DHV020 pinout, S29GL128S10DHV020 application, or S29GL128S10DHV020 equivalent, key selection criteria include asynchronous parallel interface timing compliance, OTP array availability for secure configuration, sector protection granularity, Versatile I/O voltage range (1.65 V to VCC), and AEC-Q100 grade compatibility for automotive control modules.

Technical Context

This device implements an asynchronous parallel flash architecture with XIP-capable read performance: initial random access reads a full 32-byte aligned page, followed by 15 ns sub-page accesses within the same page using low-order address bits only. The embedded algorithm controller (EAC) manages all program/erase operations-including suspend/resume-and interfaces directly with status register, data polling, and RY/BY# signaling.

Hardware ECC operates transparently during read cycles, correcting single-bit errors without software intervention; the 1024-byte OTP array supports two lockable regions for immutable firmware keys or calibration data. Sector protection uses both volatile (lock bits) and non-volatile (ASP) methods per 128-kbyte sector.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	128 Mb (16 MB), organized as 1,048,576 × 16-bit words
Random access time	90 ns at VCC = VIO = 3.0 V - determines worst-case instruction fetch latency
Page access time	15 ns - enables rapid sequential reads within 32-byte aligned pages
Write buffer size	512 bytes - allows single-command programming of up to 256 words, reducing host overhead
ECC capability	Internal hardware single-bit error correction - ensures data integrity without CPU intervention
Endurance & retention	100,000 program/erase cycles; 20-year data retention at 85°C - validated for long-life industrial deployment
Operating voltage	VCC = 2.7 V to 3.6 V; VIO = 1.65 V to VCC - supports mixed-voltage system interfacing
Temperature grade	Industrial (–40°C to +85°C) - qualified per JEDEC JESD22-A108, suitable for factory automation controllers

Pinout & Package

Package: 56-pin TSOP (Type I, 400 mil width), compliant with JEDEC MO-142AB. Pin pitch: 0.5 mm. Body dimensions: 18.4 mm × 10.16 mm × 1.2 mm.

Pin/Terminal	Circuit Role	Design Meaning
A0–A22	Address inputs	23-bit word address bus (AMAX = A22 for 128 Mb); latched on CE# or OE# assertion
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports 1.65 V to VCC I/O voltage via Versatile I/O feature
CE#	Chip enable	Active-low device select; controls power-down entry and access initiation
OE#	Output enable	Active-low read strobe; gates output drivers during read cycles
WE#	Write enable	Active-low control for write/program/erase command latching
RY/BY#	Ready/Busy indicator	Open-drain active-low signal indicating internal operation progress
RESET#	Hardware reset	Active-low asynchronous reset that aborts ongoing operations and clears status registers
WP#	Write protect	Active-low hardware sector protection override for top/bottom sectors

Key Features

Feature	Design Value
Asynchronous page-mode read	32-byte aligned page access with 15 ns intra-page timing - accelerates linear code execution
Embedded Algorithm Controller (EAC)	On-die state machine executing program/erase/suspend/resume without host timing control
Common Flash Interface (CFI)	Standardized parameter table accessible via read commands - enables OS/driver auto-detection
Advanced Sector Protection (ASP)	Volatile and non-volatile lock bits per 128-kbyte sector - supports field-upgrade-safe partitioning
Secure Silicon Region (OTP)	1024-byte one-time-programmable array with two independently lockable regions - stores cryptographic keys or calibration data

Applications

Industrial PLC Firmware Storage

Automotive ECU Boot Memory

Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers operating in factory environments with wide temperature swings.

IC Role / Device Role / Timing Role: Non-volatile parallel boot memory providing XIP-capable instruction fetch with ≤90 ns latency and sector-level update isolation.

Use Value: Enables deterministic startup and field firmware updates without external ECC handling; 100,000-cycle endurance supports decades of maintenance cycles.

Use Scenario: Holding safety-critical boot code and configuration data in engine control units certified to AEC-Q100 Grade 3.

IC Role / Device Role / Timing Role: Automotive-grade parallel flash with hardware ECC and ASP, supporting secure boot verification and OTA update rollback.

Use Value: Meets ISO 26262 ASIL-B requirements via built-in single-bit ECC and lockable OTP region for root-of-trust keys.

Medical Imaging System BIOS

Network Router Boot Image

Use Scenario: Hosting BIOS and FPGA configuration bitstreams in diagnostic imaging equipment requiring high reliability and long-term data retention.

IC Role / Device Role / Timing Role: High-integrity boot memory with 20-year data retention at 85°C and 128-kbyte sector erase for modular firmware updates.

Use Value: Eliminates need for external error-checking logic; OTP array secures calibration constants against accidental overwrite.

Use Scenario: Storing primary bootloader and Linux kernel image in carrier-grade edge routers deployed in uncontrolled ambient conditions.

IC Role / Device Role / Timing Role: Parallel flash with Versatile I/O (1.65 V–3.6 V) interfacing to 1.8 V or 3.3 V SoC buses and RY/BY# status signaling.

Use Value: Reduces BOM count by eliminating level shifters; 512-byte write buffer cuts firmware update time by >4× vs. byte-wise programming.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL128S10TFI010	Same die, 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP package	Used where board space is constrained and BGA assembly is available	Select when footprint reduction and thermal performance outweigh TSOP reworkability needs
MX29GL128FHT2I-90G	Micron 128 Mb parallel NOR; 90 ns access; no integrated ECC; CFI-compliant but no OTP array	Lacks hardware ECC and secure OTP - requires external error management	Choose only if legacy driver support exists and ECC is handled in software or external logic

Compared with S29GL128S10DHV020, the TSOP-packaged Infineon variant offers superior field-serviceability and thermal margin over the LAE BGA alternative, while the Micron part trades ECC and OTP security for broader legacy ecosystem compatibility-making it viable only in non-safety-critical, cost-sensitive designs.

Availability

S29GL128S10DHV020 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ECU boot memory, and medical imaging system BIOS requiring stable component supply across extended product lifecycles.

Supply support for S29GL128S10DHV020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.

The GL-S family targets high-reliability embedded systems needing XIP-capable flash with robust data integrity features-designed specifically for automotive, industrial, and medical applications demanding long-term availability and AEC-Q100 qualification.

FAQ

What is the function of the RY/BY# pin on S29GL128S10DHV020?

The RY/BY# pin is an open-drain, active-low ready/busy indicator. It asserts low during internal program, erase, or suspend operations and returns high when the device is idle or ready to accept new commands. This signal eliminates the need for continuous status register polling and synchronizes host timing with device internal state transitions.

Does S29GL128S10DHV020 support 1.8 V I/O operation?

Yes. The Versatile I/O feature allows VIO to operate from 1.65 V to VCC. With VCC = 3.0 V, VIO can be set to 1.8 V, enabling direct interface to 1.8 V logic families without level shifters-provided timing margins (e.g., tOE = 35 ns under VersatileIO mode) are met in the target design.

How is the 1024-byte OTP array protected from accidental programming?

The OTP array has two independently lockable regions. Once locked via dedicated CFI commands, each region becomes permanently read-only. Locking is irreversible and persists through power cycles. Programming requires explicit unlock sequences and is disabled after lock activation-preventing overwrite during field updates or system resets.

Can S29GL128S10DHV020 replace older S29GL128P devices in existing designs?

No direct drop-in replacement. While pin-compatible in TSOP, the S29GL128S introduces enhanced features including hardware ECC, larger write buffer (512 B vs. 128 B), and updated command set. Firmware and driver updates are required to leverage ECC and suspend/resume functions, and timing parameters differ slightly-especially under Versatile I/O conditions.

S29GL128S10DHV020 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 128Mbit

Memory Organization:: 8M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL128S10DHV020 FAQ

1.How can I place an order for S29GL128S10DHV020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL128S10DHV020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL128S10DHV020 reliable?

The price and inventory of S29GL128S10DHV020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10DHV020 is usually 5 days.

3.What payment methods are accepted for S29GL128S10DHV020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S10DHV020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL128S10DHV020?

S29GL128S10DHV020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL128S10DHV020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL128S10DHV020?

For technical support, including S29GL128S10DHV020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10DHV020 requirements.

6.How does Aetrix verify that S29GL128S10DHV020 is sourced from the original manufacturer or authorized distributors?

All S29GL128S10DHV020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10DHV020 meets industry standards.

7.What is the process for return or replacement of S29GL128S10DHV020?

All S29GL128S10DHV020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10DHV020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL128S10DHV020 part is unused and in its original packaging.

Return procedure for S29GL128S10DHV020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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