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Infineon Technologies S29GL128S10DHV023
- Part No.:
- S29GL128S10DHV023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL128S10DHV023.pdf
- Description:
- IC FLASH 128MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,971
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Product details
Overview
S29GL128S10DHV023 from Infineon is a 128 Mb (16 MB), 3.0 V core, parallel-interface MIRRORBIT™ Eclipse flash memory with ×16 data bus, 90 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C). It integrates hardware ECC for single-bit error correction, 128-kbyte uniform sector erase, and a 512-byte programming buffer-enabling fast embedded code storage and firmware updates in microcontroller boot loaders.
For engineers reviewing the S29GL128S10DHV023 datasheet, S29GL128S10DHV023 pinout, S29GL128S10DHV023 application, or S29GL128S10DHV023 equivalent, key selection criteria include asynchronous parallel interface timing compliance, Versatile I/O voltage support (1.65 V to VCC), OTP array availability, CFI-compatibility for BIOS/UEFI integration, and AEC-Q100 grade options for automotive use cases.
Technical Context
This device implements an asynchronous parallel flash architecture with dedicated X/Y decoders, on-die erase/program voltage generators, and state control logic managing command execution. It supports page-mode read (32-byte aligned, 15 ns subsequent access) and buffer programming (up to 512 bytes per operation), reducing effective write latency versus byte-by-byte algorithms.
The embedded algorithm controller (EAC) handles automatic sector erase, word/multiple-word program, suspend/resume, and status reporting via status register, data polling, or RY/BY# pin. Internal hardware ECC operates transparently during read cycles without software intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 128 Mb (16 MB), organized as 1,048,576 × 16-bit words |
| Random access time | 90 ns at VCC = VIO = 3.0 V - determines minimum CPU wait-state insertion for direct memory-mapped execution |
| Page access time | 15 ns - enables burst reads within 32-byte pages without re-addressing overhead |
| Programming buffer size | 512 bytes - allows single-command multi-word writes, improving firmware update throughput by ~4× vs. standard programming |
| ECC capability | Single-bit error correction per 512-byte sector - ensures data integrity without external error-handling logic |
| Endurance & retention | 100,000 program/erase cycles; 20-year data retention at 85°C - suitable for field-upgradable industrial controllers |
| Operating voltage | VCC = 2.7–3.6 V; VIO = 1.65–VCC - supports mixed-voltage SoC interfaces and low-power standby modes |
Pinout & Package
Package: 56-ball VBU Fortified BGA (9 mm × 7 mm, 0.8 mm pitch), RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 128 Mb addressing (AMAX = A22); word-aligned only |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports Versatile I/O (VIO = 1.65–VCC) |
| CE# | Chip enable | Active-low chip select; controls device power state and command latching |
| OE# | Output enable | Active-low read strobe; gates output drivers during asynchronous read cycles |
| WE# | Write enable | Active-low write strobe; initiates program/erase command sequences |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling internal operation progress (low = busy) |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into known initial state |
| WP# | Write protect | Active-low hardware sector protection override; disables program/erase when asserted |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous page-mode read | 32-byte aligned access with 15 ns subsequent cycle time - eliminates CPU wait states for sequential instruction fetch |
| 512-byte programming buffer | Reduces average program time to ≤1.5 MBps - accelerates field firmware patching in gateways and PLCs |
| Hardware ECC engine | Transparent single-bit correction per 512-byte sector - removes need for external ECC logic in safety-critical boot ROM |
| Advanced sector protection (ASP) | Volatile/non-volatile lock per 128-kB sector - enables secure bootloader partitioning and OTA update rollback protection |
| 1024-byte OTP array | Two lockable regions for immutable keys or calibration data - supports secure boot root-of-trust implementation |
Applications
| Industrial PLC Firmware Storage | Automotive Instrument Cluster Boot ROM |
|---|---|
|
Use Scenario: Storing real-time control firmware and configuration tables in programmable logic controllers requiring field updates and long-term reliability. IC Role / Device Role / Timing Role: Non-volatile boot memory mapped directly to MCU address space; provides XIP-capable instruction fetch with ≤90 ns latency. Use Value: 100,000 erase cycles and 20-year retention ensure >15-year deployment without replacement; ASP enables safe dual-bank firmware switching. |
Use Scenario: Hosting boot code and graphics assets for digital instrument clusters operating across –40°C to +105°C ambient ranges. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 compliant parallel flash providing deterministic startup timing and EMI-robust read performance. Use Value: Hardware ECC prevents silent corruption of critical boot images; OTP stores cryptographic keys for secure boot verification. |
| Medical Imaging System BIOS | Telecom Base Station Configuration Memory |
|
Use Scenario: Storing diagnostic firmware, calibration parameters, and regulatory-compliant boot images in FDA-cleared imaging equipment. IC Role / Device Role / Timing Role: CFI-compliant flash enabling standardized BIOS initialization and runtime parameter updates via JTAG or PCIe host interface. Use Value: Common Flash Interface table allows plug-and-play compatibility with UEFI firmware stacks; sector protection prevents accidental overwrite during service. |
Use Scenario: Holding FPGA configuration bitstreams and radio subsystem calibration profiles in 5G baseband units with strict thermal management. IC Role / Device Role / Timing Role: High-reliability parallel flash interfaced to ARM-based management processors; supports hot-swap firmware reload without system reset. Use Value: 512-byte buffer programming enables <500 ms configuration reload; standby current of 100 µA minimizes idle power in distributed RRUs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128P10TFV020 | Same density and timing, but TSOP-56 package (not BGA); no OTP array; lacks Versatile I/O (VIO fixed to VCC) | Preferred for cost-sensitive consumer electronics with PCB space for through-hole mounting and simpler voltage rail design | Select when board layout favors TSOP, VIO = VCC suffices, and OTP is unnecessary |
| MX29GL128FPTI-90G | Macronix part; 90 ns access, 512-byte buffer, but no hardware ECC; CFI-compatible; same VBU BGA footprint | Suitable for non-safety-critical applications where software ECC or external error detection is acceptable | Select when ECC is handled externally and supply chain diversification is required |
Compared with S29GL128P10TFV020 and MX29GL128FPTI-90G, the S29GL128S10DHV023 uniquely delivers integrated ECC, OTP security, and Versatile I/O in the compact VBU BGA-making it optimal for space-constrained, safety-aware embedded systems requiring zero-error boot integrity.
Availability
S29GL128S10DHV023 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot ROM, and medical imaging system BIOS requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL128S10DHV023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive ICs, and secure embedded solutions, with global manufacturing and quality certifications including IATF 16949 and ISO 9001.
The GL-S family targets high-reliability embedded systems needing deterministic parallel flash performance, robust data integrity, and automotive-grade qualification-designed specifically for boot code, firmware, and configuration storage in mission-critical environments.
FAQ
Does S29GL128S10DHV023 support execute-in-place (XIP) operation?
Yes. The device supports true XIP with ≤90 ns random access time and page-mode read (15 ns subsequent access), enabling direct CPU instruction fetch from flash without copying to RAM. Its asynchronous interface and deterministic timing meet real-time OS requirements for industrial control applications.
What is the function of the STB pin on S29GL128S10DHV023?
The STB (Strobe) pin is not present on this variant. S29GL128S10DHV023 uses the standard parallel NOR interface with CE#, OE#, and WE# control signals only. STB appears in older S29GL-S series variants but was removed in the GL-S generation; its functionality is fully absorbed by the enhanced command set and RY/BY# status signaling.
Can the 1024-byte OTP array be reprogrammed after locking?
No. Once either OTP region is locked via the appropriate CFI command sequence, it becomes permanently read-only. Each region supports one-time programming of up to 512 bytes; locking is irreversible and enforced by on-die fuses. This ensures cryptographic keys or calibration data remain tamper-proof throughout device life.
Is S29GL128S10DHV023 compatible with legacy S29GL128N devices?
No. While both are 128 Mb parallel NOR flashes, S29GL128S10DHV023 uses the newer MIRRORBIT™ Eclipse architecture with different command sets, timing parameters, and ECC implementation. Pinout differs (VBU BGA vs. TSOP), and CFI query responses are not identical-requiring firmware and driver updates for migration.
S29GL128S10DHV023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL128S10DHV023 FAQ
1.How can I place an order for S29GL128S10DHV023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128S10DHV023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128S10DHV023 reliable?
The price and inventory of S29GL128S10DHV023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10DHV023 is usually 5 days.
3.What payment methods are accepted for S29GL128S10DHV023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S10DHV023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL128S10DHV023?
S29GL128S10DHV023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL128S10DHV023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL128S10DHV023?
For technical support, including S29GL128S10DHV023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10DHV023 requirements.
6.How does Aetrix verify that S29GL128S10DHV023 is sourced from the original manufacturer or authorized distributors?
All S29GL128S10DHV023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10DHV023 meets industry standards.
7.What is the process for return or replacement of S29GL128S10DHV023?
All S29GL128S10DHV023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10DHV023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128S10DHV023 part is unused and in its original packaging.
Return procedure for S29GL128S10DHV023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL128S10DHV023 Tags
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