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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL128S10FAIV10

Name: S29GL128S10FAIV10
Brand: Infineon Technologies
SKU: S29GL128S10FAIV10
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL128S10FAIV10

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL128S10FAIV10.pdf

Description:: IC FLASH 128MBIT PARALLEL 64FBGA

Quantity:: RFQ Add To RFQ list

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Inventory:2,638

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Product details

Overview

S29GL128S10FAIV10 from Spansion is a 128-Mbit (16 MB) 3.0 V-only page-mode NOR Flash memory IC fabricated on 65 nm MirrorBit Eclipse process technology, featuring 100 ns random access time, industrial temperature range (–40°C to +85°C), and Fortified BGA package (LAA064, 11 mm × 13 mm). It supports sector protection, password-protected boot-block locking, and is used in firmware storage for industrial controllers and network edge devices.

For engineers reviewing the S29GL128S10FAIV10 datasheet, S29GL128S10FAIV10 pinout, S29GL128S10FAIV10 application, or S29GL128S10FAIV10 equivalent, key selection criteria include VIO/VCC flexibility (1.65–3.6 V I/O with 2.7–3.6 V core), sector-based write protection configuration, boot-block security modes (DYB power-up state and PPB/Read Password), and industrial-grade reliability under extended thermal cycling.

Technical Context

This device implements a synchronous/asynchronous dual-mode interface compatible with standard x16 parallel NOR bus protocols. It integrates embedded erase and program algorithms with status register polling and ready/busy output for host coordination.

Memory organization is structured as 128 Mbit = 8 M × 16, with uniform 128 KB sectors and configurable boot-block architecture (top/bottom 64 KB). Sector protection is implemented via hardware lock bits and software-controlled Data# Polling (DQ7) and Toggle Bit (DQ6) status feedback.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	128 Mbit (16 MB), organized as 8 M × 16-bit wide data bus
Access Time	100 ns max random access - determines minimum CPU wait-state insertion for legacy microcontrollers
Supply Voltage	VCC = 2.7–3.6 V; VIO = 1.65–VCC - enables mixed-voltage system interfacing with 1.8 V or 3.3 V logic
Operating Temp	–40°C to +85°C industrial grade - validated for use in uncontrolled ambient environments like factory-floor gateways
Package	LAA064 Fortified BGA, 11 mm × 13 mm, 64-ball array - supports high-density PCB layout with improved thermal dissipation vs. TSOP
Write Protection	Hardware sector lock + software-configurable DYB/PPB modes - enables secure boot code partitioning and field firmware update safety

Pinout & Package

Package: LAA064 Fortified Ball-Grid Array (64-ball, 0.8 mm pitch, 11 mm × 13 mm body, RoHS-compliant Pb-free).

Pin/Terminal	Circuit Role	Design Meaning
A0–A20	Address Inputs	21-bit address bus supporting full 8 M-word addressing; A0 selects LSB within 16-bit word
DQ0–DQ15	Data Inputs/Outputs	16-bit bidirectional data bus; supports byte-wide access via BYTE# control
CE#, OE#, WE#	Chip Enable / Output Enable / Write Enable	Standard asynchronous NOR control signals; active-low, TTL-compatible thresholds
RY/BY#	Ready/Busy Output	Open-drain status signal indicating internal program/erase operation progress
VCC, VIO, GND	Power Supplies	Separate core (VCC) and I/O (VIO) rails enable voltage translation without level shifters

Key Features

Feature	Design Value
MirrorBit Eclipse Technology	65 nm process enabling higher density, lower power consumption, and improved data retention (>20 years at 85°C)
Password-Protected Boot Block	Configurable top/bottom 64 KB sector with PPB or Read Password mode - prevents unauthorized firmware overwrite during field updates
Dual-Voltage I/O Support	VIO = 1.65–VCC allows direct interface to 1.8 V microcontrollers while maintaining 3.3 V core stability
Uniform Sector Architecture	128 × 128 KB sectors simplify firmware partitioning and wear leveling in bootloader+application layouts

Applications

Industrial PLC Firmware Storage

Telecom Edge Router Boot Code

Use Scenario: Storing firmware images and configuration tables in programmable logic controllers deployed in factory automation lines.

IC Role / Device Role / Timing Role: Nonvolatile program memory mapped into microcontroller address space; accessed asynchronously during cold boot and firmware recovery.

Use Value: Industrial temperature rating and sector-lock security ensure reliable operation across thermal cycles and prevent accidental corruption of critical ladder logic.

Use Scenario: Holding boot ROM, FPGA bitstreams, and failover OS images in carrier-class edge routers operating in telecom central offices.

IC Role / Device Role / Timing Role: Primary boot device providing deterministic 100 ns read latency to ARM Cortex-A9 host processor during power-on initialization.

Use Value: Dual-voltage I/O eliminates need for external level shifters when interfacing with 1.8 V SoC buses, reducing BOM count and board area.

Medical Diagnostic Equipment BIOS

Automotive ADAS Camera Module

Use Scenario: Storing UEFI-compatible BIOS and calibration data in portable ultrasound and MRI control units requiring long-term data integrity.

IC Role / Device Role / Timing Role: Secure, write-protected nonvolatile memory holding signed firmware and sensor calibration coefficients accessed at startup and runtime.

Use Value: PPB password mode ensures only authenticated service tools can modify boot parameters, meeting IEC 62304 Class C software safety requirements.

Use Scenario: Hosting camera firmware and lens calibration profiles in automotive surround-view systems operating near engine compartments.

IC Role / Device Role / Timing Role: NOR Flash memory directly interfaced to TI TDA3x SoC for fast boot and real-time firmware patch loading.

Use Value: –40°C to +85°C rating and robust sector protection maintain functional safety (ISO 26262 ASIL-B) during thermal transients in under-hood environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NOR Flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
Cypress S29GL128S10TFI010	Same die, TSOP-56 package (14 mm × 20 mm), no VIO flexibility (VIO = VCC only)	Preferred where board space allows larger footprint and no mixed-voltage interface needed	Select for cost-sensitive consumer designs with standard PCB assembly processes
Infineon S29GL128S10DHIV10	Identical specs but manufactured post-Spansion acquisition; same LAA064 BGA, identical timing and command set	No functional difference; qualified for same industrial applications with updated lifecycle documentation	Choose for new designs requiring Infineon's long-term supply assurance and updated quality reporting

Compared with S29GL128S10FAIV10, the TSOP variant trades compact BGA packaging and VIO flexibility for lower assembly cost, while the Infineon version offers identical performance with updated support infrastructure-making the original ideal for space-constrained, mixed-voltage industrial systems requiring legacy compatibility.

Availability

S29GL128S10FAIV10 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, telecom edge router boot code, and medical diagnostic equipment BIOS requiring stable component supply across extended product lifecycles.

Supply support for S29GL128S10FAIV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Spansion Inc. was a leading provider of flash memory solutions, later acquired by Cypress Semiconductor and subsequently integrated into Infineon Technologies. It specialized in high-reliability NOR Flash for embedded systems.

This part belongs to the S29GL-S MirrorBit Eclipse NOR Flash product line, designed specifically for deterministic boot performance, secure firmware storage, and long-term data retention in industrial, networking, and medical applications.

FAQ

What is the VIO voltage range supported by S29GL128S10FAIV10?

The device supports VIO = 1.65 V to VCC, where VCC operates from 2.7 V to 3.6 V. This allows direct interfacing with 1.8 V logic families without external level shifters, while maintaining full 3.3 V core functionality for reliable program/erase operations.

Does S29GL128S10FAIV10 support hardware write protection independent of software commands?

Yes - it includes hardware-based sector protection using dedicated lock bits per 128 KB sector. These bits are set via hardware programming (not volatile registers) and persist through power cycles, providing tamper-resistant firmware partitioning even if software fails or is compromised.

How does the DYB (Device Year Byte) power-up state affect boot security?

DYB power-up state determines whether protected sectors are locked or unlocked immediately after reset. Configurations V1/V2 default to highest/lowest sector protected; S5–S8 add PPB or Read Password enforcement - ensuring boot code remains inaccessible until authenticated, preventing unauthorized firmware execution at power-on.

Is the LAA064 BGA package lead-free and RoHS compliant?

Yes - the LAA064 package is Pb-free and RoHS compliant, with NiPdAu surface finish on solder balls. It meets JEDEC J-STD-020D moisture sensitivity level 3 (MSL-3) and supports standard reflow profiles up to 260°C peak temperature.

S29GL128S10FAIV10 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 128Mbit

Memory Organization:: 8M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (13x11)

S29GL128S10FAIV10 FAQ

1.How can I place an order for S29GL128S10FAIV10 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL128S10FAIV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL128S10FAIV10 reliable?

The price and inventory of S29GL128S10FAIV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10FAIV10 is usually 5 days.

3.What payment methods are accepted for S29GL128S10FAIV10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S10FAIV10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL128S10FAIV10?

S29GL128S10FAIV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL128S10FAIV10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL128S10FAIV10?

For technical support, including S29GL128S10FAIV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10FAIV10 requirements.

6.How does Aetrix verify that S29GL128S10FAIV10 is sourced from the original manufacturer or authorized distributors?

All S29GL128S10FAIV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10FAIV10 meets industry standards.

7.What is the process for return or replacement of S29GL128S10FAIV10?

All S29GL128S10FAIV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10FAIV10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL128S10FAIV10 part is unused and in its original packaging.

Return procedure for S29GL128S10FAIV10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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