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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL128S10FAIV23

Name: S29GL128S10FAIV23
Brand: Infineon Technologies
SKU: S29GL128S10FAIV23
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL128S10FAIV23

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL128S10FAIV23.pdf

Description:: IC FLASH 128MBIT PARALLEL 64FBGA

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Product details

Overview

S29GL128S10FAIV23 from Spansion is a 128-Mbit (16 MB) 3.0 V-only page-mode NOR Flash memory IC fabricated on 65 nm MirrorBit Eclipse process technology, featuring 100 ns random access time, industrial temperature range (–40°C to +85°C), and Fortified BGA package (LAA064, 11 mm × 13 mm). It supports sector protection, password-protected boot-block locking, and is used in firmware storage for industrial controllers and network edge devices.

For engineers reviewing the S29GL128S10FAIV23 datasheet, S29GL128S10FAIV23 pinout, S29GL128S10FAIV23 application, or S29GL128S10FAIV23 equivalent, key selection criteria include VIO/VCC voltage flexibility (1.65–3.6 V), DYB power-up state configuration (V2 = lowest-sector protected, unprotected at power-up), and industrial-grade reliability for embedded boot code retention.

Technical Context

This device implements a parallel asynchronous interface with address/data multiplexing support, compatible with standard x16 bus architectures. It integrates embedded erase and program algorithms with status register polling and ready/busy output for host coordination.

Memory organization is 8 M × 16-bit, with uniform 128-KB sectors and configurable boot-block protection. The V2 suffix denotes VIO = 1.65–VCC, VCC = 2.7–3.6 V, lowest-address sector permanently protected, and Device Protection Bits (DYB) initialized to unprotected state at power-on.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	128 Mbit (16 MB), organized as 8 M × 16-bit for direct microprocessor bus interfacing
Access Time	100 ns max random access - ensures compatibility with 10 MHz CPU read cycles without wait states
Supply Voltage	VCC = 2.7–3.6 V, VIO = 1.65–VCC - enables mixed-voltage system integration with 1.8 V I/O domains
Operating Temp	–40°C to +85°C industrial grade - qualified for uncontrolled ambient environments in factory automation
Package	LAA064 Fortified BGA, 11 mm × 13 mm, 64-ball - provides mechanical robustness and thermal performance for reflow-soldered PCBs
Protection Mode	V2 configuration: lowest 128 KB sector hardware-locked, DYB bits reset to unprotected at power-up - balances security and field-upgrade flexibility
Process Tech	65 nm MirrorBit Eclipse - delivers higher density and lower power vs prior 90 nm generation while maintaining NOR reliability

Pinout & Package

Package: Fortified Ball-Grid Array (LAA064), 64-ball, 0.8 mm pitch, 11 mm × 13 mm body, RoHS-compliant Pb-free construction.

Pin/Terminal	Circuit Role	Design Meaning
A0–A20	Address Inputs	21-bit address bus supporting full 8 M-word addressing; A0 is LSB for x16 data width
DQ0–DQ15	Data I/O	16-bit bidirectional data bus with internal tristate control during read/write/erase operations
CE#	Chip Enable	Active-low enable controlling device selection; must be asserted before OE#/WE# for valid access
OE#	Output Enable	Active-low control for data bus output drivers; used during read cycles only
WE#	Write Enable	Active-low signal initiating write, program, or erase command sequences via command register
RY/BY#	Ready/Busy Output	Open-drain status indicator: high = ready, low = internal operation in progress (erase/program)
VCC, VIO	Power Supplies	Separate core (VCC) and I/O (VIO) rails allow independent voltage scaling and noise isolation
WP#/ACC	Write Protect / Acceleration	WP# hardware locks top/bottom sectors; ACC enables high-voltage program acceleration mode

Key Features

Feature	Design Value
Uniform Sector Architecture	128 KB sectors enable granular firmware updates without erasing entire device - reduces field upgrade time and risk
Password-Protected Boot Block	V2 config uses hardware lock on lowest sector plus software-controlled DYB bits - prevents accidental overwrite of bootloader while allowing application partition reprogramming
MirrorBit Eclipse Technology	Two-bit-per-cell storage in 65 nm process increases density without compromising read latency or endurance - extends product lifecycle vs legacy NOR
VIO/VCC Flexibility	Independent 1.65–3.6 V I/O rail supports interoperability with 1.8 V FPGAs and 3.3 V microcontrollers in same system
Industrial Temperature Range	–40°C to +85°C qualification ensures stable timing margins and data retention over full operating life in harsh enclosures

Applications

Industrial PLC Firmware Storage

Network Router Boot Image

Use Scenario: Storing firmware and configuration data in programmable logic controllers deployed in factory-floor cabinets with wide ambient swings.

IC Role / Device Role / Timing Role: Nonvolatile boot memory providing deterministic 100 ns read access to initialization code for ARM Cortex-M7 MCU during cold start.

Use Value: V2 configuration ensures bootloader integrity via hardware-locked lowest sector while enabling field updates to application partitions via software-controlled DYB.

Use Scenario: Holding boot loader and fail-safe recovery image in enterprise-grade Layer 3 routers requiring zero-downtime firmware rollback.

IC Role / Device Role / Timing Role: Parallel NOR Flash directly mapped into MIPS processor address space for XIP (eXecute-In-Place) execution of boot code.

Use Value: 65 nm MirrorBit Eclipse process delivers >100K program/erase cycles and 20-year data retention - exceeds carrier-grade reliability requirements.

Medical Diagnostic Equipment BIOS

Automotive ADAS Camera Module

Use Scenario: Storing BIOS and calibration tables in ultrasound and MRI subsystems where data integrity is safety-critical.

IC Role / Device Role / Timing Role: Secure nonvolatile memory with password-protected boot block preventing unauthorized modification of startup routines.

Use Value: VIO = 1.65–VCC allows direct interface to 1.8 V FPGA configuration logic while maintaining 3.3 V core for noise immunity.

Use Scenario: Firmware storage in surround-view camera ECUs operating inside vehicle cabin with thermal cycling between –40°C and +85°C.

IC Role / Device Role / Timing Role: Industrial-temperature NOR Flash providing guaranteed read access during cold crank and hot soak conditions.

Use Value: LAA064 fortified BGA package resists mechanical stress from vibration and thermal expansion mismatch in automotive PCB assemblies.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NOR Flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL128S90FAIV23	90 ns access time (vs 100 ns); identical V2 configuration, package, and feature set	Enables tighter timing margins in high-speed bus designs; requires validation of setup/hold times with host controller	Select when system clock frequency exceeds 12.5 MHz and timing closure requires faster read latency
S29GL128S10FAI023	V02 configuration: same VCC/VIO range but lowest-sector protection disabled; DYB power-up state unchanged	Lacks hardware boot-block lock - suitable for systems using external secure boot or software-only protection schemes	Choose when bootloader integrity is enforced by external HSM or firmware signing, not hardware sector lock

Compared with S29GL128S90FAIV23, this part trades 10 ns speed for broader timing margin tolerance; versus S29GL128S10FAI023, it adds hardware-enforced boot security at no cost to power or footprint - critical for safety-certifiable systems.

Availability

S29GL128S10FAIV23 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, network router boot image retention, and medical diagnostic equipment BIOS requiring stable component supply across extended product lifecycles.

Supply support for S29GL128S10FAIV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Spansion Inc. was a fabless semiconductor company specializing in flash memory and microcontrollers, formed from the flash division of AMD and Fujitsu, later acquired by Cypress Semiconductor in 2015.

The S29GL-S family targets high-reliability embedded systems requiring deterministic NOR Flash performance, emphasizing sector protection, long data retention, and industrial temperature operation for mission-critical firmware storage.

FAQ

What does the 'V2' suffix indicate in S29GL128S10FAIV23?

The 'V2' suffix specifies three key electrical and functional attributes: (1) VIO voltage range is 1.65 V to VCC, (2) VCC operates from 2.7 V to 3.6 V, (3) the lowest 128 KB sector is hardware-protected, and (4) Device Protection Bits (DYB) power up in the unprotected state. This configuration balances security and field-upgrade capability for industrial firmware applications.

Is S29GL128S10FAIV23 pin-compatible with other S29GL-S family members?

Yes - all S29GL-S devices in the LAA064 Fortified BGA package share identical 64-ball pinout, including S29GL01GS, S29GL512S, S29GL256S, and S29GL128S variants. Address/data bus width (x16), control signal assignment (CE#, OE#, WE#), and power pin locations are fully consistent, enabling drop-in replacement within same density and speed grade.

Does this device support execute-in-place (XIP) operation?

Yes - S29GL128S10FAIV23 supports true XIP operation due to its fast 100 ns random access time and asynchronous parallel interface. When mapped into a processor's memory space, instruction fetches occur directly from Flash without copying to RAM, reducing boot time and SRAM usage in resource-constrained embedded systems.

What is the endurance and data retention specification?

Per Spansion documentation, S29GL128S10FAIV23 guarantees ≥100,000 program/erase cycles per sector and ≥20 years of data retention at 85°C. These values are validated across the full industrial temperature range and apply to all sectors, including the hardware-protected boot block in V2 configuration.

S29GL128S10FAIV23 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 128Mbit

Memory Organization:: 8M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (13x11)

S29GL128S10FAIV23 FAQ

1.How can I place an order for S29GL128S10FAIV23 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL128S10FAIV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL128S10FAIV23 reliable?

The price and inventory of S29GL128S10FAIV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10FAIV23 is usually 5 days.

3.What payment methods are accepted for S29GL128S10FAIV23?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S10FAIV23 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL128S10FAIV23?

S29GL128S10FAIV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL128S10FAIV23 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL128S10FAIV23?

For technical support, including S29GL128S10FAIV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10FAIV23 requirements.

6.How does Aetrix verify that S29GL128S10FAIV23 is sourced from the original manufacturer or authorized distributors?

All S29GL128S10FAIV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10FAIV23 meets industry standards.

7.What is the process for return or replacement of S29GL128S10FAIV23?

All S29GL128S10FAIV23 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10FAIV23, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL128S10FAIV23 part is unused and in its original packaging.

Return procedure for S29GL128S10FAIV23:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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