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Infineon Technologies S29GL128S10FHB010
- Part No.:
- S29GL128S10FHB010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL128S10FHB010.pdf
- Description:
- IC FLASH 128MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,673
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Product details
Overview
S29GL128S10FHB010 from Infineon is a 128 Mb (16 MB), 3.0 V core, parallel-interface MIRRORBIT™ Eclipse flash memory with ×16 data bus, 90 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C). It integrates hardware ECC for single-bit error correction, 128-kbyte uniform sector erase, and a 512-byte programming buffer-used in boot code storage for industrial microcontroller-based systems requiring reliable non-volatile program execution.
For engineers reviewing the S29GL128S10FHB010 datasheet, S29GL128S10FHB010 pinout, S29GL128S10FHB010 application, or S29GL128S10FHB010 equivalent, key selection criteria include asynchronous parallel interface timing, Versatile I/O voltage range (1.65 V to VCC), OTP array support, CFI compliance, and AEC-Q100 grade 3 eligibility in automotive variants.
Technical Context
This device implements an asynchronous parallel flash architecture with dedicated X/Y decoders, on-die erase/program voltage generators, and state control logic managing embedded algorithms. It supports page-mode reads (32-byte aligned, 15 ns subsequent access) and buffer programming up to 512 bytes per operation.
The internal ECC engine operates transparently during read cycles, correcting single-bit errors in real time without software intervention. Sector protection includes volatile (lock bits) and non-volatile (ASP) methods, and the device features dual lockable 512-byte OTP regions for secure configuration storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 128 Mb (16 MB), organized as 1,048,576 × 16-bit words |
| Random access time | 90 ns at VCC = VIO = 3.0 V - determines worst-case instruction fetch latency |
| Page access time | 15 ns - enables fast sequential reads within 32-byte aligned pages |
| Programming buffer | 512 bytes - reduces effective programming time by batching writes |
| ECC capability | Single-bit error correction per 512-byte sector - ensures data integrity without host SW overhead |
| Endurance & retention | 100,000 program/erase cycles; 20-year data retention at 85°C - validated for long-life embedded deployments |
| Operating voltage | VCC = 2.7–3.6 V; VIO = 1.65–VCC - supports mixed-voltage system interfacing |
Pinout & Package
Package: 56-pin TSOP (Type I, standard thin small outline package) with 0.5 mm pitch, JEDEC MO-141AC compliant. Pin count and layout match industry-standard parallel NOR flash footprints.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | 23-bit word address bus (AMAX = A22 for 128 Mb); latched on CE# or OE# assertion |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports 1.65–3.6 V I/O voltage via VIO pin |
| CE# | Chip enable | Active-low device select; controls power-down and command latch timing |
| OE# | Output enable | Active-low read strobe; gates output drivers during asynchronous reads |
| WE# | Write enable | Active-low write strobe; initiates command sequences and data loading |
| RY/BY# | Ready/Busy indicator | Open-drain status signal; low during embedded program/erase operations |
| WP# | Write protect | Hardware sector protection enable; active-low, tied high for normal operation |
| VCC | Core supply | 3.0 V nominal core voltage (2.7–3.6 V); powers logic and memory array |
| VIO | I/O supply | Independent I/O voltage rail (1.65–VCC); enables mixed-signal SoC interfacing |
| RESET# | Hardware reset | Active-low asynchronous reset; clears internal state and aborts ongoing operations |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous page-mode read | 32-byte aligned page access with 15 ns subsequent word latency - accelerates linear code execution |
| 512-byte programming buffer | Reduces average programming time by >60% vs. single-word writes - critical for firmware update efficiency |
| Hardware ECC engine | Single-bit correction per 512-byte sector with no CPU overhead - improves reliability in unattended systems |
| Versatile I/O (VIO) | Independent 1.65–3.6 V I/O rail - eliminates level shifters when interfacing with 1.8 V or 3.3 V controllers |
| Common Flash Interface (CFI) | Standardized parameter table accessible via read commands - enables OS/driver auto-detection and portability |
Applications
| Industrial Control Firmware Storage | Automotive Instrument Cluster Boot Memory |
|---|---|
Use Scenario: Storing bootloader and real-time OS kernel in PLCs and HMIs where power cycling is frequent and field updates occur infrequently. IC Role / Device Role / Timing Role: Non-volatile XIP-capable boot memory providing deterministic 90 ns instruction fetch latency. Use Value: Hardware ECC and 100K-cycle endurance ensure 15+ years of field operation without corruption-induced failures. | Use Scenario: Holding calibrated display firmware and safety-critical startup code in digital instrument clusters meeting AEC-Q100 Grade 3 requirements. IC Role / Device Role / Timing Role: Automotive-grade parallel NOR flash with –40°C to +85°C operation and OTP-locked calibration data. Use Value: Dual-lockable 1024-byte OTP array secures vehicle-specific configuration without external security ICs. |
| Medical Diagnostic Equipment BIOS | Networking Edge Router Configuration Storage |
Use Scenario: Hosting BIOS and FPGA configuration bitstreams in portable ultrasound and imaging devices requiring FDA-compliant data integrity. IC Role / Device Role / Timing Role: CFI-compliant flash enabling UEFI-compatible firmware recovery and secure boot chain anchoring. Use Value: 20-year data retention at 85°C validates long-term archival of calibration and regulatory metadata. | Use Scenario: Storing boot images and routing tables in carrier-grade edge routers deployed in temperature-variable telco cabinets. IC Role / Device Role / Timing Role: High-reliability parallel flash supporting hot-swap-aware firmware updates via RY/BY# status monitoring. Use Value: Suspend/resume capability allows safe interruption of sector erase during network failover events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128P10TFB010 | Same density and timing, but uses 64-ball LAE Fortified BGA (9 mm × 9 mm) instead of 56-pin TSOP | Preferred for space-constrained PCBs; requires re-layout and BGA reflow process | Select for new designs prioritizing board area over legacy footprint compatibility |
| MX29GL128FPTI-90G | Macronix part with 90 ns access, but lacks hardware ECC and OTP array; CFI support limited to basic ID query | Lower cost for non-safety-critical applications where SW ECC or external OTP is acceptable | Choose only when ECC and secure OTP are not required and BOM cost is primary constraint |
Compared with S29GL128P10TFB010, this TSOP variant offers drop-in replacement in legacy sockets; versus MX29GL128FPTI-90G, it delivers verified hardware-level data integrity and secure provisioning-critical for certified medical and automotive use.
Availability
S29GL128S10FHB010 is available at Aetrix Electronics and suitable for industrial control firmware storage, automotive instrument cluster boot memory, and medical diagnostic equipment BIOS requiring stable component supply across extended product lifecycles.
Supply support for S29GL128S10FHB010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
The GL-S family targets embedded systems needing deterministic XIP performance and robust data retention-designed specifically for boot code, firmware, and configuration storage in harsh-environment applications.
FAQ
What is the maximum operating temperature range for S29GL128S10FHB010?
This part is rated for industrial temperature range: –40°C to +85°C. It is not qualified to AEC-Q100 automotive grades unless ordered with automotive suffixes (e.g., -FHB013 for Grade 3). The datasheet specifies thermal resistance (θJA = 45°C/W) and derating curves for continuous operation at max ambient.
Does S29GL128S10FHB010 support execute-in-place (XIP) operation?
Yes-it supports true XIP with deterministic 90 ns random access and 15 ns page-mode latency. The device delivers full 16-bit words on each read cycle without wait states when interfaced to compatible microcontrollers with appropriate address/data bus timing setup.
How is hardware ECC implemented and verified in this device?
ECC is performed automatically in hardware during every read operation using a Hamming code algorithm covering each 512-byte sector. Single-bit errors are corrected transparently; double-bit errors trigger status register flags (ECC_FAIL bit) and require host intervention. No external logic or software driver is needed.
Can the OTP array be reprogrammed after initial programming?
No-the 1024-byte OTP array consists of two independently lockable 512-byte regions. Once a region's lock bit is set (via specific unlock-and-program command sequence), that region becomes permanently read-only. Locking is irreversible and does not affect main array operations.
S29GL128S10FHB010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL128S10FHB010 FAQ
1.How can I place an order for S29GL128S10FHB010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128S10FHB010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128S10FHB010 reliable?
The price and inventory of S29GL128S10FHB010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10FHB010 is usually 5 days.
3.What payment methods are accepted for S29GL128S10FHB010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S10FHB010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL128S10FHB010?
S29GL128S10FHB010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL128S10FHB010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL128S10FHB010?
For technical support, including S29GL128S10FHB010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10FHB010 requirements.
6.How does Aetrix verify that S29GL128S10FHB010 is sourced from the original manufacturer or authorized distributors?
All S29GL128S10FHB010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10FHB010 meets industry standards.
7.What is the process for return or replacement of S29GL128S10FHB010?
All S29GL128S10FHB010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10FHB010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128S10FHB010 part is unused and in its original packaging.
Return procedure for S29GL128S10FHB010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL128S10FHB010 Tags
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M24C02-WMN6TP
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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AT24C04C-SSHM-T
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