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Infineon Technologies S29GL128S10FHI010
- Part No.:
- S29GL128S10FHI010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL128S10FHI010.pdf
- Description:
- IC FLASH 128MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,492
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Product details
Overview
S29GL128S10FHI010 from Infineon is a 128 Mb (16 MB), 3.0 V core, parallel-interface MIRRORBIT™ Eclipse flash memory with ×16 data bus, 90 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C). It integrates hardware ECC for single-bit error correction, 128-kbyte uniform sector erase, and a 512-byte programming buffer-enabling fast embedded code storage and firmware update in microcontroller boot loaders.
For engineers reviewing the S29GL128S10FHI010 datasheet, S29GL128S10FHI010 pinout, S29GL128S10FHI010 application, or S29GL128S10FHI010 equivalent, key selection criteria include its 3.0 V single-supply operation (2.7–3.6 V), versatile I/O voltage range (1.65–VCC), CFI-compliant interface, OTP array support, and AEC-Q100 Grade 3 qualification suitability for automotive control modules.
Technical Context
This device implements an asynchronous parallel flash architecture with XIP-capable read performance: initial random access reads a full 32-byte aligned page, followed by 15 ns sub-page accesses within the same page using low-order address bits only. The embedded algorithm controller (EAC) manages all program/erase operations-including suspend/resume-and interfaces with status register, data polling, and RY/BY# signaling.
Hardware ECC operates transparently during read cycles, correcting single-bit errors without software intervention; the 1024-byte OTP array supports two lockable regions for secure boot code or calibration data storage. Sector protection uses both volatile (SRAM-based) and non-volatile (flash-based) methods per 128-kbyte sector.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 128 Mb (16 MB); supports full firmware image storage for mid-tier MCUs |
| Interface | Asynchronous parallel ×16 bus; no clock required, compatible with legacy 16-bit microprocessor buses |
| Access Time | 90 ns random / 15 ns page; enables real-time XIP execution with minimal wait states |
| Programming Buffer | 512 bytes; reduces average programming time by up to 4× vs. single-word writes |
| ECC | On-the-fly single-bit correction; eliminates need for external error-handling logic |
| Endurance | 100,000 program/erase cycles; suitable for field-updatable systems with frequent firmware revisions |
| Data Retention | 20 years at +85°C; meets long-lifecycle requirements for industrial controllers |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), standard JEDEC MO-141AC footprint, 18.4 mm × 10.16 mm × 1.2 mm height, lead-free and RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | 23-bit word address bus; A22 is MSB for 128 Mb (2²³ × 16-bit = 16 MB) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte/word writes via WE# and BYTE# control |
| CE# | Chip enable | Active-low chip select; enables device for read/write when OE# and WE# are also asserted |
| OE# | Output enable | Active-low read strobe; gates output drivers during read cycles |
| WE# | Write enable | Active-low write strobe; controls latching of data into internal registers |
| RY/BY# | Ready/Busy indicator | Open-drain active-low signal; asserts low during program/erase, high when ready |
| VCC | Core supply | 3.0 V ±10% supply for core logic, programming, and erase; no separate VPP required |
| VIO | I/O supply | 1.65 V to VCC; allows interfacing with 1.8 V, 2.5 V, or 3.3 V host systems |
Key Features
| Feature | Design Value |
|---|---|
| Page mode read | 32-byte aligned page access with 15 ns subsequent reads-reduces instruction fetch latency in XIP applications |
| Buffered programming | Up to 512 bytes per command; minimizes host CPU overhead during firmware updates |
| Hardware ECC | Single-bit correction on every read; prevents silent data corruption in safety-critical boot paths |
| OTP array | 1024-byte one-time-programmable region with dual lock bits-secures cryptographic keys or calibration constants |
| ASP sector protection | Volatile and non-volatile locking per 128-kbyte sector; enables flexible field update policies without full-chip erase |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated engine maps and diagnostic firmware in AEC-Q100 Grade 3 qualified ECU modules. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable code execution and secure OTA update storage. Use Value: 90 ns random access enables deterministic startup timing; OTP region stores immutable security keys resistant to reprogramming. | Use Scenario: Holding ladder logic runtime images and configuration data in DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: Primary firmware repository with sector-level protection to prevent accidental overwrite of critical control routines. Use Value: 128-kbyte uniform sectors allow atomic firmware patching; 20-year retention ensures reliability over extended maintenance cycles. |
| Medical Imaging Boot Loader | Telecom Base Station Configuration |
Use Scenario: Hosting secure boot loader and FPGA bitstream in FDA-regulated ultrasound imaging systems. IC Role / Device Role / Timing Role: Trusted code origin point with hardware ECC and OTP-locked signature verification keys. Use Value: Single-bit ECC eliminates need for redundant checksum layers; industrial temp grade supports fanless enclosure operation. | Use Scenario: Storing radio parameter tables and protocol stack binaries in outdoor 4G/5G remote radio units. IC Role / Device Role / Timing Role: High-reliability configuration store supporting hot-swap firmware updates without service interruption. Use Value: Suspend/resume capability allows background sector erase during low-traffic windows; 100k-cycle endurance accommodates frequent field tuning. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128P10TFI010 | Same density and timing, but uses 64-ball LAE BGA (9 mm × 9 mm); no TSOP option | Better suited for space-constrained PCBs where board area is prioritized over manual assembly | Select if footprint miniaturization and automated reflow compatibility outweigh hand-soldering needs |
| MX29GL128FHT2I-90G | Macronix part; 90 ns access, but lacks hardware ECC and OTP array; requires external error handling | Lower-cost alternative where firmware integrity is managed in software or external controller | Choose only when ECC and secure OTP are not required, and cost sensitivity dominates design constraints |
Compared with S29GL128P10TFI010, this TSOP variant offers easier prototyping and repair; versus MX29GL128FHT2I-90G, it delivers built-in data integrity and secure storage-critical for functional safety and regulatory compliance.
Availability
S29GL128S10FHI010 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware deployment, and medical imaging boot loader integration requiring stable component supply across multi-year production programs.
Supply support for S29GL128S10FHI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
The GL-S family targets high-reliability embedded systems needing deterministic XIP performance, robust firmware update capability, and automotive-grade qualification-designed specifically for ECU, gateway, and industrial control applications demanding long-term data integrity.
FAQ
What is the minimum VIO voltage supported by S29GL128S10FHI010?
The device supports VIO from 1.65 V to VCC, enabling direct interface with 1.8 V logic families without level shifters. This is verified in Section 10.4 (Operating Ranges) and Table 10-2 of the datasheet, where VIO min is explicitly specified as 1.65 V across all temperature grades.
Does S29GL128S10FHI010 require an external VPP voltage for programming?
No. Programming and erase operations use only the single VCC supply (2.7–3.6 V); internal charge pumps generate all required high voltages. This eliminates external VPP circuitry and simplifies power design-confirmed in the "Distinctive characteristics" section and Section 10.5 (DC Characteristics).
How is the OTP array protected against accidental programming?
The 1024-byte OTP array has two independent lock bits-one for each 512-byte region-that permanently disable further writes once set. Locking is performed via dedicated CFI commands (0x60 → 0xD0), and status is readable via the CFI query table; no hardware fuse is used.
Can S29GL128S10FHI010 be used in AEC-Q100 Grade 2 automotive applications?
No. S29GL128S10FHI010 is specified for Industrial (–40°C to +85°C) and AEC-Q100 Grade 3 (–40°C to +85°C) only. For Grade 2 (–40°C to +105°C), Infineon offers the S29GL128S10FHJ010 variant-same functionality with extended temperature qualification.
S29GL128S10FHI010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL128S10FHI010 FAQ
1.How can I place an order for S29GL128S10FHI010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128S10FHI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128S10FHI010 reliable?
The price and inventory of S29GL128S10FHI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10FHI010 is usually 5 days.
3.What payment methods are accepted for S29GL128S10FHI010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S10FHI010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL128S10FHI010?
S29GL128S10FHI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL128S10FHI010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL128S10FHI010?
For technical support, including S29GL128S10FHI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10FHI010 requirements.
6.How does Aetrix verify that S29GL128S10FHI010 is sourced from the original manufacturer or authorized distributors?
All S29GL128S10FHI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10FHI010 meets industry standards.
7.What is the process for return or replacement of S29GL128S10FHI010?
All S29GL128S10FHI010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10FHI010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128S10FHI010 part is unused and in its original packaging.
Return procedure for S29GL128S10FHI010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL128S10FHI010 Tags
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