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Infineon Technologies S29GL128S10FHIV10
- Part No.:
- S29GL128S10FHIV10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL128S10FHIV10.pdf
- Description:
- IC FLASH 128MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,703
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Product details
Overview
S29GL128S10FHIV10 from Infineon is a 128 Mb (16 MB) parallel NOR flash memory IC with 3.0 V core supply, 16-bit data bus, and 65 nm MIRRORBIT™ Eclipse process technology. It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction, targeting boot code storage and firmware execution in industrial and automotive embedded systems.
For engineers reviewing the S29GL128S10FHIV10 datasheet, S29GL128S10FHIV10 pinout, S29GL128S10FHIV10 application, or S29GL128S10FHIV10 equivalent, key selection criteria include its 128-kbyte uniform sector erase architecture, 512-byte programming buffer, Versatile I/O (1.65 V to VCC), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and TSOP-56 package compatibility.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A22), supporting both standard and page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume capability and status monitoring via RY/BY#, data polling, or status register.
The internal architecture integrates a 512-byte write buffer, sector-level protection (volatile/non-volatile ASP), and a dedicated 1024-byte OTP array with two lockable regions. ECC logic operates transparently during read cycles, correcting single-bit errors without software intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 128 Mb (16 MB); supports full firmware image storage for mid-complexity microcontrollers. |
| Random Access Time | 90 ns at VCC = VIO; enables fast XIP (execute-in-place) boot code execution. |
| Page Access Time | 15 ns; allows rapid sequential reads within 32-byte aligned pages. |
| Programming Buffer | 512 bytes; reduces effective programming time by batching writes without host CPU overhead. |
| ECC Support | Internal hardware single-bit error correction; eliminates need for external ECC logic or software layer. |
| Endurance | 100,000 program/erase cycles per sector; suitable for field-upgradable firmware with frequent updates. |
| Data Retention | 20 years at +85°C; ensures long-term reliability in unpowered industrial environments. |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP), 14 mm × 20 mm, JEDEC MO-141AC compliant, lead-free and RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address Inputs | 23-bit word address bus; A22 is MSB for 128 Mb density (2²³ × 16 bits). |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte/word writes and reads per cycle. |
| CE# | Chip Enable | Active-low chip select; controls device power state and command recognition timing. |
| OE# | Output Enable | Active-low control for data bus output drivers; enables read data gating. |
| WE# | Write Enable | Active-low strobe for latching address/data during program/erase commands. |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low during embedded operations, high when ready. |
| RESET# | Hardware Reset | Active-low asynchronous reset; forces device into standby and clears internal state. |
| VCC | Core Supply | 3.0 V ±0.3 V supply for core logic and memory array; supports 2.7–3.6 V operation. |
| VIO | I/O Supply | Independent 1.65–3.6 V I/O voltage; enables interfacing with mixed-voltage host systems. |
Key Features
| Feature | Design Value |
|---|---|
| 65 nm MIRRORBIT™ Eclipse Process | Enables higher density and lower active current vs. older 90 nm flash nodes. |
| Asynchronous Page Mode Read | 15 ns intra-page access enables efficient burst reads for instruction fetch or data streaming. |
| Uniform 128-kbyte Sector Erase | Simplifies firmware partitioning and wear leveling; no complex block management required. |
| Advanced Sector Protection (ASP) | Per-sector volatile/non-volatile locking prevents accidental program/erase during power transitions. |
| Secure Silicon Region (OTP) | 1024-byte one-time-programmable area with dual lockable regions for keys or calibration data. |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated gauge graphics, driver alerts, and CAN message lookup tables in digital dashboards. IC Role / Device Role / Timing Role: Boot ROM and runtime firmware storage with AEC-Q100 Grade 2 qualification and 105°C operation. Use Value: 90 ns random access enables real-time UI rendering; ECC ensures display integrity over 15+ year vehicle life. | Use Scenario: Holding ladder logic executables, I/O configuration maps, and safety-critical firmware updates. IC Role / Device Role / Timing Role: Non-volatile program memory with sector-level write protection and 20-year data retention. Use Value: Uniform 128-kbyte sectors simplify field update partitioning; ASP prevents corruption during brown-out events. |
| Medical Diagnostic Imaging Boot | Avionics Display System |
Use Scenario: Hosting bootloader, FPGA configuration bitstreams, and DICOM protocol stacks in portable ultrasound units. IC Role / Device Role / Timing Role: XIP-capable flash for deterministic boot latency and secure firmware validation. Use Value: 15 ns page access accelerates initialization; OTP region stores cryptographic keys for secure boot chain. | Use Scenario: Storing flight display firmware, navigation databases, and HUD overlay assets in certified cockpit displays. IC Role / Device Role / Timing Role: High-reliability firmware storage meeting DO-254/ED-80 requirements with ECC and endurance. Use Value: 100,000 erase cycles support frequent database updates; 20-year retention meets aircraft service life. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128P10TFI010 | Same density and timing, but uses 64-ball LAE Fortified BGA (9 mm × 9 mm) instead of TSOP-56. | Preferred for space-constrained PCBs where thermal performance and board-level reliability outweigh manual assembly needs. | Select when footprint size and thermal dissipation are prioritized over hand-solderability and legacy socket compatibility. |
| N25Q128A13ESE40F | 128 Mb Quad SPI interface, 133 MHz clock, no parallel bus; lacks hardware ECC and page mode read. | Used in newer designs with SPI-capable MCUs; requires software-managed ECC and different driver stack. | Choose only if system architecture mandates serial interface and can accommodate software ECC implementation. |
Compared with S29GL128P10TFI010, the S29GL128S10FHIV10 offers direct drop-in compatibility with legacy TSOP-based controllers and simpler signal routing. Against N25Q128A13ESE40F, it provides deterministic low-latency XIP execution and autonomous ECC-critical for safety-certified systems where SPI timing jitter or software overhead is unacceptable.
Availability
S29GL128S10FHIV10 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, and medical diagnostic imaging boot applications requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL128S10FHIV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and memory solutions, with global R&D and manufacturing infrastructure.
The GL-S family targets high-reliability embedded systems needing deterministic boot performance, robust data integrity, and AEC-Q100 compliance-designed specifically for automotive, industrial, and medical applications demanding long-term firmware stability.
FAQ
What is the maximum operating temperature range for S29GL128S10FHIV10?
The S29GL128S10FHIV10 is qualified for Industrial Plus (–40°C to +105°C) operation, verified per Infineon's internal test standards and documented in the 001-98285 Rev. *U datasheet Section 10.4. This grade supports under-hood automotive and high-temperature industrial environments without derating.
Does this device support execute-in-place (XIP) functionality?
Yes-S29GL128S10FHIV10 supports true XIP operation due to its 90 ns random access time and asynchronous parallel interface. The device delivers instruction fetches directly to the CPU without buffering or translation, enabling deterministic boot and real-time code execution as confirmed in the Product Overview (Datasheet p.5).
How does the 512-byte programming buffer improve system-level throughput?
The 512-byte buffer allows up to 256 words to be loaded before initiating embedded programming, reducing host-side wait states and bus arbitration overhead. Measured buffer programming rate is 1.5 MBps (Datasheet p.2), cutting effective write time by ~4× versus single-word programming in typical firmware update scenarios.
Is hardware reset (RESET#) required for reliable power-on initialization?
Yes-asserting RESET# for ≥100 ns after VCC stabilizes ensures proper internal state initialization, including status register clearing and command parser readiness. Omitting this step may result in undefined behavior during first read or program attempts, as specified in Section 11.3 (Power-on Reset) of the datasheet.
S29GL128S10FHIV10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL128S10FHIV10 FAQ
1.How can I place an order for S29GL128S10FHIV10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128S10FHIV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128S10FHIV10 reliable?
The price and inventory of S29GL128S10FHIV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10FHIV10 is usually 5 days.
3.What payment methods are accepted for S29GL128S10FHIV10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S10FHIV10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL128S10FHIV10?
S29GL128S10FHIV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL128S10FHIV10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL128S10FHIV10?
For technical support, including S29GL128S10FHIV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10FHIV10 requirements.
6.How does Aetrix verify that S29GL128S10FHIV10 is sourced from the original manufacturer or authorized distributors?
All S29GL128S10FHIV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10FHIV10 meets industry standards.
7.What is the process for return or replacement of S29GL128S10FHIV10?
All S29GL128S10FHIV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10FHIV10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128S10FHIV10 part is unused and in its original packaging.
Return procedure for S29GL128S10FHIV10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL128S10FHIV10 Tags
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