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Infineon Technologies S29GL128S10FHIV23
- Part No.:
- S29GL128S10FHIV23
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL128S10FHIV23.pdf
- Description:
- IC FLASH 128MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,367
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Product details
Overview
S29GL128S10FHIV23 from Infineon is a 128 Mb (16 MB) parallel NOR flash memory IC with 3.0 V core supply, 16-bit data bus, and 65 nm MIRRORBIT™ Eclipse process technology. It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. Designed for embedded boot code storage in industrial controllers requiring high reliability and fast XIP execution.
For engineers reviewing the S29GL128S10FHIV23 datasheet, S29GL128S10FHIV23 pinout, S29GL128S10FHIV23 application, or S29GL128S10FHIV23 equivalent, key selection criteria include its 128-kbyte uniform sector erase granularity, 512-byte programming buffer, Versatile I/O (1.65 V–VCC), AEC-Q100 Grade 3 automotive qualification, and TSOP-56 package compatibility.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A22), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) handles all program/erase operations autonomously, including suspend/resume and status reporting via RY/BY#, data polling, or status register.
The flash integrates on-die ECC logic that detects and corrects single-bit errors during read cycles without software intervention, and features Advanced Sector Protection (ASP) with volatile/non-volatile lock bits per 128-kbyte sector plus a dedicated 1024-byte OTP array with two lockable regions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 128 Mb (16 MB); supports full boot image storage for mid-size microcontrollers |
| Random Access Time | 90 ns at VCC = VIO; enables deterministic XIP execution latency in real-time systems |
| Page Access Time | 15 ns; allows rapid sequential reads within 32-byte aligned pages |
| Programming Buffer | 512 bytes; reduces effective programming time by batching up to 256 words per command |
| ECC Support | Hardware single-bit error correction; eliminates need for external ECC logic or software overhead |
| Endurance | 100,000 program/erase cycles per sector; suitable for field-upgradable firmware storage |
| Data Retention | 20 years at +85°C; validated for long-life industrial deployments |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP-I, Type I), 14 mm × 20 mm, 0.5 mm pitch, JEDEC MO-141AC compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address Inputs | Word-aligned address lines (A22 MSB); support 128-Mb addressing space (2²³ × 16-bit) |
| DQ0–DQ15 | Data Bus | 16-bit bidirectional data path; latched on rising edge of WE# or OE# for writes/reads |
| CE# | Chip Enable | Active-low enable controlling device selection; required for all read/write/erase operations |
| OE# | Output Enable | Active-low control for output drivers; used during read cycles to gate data onto DQ bus |
| WE# | Write Enable | Active-low strobe for write operations; initiates command sequences and data latching |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low during embedded program/erase, high when ready |
| RESET# | Hardware Reset | Active-low signal forcing device into reset state; clears internal state and aborts ongoing operations |
| VCC | Core Supply | 3.0 V ±0.3 V supply powering core logic and charge pumps; operates across 2.7–3.6 V range |
| VIO | I/O Supply | Independent I/O voltage (1.65 V–VCC); enables interfacing with mixed-voltage host systems |
Key Features
| Feature | Design Value |
|---|---|
| Page Mode Read | 32-byte aligned page access with 15 ns cycle time - accelerates sequential instruction fetch in XIP applications |
| Embedded Algorithm Controller | Fully autonomous program/erase/suspend/resume - removes host CPU overhead and guarantees timing compliance |
| Versatile I/O Interface | VIO range 1.65 V to VCC - simplifies integration with 1.8 V, 2.5 V, or 3.3 V host processors without level shifters |
| Advanced Sector Protection | Volatile and non-volatile lock bits per 128-kbyte sector - enables flexible firmware partitioning and secure OTA update zones |
| Secure Silicon Region | 1024-byte OTP array with two independently lockable regions - stores cryptographic keys or calibration data permanently |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers operating continuously at 85°C ambient. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with ≤90 ns latency. Use Value: 20-year data retention and 100K endurance ensure firmware integrity over 15+ year product lifecycle without refresh. | Use Scenario: Holding safety-critical boot code and sensor calibration data in front-camera ECU certified to AEC-Q100 Grade 3. IC Role / Device Role / Timing Role: Certified NOR flash serving as trusted boot source with hardware ECC and sector-level write protection. Use Value: Integrated single-bit ECC and OTP region eliminate external error-handling logic and secure key storage requirements. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
Use Scenario: Hosting BIOS and FPGA configuration bitstreams in portable ultrasound devices requiring radiation-tolerant, long-retention storage. IC Role / Device Role / Timing Role: Dual-role memory storing both executable code and static configuration data with sector isolation. Use Value: Uniform 128-kbyte sectors allow independent locking of BIOS vs. calibration partitions, preventing accidental overwrite. | Use Scenario: Storing FPGA configuration, DSP firmware, and network parameter tables in outdoor 5G remote radio units exposed to thermal cycling. IC Role / Device Role / Timing Role: High-reliability parallel flash interfaced to ARM-based baseband processor via 16-bit bus. Use Value: Versatile I/O (1.65–3.6 V) accommodates 1.8 V FPGA I/O while maintaining 3.0 V core operation for optimal endurance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128P10TFIV20 | Same density and architecture but uses 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP option | Preferred for space-constrained PCBs where board area is critical and routing complexity acceptable | Select when footprint reduction outweighs ease of prototyping and thermal management needs |
| MX29GL128FHT2I-90G | Micron part with identical 128 Mb density, 90 ns access, and 1.65–3.6 V VIO, but lacks integrated ECC and OTP array | Requires external ECC handling and separate secure storage solution for keys/calibration | Choose only if cost sensitivity dominates and system-level ECC implementation is already available |
Compared with S29GL128P10TFIV20, this TSOP-packaged variant offers superior thermal dissipation and simpler layout; versus MX29GL128FHT2I-90G, it delivers built-in ECC and OTP security-reducing BOM count and firmware validation scope.
Availability
S29GL128S10FHIV23 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S29GL128S10FHIV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions for industrial and automotive markets.
The GL-S family targets embedded systems needing robust, high-speed parallel NOR flash with XIP capability, ECC, and AEC-Q100 qualification - optimized for boot code, firmware, and configuration storage in harsh environments.
FAQ
What is the maximum operating temperature range for S29GL128S10FHIV23?
This part is qualified for Industrial Plus grade (–40°C to +105°C), verified per Infineon's reliability testing protocol. The device maintains full specification compliance-including 90 ns random access and 100,000 erase cycles-across this full range, with derating applied only to standby current above +85°C.
Does S29GL128S10FHIV23 support common flash interface (CFI)?
Yes, it implements the Common Flash Interface (CFI) parameter table per JEDEC JESD68. This enables automatic detection of geometry, timing, and command set by host boot ROM or flash translation layer, eliminating hardcoded memory initialization sequences in bootloader code.
Can S29GL128S10FHIV23 be used with a 1.8 V I/O interface?
Yes, its Versatile I/O feature supports VIO from 1.65 V to VCC. When VCC = 3.0 V, VIO may be set to 1.8 V, allowing direct connection to 1.8 V microcontrollers without level shifters-provided timing margins (e.g., tOE = 35 ns) are met under those voltage conditions.
How does the 512-byte programming buffer improve write performance?
The buffer allows up to 512 bytes (256 words) to be loaded before initiating a single embedded program operation, reducing command overhead and bus arbitration delays. Measured effective programming rate reaches 1.5 MBps-over 3× faster than single-word programming for contiguous firmware updates.
S29GL128S10FHIV23 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL128S10FHIV23 FAQ
1.How can I place an order for S29GL128S10FHIV23 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128S10FHIV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128S10FHIV23 reliable?
The price and inventory of S29GL128S10FHIV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10FHIV23 is usually 5 days.
3.What payment methods are accepted for S29GL128S10FHIV23?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S10FHIV23 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL128S10FHIV23?
S29GL128S10FHIV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL128S10FHIV23 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL128S10FHIV23?
For technical support, including S29GL128S10FHIV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10FHIV23 requirements.
6.How does Aetrix verify that S29GL128S10FHIV23 is sourced from the original manufacturer or authorized distributors?
All S29GL128S10FHIV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10FHIV23 meets industry standards.
7.What is the process for return or replacement of S29GL128S10FHIV23?
All S29GL128S10FHIV23 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10FHIV23, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128S10FHIV23 part is unused and in its original packaging.
Return procedure for S29GL128S10FHIV23:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL128S10FHIV23 Tags
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