Infineon Technologies S29GL128S10FHSS10
- Part No.:
- S29GL128S10FHSS10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL128S10FHSS10.pdf
- Description:
- IC FLASH 128MBIT PARALLEL 64FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,415
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Product details
Overview
S29GL128S10FHSS10 from Infineon is a 128 Mb (16 MB), 3.0 V core, parallel-interface MIRRORBIT™ Eclipse flash memory with ×16 data bus, 90 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C). It integrates hardware ECC for single-bit error correction, 128-kbyte uniform sector erase, and a 512-byte programming buffer-used in boot code storage and firmware update in embedded controllers.
For engineers reviewing the S29GL128S10FHSS10 datasheet, S29GL128S10FHSS10 pinout, S29GL128S10FHSS10 application, or S29GL128S10FHSS10 equivalent, key selection criteria include asynchronous read timing, Versatile I/O voltage range (1.65 V to VCC), OTP array support, CFI compliance, and AEC-Q100 grade availability.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A22), supporting both standard and page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations with suspend/resume capability and status reporting via status register, data polling, or RY/BY# pin.
The flash uses 65 nm MIRRORBIT™ Eclipse technology with internal hardware ECC, 100,000 program/erase cycles, and 20-year data retention. Sector protection includes volatile/non-volatile ASP and a separate 1024-byte OTP array with two lockable regions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 128 Mb (16 MB), organized as 1,048,576 × 16-bit words |
| Random Access Time | 90 ns at VCC = VIO = 3.0 V - determines minimum CPU wait-state insertion for random fetches |
| Page Access Time | 15 ns - enables fast sequential reads within 32-byte aligned pages |
| Programming Buffer | 512 bytes - allows burst programming of up to 256 words per command, reducing effective write latency |
| ECC Support | Internal hardware single-bit error correction - eliminates need for external ECC logic in boot ROM applications |
| Operating Voltage | VCC = 2.7 V to 3.6 V; VIO = 1.65 V to VCC - supports mixed-voltage system interfacing |
| Endurance & Retention | 100,000 program/erase cycles; 20 years data retention at 85°C - validated for long-life industrial firmware storage |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-142AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address Inputs | Word-aligned address lines; A22 is MSB for 128 Mb (2²³ = 8,388,608 words) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports high-speed page reads and buffer writes |
| CE# | Chip Enable | Active-low enable controlling device selection; tCE = 90 ns max defines chip select setup window |
| OE# | Output Enable | Active-low control for data output gating; tOE = 25 ns max governs read data hold timing |
| WE# | Write Enable | Active-low signal initiating write/program commands; latched with address/data for command execution |
| RY/BY# | Ready/Busy Output | Open-drain status indicator: low = operation in progress; high = ready for next command |
| RESET# | Hardware Reset | Active-low asynchronous reset that halts ongoing operations and returns device to read mode |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous Page Read | 32-byte aligned page access with 15 ns cycle time - accelerates linear code execution without cache |
| 512-Byte Programming Buffer | Enables single-command programming of up to 256 words - cuts firmware update time vs. byte-by-byte writes |
| Hardware ECC Engine | On-die single-bit error correction with automatic detection - ensures boot reliability without software overhead |
| Versatile I/O (VIO) | Independent VIO supply (1.65 V to VCC) - permits direct interfacing with 1.8 V or 3.3 V controllers |
| OTP Array | 1024-byte one-time-programmable region with dual lock bits - secures calibration data or cryptographic keys |
Applications
| Industrial Control Firmware Storage | Automotive ECU Boot Memory |
|---|---|
Use Scenario: Storing boot loader and safety-critical firmware in PLCs and motion controllers requiring field updates. IC Role / Device Role / Timing Role: Non-volatile XIP-capable boot memory with deterministic 90 ns random access for cold-start execution. Use Value: Hardware ECC and 100K-cycle endurance ensure firmware integrity over 15+ years of industrial deployment. | Use Scenario: Holding ASW-compliant boot code and configuration parameters in engine control units. IC Role / Device Role / Timing Role: AEC-Q100 Grade 3 flash memory providing secure, temperature-stable boot image storage. Use Value: OTP array and advanced sector protection prevent unauthorized modification of calibration data. |
| Medical Imaging System Code Storage | Networking Equipment Configuration Memory |
Use Scenario: Hosting FPGA configuration bitstreams and diagnostic application binaries in portable ultrasound devices. IC Role / Device Role / Timing Role: High-reliability parallel flash with 20-year data retention for regulatory-compliant medical device lifecycle. Use Value: Page-mode read (15 ns) enables rapid reconfiguration without external DRAM buffering. | Use Scenario: Storing switch/router firmware images and persistent configuration tables in carrier-grade Ethernet switches. IC Role / Device Role / Timing Role: CFI-compliant flash enabling standardized BIOS/UEFI firmware update mechanisms. Use Value: Common Flash Interface table allows auto-detection and driver compatibility across multiple platforms. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128S11FHSS10 | Same density and package, but 110 ns random access (vs. 90 ns); rated for Industrial Plus (–40°C to +105°C) | Higher temperature operation required; slightly slower read performance acceptable | Select when extended thermal range is mandatory and 20 ns timing margin is available |
| MX29GL128FHTI-90G | Micron 128 Mb parallel NOR; 90 ns access, but no integrated hardware ECC or OTP array | No on-die ECC - requires external error handling; lacks secure OTP region | Choose only if cost sensitivity outweighs reliability/security requirements and ECC is implemented in host SW |
Compared with S29GL128S10FHSS10, the S29GL128S11FHSS10 trades 20 ns read speed for +20°C operating margin, while the MX29GL128FHTI-90G omits ECC and OTP-making it unsuitable for safety-critical or secure boot use cases.
Availability
S29GL128S10FHSS10 is available at Aetrix Electronics and suitable for industrial control systems, automotive ECUs, medical imaging devices, and networking equipment requiring stable component supply and long-term firmware integrity.
Supply support for S29GL128S10FHSS10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q standards.
The GL-S family targets high-reliability embedded applications demanding XIP capability, robust data retention, and automotive-grade qualification-designed specifically for boot code, firmware, and secure configuration storage.
FAQ
What is the purpose of the Versatile I/O (VIO) feature?
The Versatile I/O feature allows independent VIO supply (1.65 V to VCC) for the data and control pins, enabling direct interface with 1.8 V or 3.3 V host processors without level shifters. This simplifies board design and reduces BOM count while maintaining signal integrity across mixed-voltage systems.
Does S29GL128S10FHSS10 support execute-in-place (XIP) operation?
Yes-S29GL128S10FHSS10 supports true XIP operation due to its fast random access (90 ns) and asynchronous parallel interface. The device delivers instruction words directly to the CPU without requiring prefetch or caching, making it suitable for boot ROM and real-time firmware execution in microcontrollers.
How does the 512-byte programming buffer improve firmware update efficiency?
The 512-byte buffer allows up to 256 words to be loaded and programmed in a single embedded operation, reducing command overhead and bus arbitration delays. Measured performance shows ~1.5 MBps effective programming rate-over 3× faster than single-word programming for typical firmware patch sizes.
Is the OTP array truly one-time programmable, and how is it secured?
Yes-the 1024-byte OTP array has two independent lock bits (one per 512-byte region) that permanently disable further writes once set. Locking is irreversible and hardware-enforced; no command or voltage sequence can unlock it. This provides tamper-resistant storage for calibration constants, device IDs, or cryptographic keys.
S29GL128S10FHSS10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- 0°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL128S10FHSS10 FAQ
1.How can I place an order for S29GL128S10FHSS10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128S10FHSS10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128S10FHSS10 reliable?
The price and inventory of S29GL128S10FHSS10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10FHSS10 is usually 5 days.
3.What payment methods are accepted for S29GL128S10FHSS10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S10FHSS10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL128S10FHSS10?
S29GL128S10FHSS10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL128S10FHSS10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL128S10FHSS10?
For technical support, including S29GL128S10FHSS10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10FHSS10 requirements.
6.How does Aetrix verify that S29GL128S10FHSS10 is sourced from the original manufacturer or authorized distributors?
All S29GL128S10FHSS10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10FHSS10 meets industry standards.
7.What is the process for return or replacement of S29GL128S10FHSS10?
All S29GL128S10FHSS10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10FHSS10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128S10FHSS10 part is unused and in its original packaging.
Return procedure for S29GL128S10FHSS10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL128S10FHSS10 Tags

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