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Infineon Technologies S29GL128S10GHB010

Part No.:
S29GL128S10GHB010
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
56-VFBGA
Datasheet:
AetrixS29GL128S10GHB010.pdf
Description:
IC FLASH 128MBIT CFI 56FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,589

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Product details

Overview

S29GL128S10GHB010 from Infineon is a 128 Mb (16 MB) parallel NOR flash memory IC with 3.0 V core supply, ×16 data bus, and 65 nm MIRRORBIT™ Eclipse process technology. It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. Designed for embedded boot code storage in industrial control systems requiring reliable non-volatile program execution.

For engineers reviewing the S29GL128S10GHB010 datasheet, S29GL128S10GHB010 pinout, S29GL128S10GHB010 application, or S29GL128S10GHB010 equivalent, key selection factors include its 128-kbyte uniform sector erase granularity, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65 V to VCC), and AEC-Q100 Grade 2 qualification (-40°C to +105°C).

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A22), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages all program/erase operations, including suspend/resume capability and automatic status reporting via RY/BY# pin or status register polling.

The internal architecture integrates dedicated erase voltage and programming voltage generators, on-die ECC logic, and advanced sector protection (ASP) with volatile/non-volatile lock options. The 1024-byte OTP array includes two independently lockable regions for secure configuration or calibration data storage.

Key Specifications

Parameter Value and Actual Design Meaning
Memory density 128 Mb (16 MB), organized as 1,048,576 × 16-bit words - supports full boot image storage for mid-complexity microcontrollers.
Access time (random) 90 ns at VCC = VIO - enables direct XIP execution without wait states in 50 MHz CPU bus environments.
Page access time 15 ns - accelerates sequential instruction fetch within 32-byte aligned pages during burst code execution.
Write buffer size 512 bytes (256 words) - reduces effective programming time by >3× vs. single-word writes in firmware update routines.
ECC capability On-die hardware single-bit error correction - eliminates need for external ECC logic in safety-critical boot loaders.
Endurance & retention 100,000 program/erase cycles; 20-year data retention - meets long-lifecycle requirements for industrial gateways and automotive ECUs.
Operating temperature -40°C to +105°C (AEC-Q100 Grade 2) - qualified for under-hood automotive applications and high-ambient industrial enclosures.

Pinout & Package

Package: 56-ball VBU Fortified BGA (9 mm × 7 mm, 0.8 mm pitch). RoHS-compliant, lead-free, moisture sensitivity level 3.

Pin/Terminal Circuit Role Design Meaning
A0–A22 Address inputs Word-aligned address bus; A22 is MSB for 128 Mb (2²³ = 8,388,608 words × 2 bytes = 16 MB).
DQ0–DQ15 Data I/O Bi-directional ×16 data bus; supports 16-bit parallel transfers for fast code read and buffer programming.
CE# Chip enable Active-low device select; controls power state entry/exit and enables multi-device decoding in memory maps.
OE# Output enable Active-low read strobe; gates output drivers during asynchronous read cycles to minimize bus contention.
WE# Write enable Active-low control for write/program/erase command latching; synchronized with CE# and OE# for valid command sequences.
RY/BY# Ready/Busy indicator Open-drain status signal; low during active program/erase, high when operation complete or ready for next command.
VCC Core supply 3.0 V ±10% (2.7–3.6 V); powers core logic, EAC, and internal voltage generators - no separate VPP required.
VIO I/O supply 1.65 V to VCC; decouples I/O voltage from core, enabling interoperability with 1.8 V or 3.3 V host interfaces.

Key Features

Feature Design Value
Versatile I/O voltage range VIO supports 1.65 V to VCC - eliminates level shifters when interfacing with mixed-voltage SoCs (e.g., 1.8 V FPGA + 3.3 V MCU).
512-byte write buffer Enables single-command programming of up to 512 bytes - cuts firmware update time by ~75% vs. byte-by-byte writes.
Uniform 128-kbyte sectors 64 identical sectors simplify partitioning for bootloader, application, and parameter storage with deterministic erase timing.
Hardware ECC engine Single-bit correction with no software overhead - maintains functional safety integrity without CPU intervention during boot.
OTP array (1024 B) Two lockable regions store immutable calibration data or security keys - prevents accidental overwrite after field deployment.

Applications

Automotive Engine Control Unit (ECU) Industrial PLC Firmware Storage

Use Scenario: Storing boot loader and real-time control firmware in diesel engine management systems operating at 105°C ambient.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory with XIP capability and AEC-Q100 Grade 2 qualification.

Use Value: 90 ns random access ensures zero-wait-state execution; 100,000-cycle endurance supports 15+ year vehicle service life.

Use Scenario: Holding firmware and configuration tables in DIN-rail mounted programmable logic controllers deployed in factory automation cabinets.

IC Role / Device Role / Timing Role: Reliable parallel NOR flash for deterministic boot and field-upgradable application code.

Use Value: Uniform 128-kB sectors allow atomic firmware updates; hardware ECC prevents silent corruption in electrically noisy environments.

Medical Imaging System Boot Memory Avionics Display Controller Storage

Use Scenario: Hosting boot code and diagnostic firmware in portable ultrasound devices requiring FDA-grade reliability and thermal stability.

IC Role / Device Role / Timing Role: Certified non-volatile memory for safety-critical boot path with 20-year data retention guarantee.

Use Value: On-die ECC and 1024-byte OTP enable secure calibration storage and fault-tolerant startup sequence.

Use Scenario: Storing display firmware and font assets in DO-160 qualified cockpit display units exposed to wide temperature cycling.

IC Role / Device Role / Timing Role: High-reliability parallel flash with extended temperature grade and robust sector protection.

Use Value: Advanced sector protection (ASP) prevents accidental erasure of certified display assets during maintenance updates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part Technical Difference Application Difference Selection Advice
S29GL128S10TFI010 Same die, 56-pin TSOP-56 package instead of VBU BGA; 100 ns random access (vs. 90 ns); no AEC-Q100 qualification. Limited to commercial/industrial PCBs with through-hole or surface-mount footprint constraints; unsuitable for automotive under-hood use. Select for cost-sensitive industrial designs where BGA assembly is unavailable and thermal grade ≤85°C suffices.
MX29GL128FPTI-90G 128 Mb parallel NOR, 90 ns access, but lacks on-die ECC and OTP array; uses older 90 nm process; no AEC-Q100 certification. Requires external ECC logic for safety-critical boot paths; not approved for automotive functional safety applications. Choose only for legacy system refreshes where Infineon GL-S features (ECC, ASP, OTP) are unused and footprint compatibility exists.

Compared with S29GL128S10TFI010 and MX29GL128FPTI-90G, the S29GL128S10GHB010 uniquely combines AEC-Q100 Grade 2 qualification, hardware ECC, and 1024-byte OTP in a compact VBU BGA - making it the sole option for new automotive and high-integrity industrial designs requiring certified boot memory.

Availability

S29GL128S10GHB010 is available at Aetrix Electronics and suitable for automotive engine control units, industrial PLCs, medical imaging boot systems, and avionics display controllers requiring stable component supply across extended product lifecycles.

Supply support for S29GL128S10GHB010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certifications including IATF 16949.

The GL-S family targets automotive and industrial embedded systems requiring deterministic boot performance, long-term data integrity, and AEC-Q100 compliance - delivering XIP-capable NOR flash optimized for safety-critical firmware storage.

FAQ

Does S29GL128S10GHB010 support execute-in-place (XIP) operation?

Yes. The device supports true XIP operation due to its 90 ns random access time and asynchronous parallel interface. Code stored in its memory can be executed directly by the host processor without copying to RAM, reducing boot latency and SRAM usage in resource-constrained embedded systems.

What is the function of the RY/BY# pin, and how is it used in system design?

The RY/BY# pin is an open-drain ready/busy status indicator. It asserts low during program or erase operations and returns high when complete. System designers use it for hardware handshaking to avoid polling the status register, reducing CPU overhead and ensuring deterministic timing in real-time applications.

How does the Versatile I/O (VIO) feature benefit mixed-voltage system integration?

VIO allows independent setting of I/O voltage between 1.65 V and VCC, enabling direct connection to 1.8 V FPGAs or 3.3 V microcontrollers without external level shifters. This simplifies PCB layout, reduces BOM count, and improves signal integrity in heterogeneous digital systems.

Is the 1024-byte OTP array field-programmable, and what locking mechanisms apply?

Yes, the OTP array is programmable once per region using standard command sequences. It contains two independently lockable 512-byte regions: one lock bit per region disables further writes permanently. Locking is irreversible and occurs at the sector level, ensuring calibration data or cryptographic keys remain tamper-proof after deployment.

S29GL128S10GHB010 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-S
Package/Case:
56-VFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
-
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR (SLC)
Memory Size:
128Mbit
Memory Organization:
16M x 8
Memory Interface:
CFI
Clock Frequency:
-
Write Cycle Time - Word, Page:
60ns
Access Time:
100 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
56-FBGA (9x7)

S29GL128S10GHB010 FAQ

1.How can I place an order for S29GL128S10GHB010 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL128S10GHB010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL128S10GHB010 reliable?

The price and inventory of S29GL128S10GHB010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10GHB010 is usually 5 days.

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S29GL128S10GHB010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL128S10GHB010 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL128S10GHB010?

For technical support, including S29GL128S10GHB010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10GHB010 requirements.

6.How does Aetrix verify that S29GL128S10GHB010 is sourced from the original manufacturer or authorized distributors?

All S29GL128S10GHB010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10GHB010 meets industry standards.

7.What is the process for return or replacement of S29GL128S10GHB010?

All S29GL128S10GHB010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10GHB010, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL128S10GHB010 part is unused and in its original packaging.

Return procedure for S29GL128S10GHB010:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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