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Infineon Technologies S29GL128S10GHIV20
- Part No.:
- S29GL128S10GHIV20
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-VFBGA
- Datasheet:
-
S29GL128S10GHIV20.pdf
- Description:
- IC FLASH 128MBIT PARALLEL 56FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,625
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Product details
Overview
S29GL128S10GHIV20 from Infineon is a 128 Mb (16 MB), 3.0 V core, parallel-interface MIRRORBIT™ Eclipse flash memory with ×16 data bus, 90 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C). It integrates hardware ECC for single-bit error correction, 128-kbyte uniform sector erase, and a 512-byte write buffer-enabling fast embedded code storage and firmware update in microcontroller boot loaders.
For engineers reviewing the S29GL128S10GHIV20 datasheet, S29GL128S10GHIV20 pinout, S29GL128S10GHIV20 application, or S29GL128S10GHIV20 equivalent, key selection criteria include asynchronous parallel interface timing compliance, OTP array availability for secure configuration, Versatile I/O voltage support (1.65 V to VCC), and AEC-Q100 grade 3 qualification for automotive control modules.
Technical Context
This device implements an asynchronous parallel flash architecture with dedicated X/Y decoders, on-die erase/program voltage generators, and a state machine-driven Embedded Algorithm Controller (EAC) that executes sector erase and buffer programming without host CPU intervention. It supports CFI-compliant identification and status register polling via DQ7/DQ6.
The memory array is organized into uniform 128-kbyte sectors, each independently erasable; the 1024-byte OTP array contains two lockable regions for immutable calibration or security keys. ECC operates transparently during read cycles, correcting single-bit errors in real time using internal syndrome calculation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 128 Mb (16 MB), organized as 1,048,576 × 16-bit words |
| Random access time | 90 ns at VCC = VIO = 3.0 V - determines minimum instruction fetch latency in XIP boot scenarios |
| Page access time | 15 ns - enables rapid sequential reads within 32-byte aligned pages for firmware execution efficiency |
| Write buffer size | 512 bytes - allows single-command programming of up to 256 words, reducing host overhead vs. byte-by-byte writes |
| ECC capability | Internal hardware single-bit error correction - eliminates need for external ECC logic in safety-critical boot memory |
| Endurance & retention | 100,000 program/erase cycles; 20-year data retention at 85°C - validated for long-life industrial controller firmware storage |
| Operating temperature | –40°C to +85°C (Industrial grade) - qualified per JEDEC JESD22-A108, suitable for enclosed industrial enclosures |
Pinout & Package
Package: 56-pin TSOP (Type I, 400 mil width), compliant with JEDEC MO-142AB. Pin pitch: 0.5 mm. Body dimensions: 18.4 mm × 10.16 mm × 1.2 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | 23-bit address bus supporting full 16 MB address space; A22 is MSB for 128 Mb density |
| DQ0–DQ15 | Data I/O bidirectional bus | ×16 parallel interface; supports both read and write transfers on same pins with direction controlled by WE# and OE# |
| CE# | Chip enable (active low) | Enables device for read/write operations; deassertion places device in low-power standby (<100 µA) |
| OE# | Output enable (active low) | Gates output drivers during read; required for valid data assertion on DQ bus |
| WE# | Write enable (active low) | Controls write latching and command execution; must be asserted with CE# and proper address/data setup |
| RY/BY# | Ready/Busy indicator (open-drain) | Low during embedded erase/program; used for hardware polling instead of software status register reads |
| WP# | Hardware write protect (active low) | Physically disables sector erase and program commands when asserted - provides board-level protection against accidental writes |
| VCC | Core power supply | Single 2.7–3.6 V supply powers core logic, charge pumps, and I/O buffers - eliminates need for separate VPP |
| VIO | I/O power supply | 1.65–3.6 V range enables interfacing with 1.8 V, 2.5 V, or 3.3 V host buses without level shifters |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage support | VIO range 1.65 V to VCC enables direct connection to mixed-voltage SoCs without external level translation |
| 512-byte write buffer | Reduces effective programming time by >60% vs. single-word writes - critical for field firmware updates with minimal downtime |
| Hardware ECC engine | Corrects single-bit errors on-the-fly during read; no CPU cycle penalty or software driver dependency |
| Uniform 128-kbyte sectors | Enables deterministic erase scheduling and wear leveling across 128 independent blocks - simplifies bootloader partitioning |
| OTP array with dual lock | 1024-byte one-time-programmable region split into two separately lockable sections for secure key and calibration storage |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot code and calibrated lookup tables in AEC-Q100 grade 3 ECU modules operating continuously at 85°C ambient. IC Role / Device Role / Timing Role: Non-volatile XIP-capable boot memory with deterministic 90 ns read latency and hardware ECC for ASIL-B functional safety compliance. Use Value: Eliminates external error correction logic while meeting ISO 26262 diagnostic coverage requirements for boot integrity verification. |
Use Scenario: Holding firmware images and configuration parameters in DIN-rail mounted programmable logic controllers deployed in factory automation cabinets. IC Role / Device Role / Timing Role: High-reliability parallel flash for cold-boot initialization and over-the-air firmware rollback with 100,000-cycle endurance. Use Value: Supports secure field updates via 512-byte buffer programming and sector-level erase granularity without interrupting real-time I/O scanning. |
| Medical Diagnostic Imaging Boot Loader | Telecom Base Station Configuration Memory |
Use Scenario: Hosting primary boot loader and FPGA bitstream in portable ultrasound systems requiring 20-year data retention under thermal cycling. IC Role / Device Role / Timing Role: Radiation-tolerant, long-life non-volatile memory with OTP-secured calibration coefficients and ECC-protected boot vector table. Use Value: Meets IEC 62304 Class C software lifecycle requirements through verified 20-year retention and single-bit error resilience. |
Use Scenario: Storing radio frequency calibration data and protocol stack configuration in outdoor 5G remote radio units exposed to –40°C to +85°C thermal swings. IC Role / Device Role / Timing Role: Industrial-grade parallel flash with Versatile I/O supporting 1.8 V FPGA configuration interfaces and hardware WP# for tamper-resistant settings. Use Value: Enables reliable reconfiguration after power loss without external voltage translators or backup batteries. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128P10TFIV10 | Same density and timing, but uses 64-ball LAE Fortified BGA (9 mm × 9 mm); lacks OTP array | Preferred for space-constrained PCB layouts where TSOP footprint is prohibitive; unsuitable for secure key storage | Select when board area is critical and OTP functionality is not required |
| MX29GL128FHT2I-90G | Macronix part with 90 ns access, but no integrated ECC; requires external error handling; different CFI command set | Lower BOM cost where functional safety certification is not mandated; incompatible with Infineon's ECC-aware boot ROM | Select only for cost-sensitive non-safety applications with full firmware redesign for error detection |
Compared with S29GL128P10TFIV10 and MX29GL128FHT2I-90G, the S29GL128S10GHIV20 uniquely delivers OTP-based security, hardware ECC, and TSOP packaging in a single industrial-grade device-making it optimal for legacy-compatible, safety-aware embedded designs requiring minimal layout change.
Availability
S29GL128S10GHIV20 is available at Aetrix Electronics and suitable for automotive ECU boot memory, industrial PLC firmware storage, medical imaging boot loaders, and telecom base station configuration requiring stable component supply across extended product lifecycles.
Supply support for S29GL128S10GHIV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D centers and ISO/TS 16949-certified wafer fabs.
The GL-S family targets high-reliability embedded systems requiring XIP-capable flash with robust data integrity, targeting automotive, industrial, and medical applications where long-term firmware stability and safety certification are mandatory.
FAQ
Does S29GL128S10GHIV20 support execute-in-place (XIP) operation?
Yes, it supports true XIP operation with 90 ns random access time and 15 ns page mode reads, enabling direct CPU instruction fetch from flash without copying to RAM. The device's asynchronous interface and fast initial access meet ARM Cortex-M and PowerPC e200 boot timing requirements without wait states.
What is the function of the STB pin on S29GL128S10GHIV20?
The STB (Standby) pin is not present on this TSOP variant; it appears only on certain FBGA packages (e.g., LAE/LAA) for advanced power management. The TSOP version (S29GL128S10GHIV20) enters standby automatically when CE# is deasserted, drawing <100 µA - no STB pin required.
Can the OTP array be reprogrammed after locking?
No. Once either of the two OTP lock bits is set via the CFI command sequence, the corresponding 512-byte region becomes permanently read-only. Locking is irreversible and requires VPP = VCC during the lock command - no unlock mechanism exists per datasheet specification.
Is the RY/BY# pin compatible with standard open-drain bus wiring?
Yes, RY/BY# is an open-drain output requiring an external pull-up resistor (typically 4.7 kΩ to VIO). It drives low during active erase/program operations and floats high otherwise, allowing wired-OR connection with other devices on shared status lines in multi-flash systems.
S29GL128S10GHIV20 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-VFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-FBGA (9x7)
S29GL128S10GHIV20 FAQ
1.How can I place an order for S29GL128S10GHIV20 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128S10GHIV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128S10GHIV20 reliable?
The price and inventory of S29GL128S10GHIV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10GHIV20 is usually 5 days.
3.What payment methods are accepted for S29GL128S10GHIV20?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S10GHIV20 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL128S10GHIV20?
S29GL128S10GHIV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL128S10GHIV20 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL128S10GHIV20?
For technical support, including S29GL128S10GHIV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10GHIV20 requirements.
6.How does Aetrix verify that S29GL128S10GHIV20 is sourced from the original manufacturer or authorized distributors?
All S29GL128S10GHIV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10GHIV20 meets industry standards.
7.What is the process for return or replacement of S29GL128S10GHIV20?
All S29GL128S10GHIV20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10GHIV20, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128S10GHIV20 part is unused and in its original packaging.
Return procedure for S29GL128S10GHIV20:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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