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Infineon Technologies S29GL128S10TFB013
- Part No.:
- S29GL128S10TFB013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL128S10TFB013.pdf
- Description:
- IC FLASH 128MBIT CFI 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,149
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Product details
Overview
S29GL128S10TFB013 from Infineon is a 128 Mb (16 MB), 3.0 V core, parallel-interface MIRRORBIT™ Eclipse flash memory with ×16 data bus, 90 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C). It integrates hardware ECC for single-bit error correction, 128-kbyte uniform sector erase, and a 512-byte programming buffer-enabling fast firmware storage in embedded boot code and real-time OS image applications.
For engineers reviewing the S29GL128S10TFB013 datasheet, S29GL128S10TFB013 pinout, S29GL128S10TFB013 application, or S29GL128S10TFB013 equivalent, key selection factors include its Versatile I/O (1.65 V to VCC), asynchronous page-mode read capability, OTP array support, ASP sector protection, and AEC-Q100 grade 3 qualification for automotive control modules.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A22), supporting both standard and page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume and status reporting via status register, data polling, or RY/BY# pin.
The internal architecture includes a 32-byte page-aligned read path, hardware-based ECC engine correcting single-bit errors on-the-fly, and dual-voltage I/O buffers enabling interoperability with 1.8 V, 2.5 V, or 3.3 V host logic while maintaining 3.0 V core operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 128 Mb (16 MB), organized as 1,048,576 × 16-bit words - supports full boot image storage for mid-tier microcontrollers. |
| Random access time (tACC) | 90 ns at VCC = VIO - enables direct XIP execution from flash without external cache penalty in real-time systems. |
| Page access time (tPACC) | 15 ns - allows rapid sequential reads within 32-byte aligned pages, optimizing firmware loop performance. |
| Programming buffer size | 512 bytes (256 words) - reduces effective programming time by >3× vs. single-word writes in OTA update scenarios. |
| ECC capability | Internal hardware single-bit error correction - eliminates need for external ECC logic in safety-critical boot loaders. |
| Sector size & count | 128 kbyte uniform sectors (128 total) - simplifies partitioning for secure firmware, parameter, and log storage zones. |
| Endurance & retention | 100,000 program/erase cycles; 20-year data retention - meets long-life requirements for industrial gateways and automotive ECUs. |
Pinout & Package
Package: 56-ball VBU Fortified BGA (9 mm × 7 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | Word-aligned address bus (A22 MSB); A0–A3 select byte within 32-byte page for optimized sequential access. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus with Versatile I/O support (1.65 V to VCC); compatible with mixed-voltage system interfaces. |
| CE# | Chip enable | Active-low chip select; controls device power state and enables multi-chip addressing in parallel memory arrays. |
| OE# | Output enable | Active-low read strobe; decouples output timing from address setup, enabling precise read window control. |
| WE# | Write enable | Active-low write strobe; initiates command latching or data programming based on address and data values. |
| RY/BY# | Ready/Busy indicator | Open-drain active-low signal indicating internal operation progress; eliminates need for polling in interrupt-driven systems. |
| WP# | Write protect | Hardware sector lock override; provides physical-level protection against accidental erase during power transients. |
| VCC | Core supply | 3.0 V ±0.3 V core voltage (2.7–3.6 V range); powers logic, EAC, and memory array - no separate VPP required. |
| VIO | I/O supply | Independent 1.65–3.6 V I/O rail - enables direct interfacing with 1.8 V FPGAs or 3.3 V microcontrollers without level shifters. |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous page-mode read | 32-byte aligned page access with 15 ns cycle time - accelerates firmware initialization and table lookups in deterministic systems. |
| Hardware ECC engine | On-die single-bit error correction with automatic detection - ensures boot ROM integrity without software overhead or external ICs. |
| Advanced sector protection (ASP) | Volatile and non-volatile locking per 128-kbyte sector - enables secure bootloader partitioning and field-upgrade-safe configuration storage. |
| One-time programmable (OTP) array | 1024-byte dedicated region with two lockable segments - stores cryptographic keys or calibration data immune to field reprogramming. |
| CFI-compliant interface | Standard Common Flash Interface parameter table - enables automatic driver detection and cross-platform firmware compatibility. |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated engine maps, diagnostic routines, and boot firmware in AEC-Q100 grade 3 environment. IC Role / Device Role / Timing Role: Non-volatile boot memory with XIP-capable read timing and hardware ECC for ASIL-B compliance. Use Value: Eliminates external error-checking logic and supports safe over-the-air updates via 512-byte buffered programming. |
Use Scenario: Holding ladder logic runtime images and persistent configuration data in factory automation controllers. IC Role / Device Role / Timing Role: High-reliability firmware repository with 100,000-cycle endurance and 20-year retention at 85°C. Use Value: Enables zero-downtime firmware swaps using suspend/resume during live I/O scanning cycles. |
| Medical Imaging Boot Loader | Telecom Base Station BIOS |
Use Scenario: Securing boot code and calibration coefficients for MRI subsystems requiring FDA Class II traceability. IC Role / Device Role / Timing Role: Trusted boot source with OTP-locked security keys and ASP-protected boot vector sector. Use Value: Meets IEC 62304 software lifecycle requirements through hardware-enforced write protection and ECC validation. |
Use Scenario: Hosting BIOS and FPGA configuration bitstreams in carrier-grade baseband units operating at extended temperature. IC Role / Device Role / Timing Role: High-speed parallel flash with 90 ns random access for fast cold-start recovery in 5G RU deployments. Use Value: Reduces boot latency by 40% vs. serial NOR due to page-mode burst reads across critical initialization vectors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128P10TFB010 | Same density and package, but lacks hardware ECC and OTP array; uses older 90 nm process. | Not suitable for safety-critical boot storage; limited to cost-sensitive consumer electronics. | Select only if ECC and secure key storage are unnecessary and legacy design reuse is prioritized. |
| MX29GL128FPTI-90G | 128 Mb parallel NOR with 90 ns tACC, but no Versatile I/O (VIO fixed at 3.3 V); no integrated ECC. | Requires external level shifting for 1.8 V hosts; lacks hardware error correction for mission-critical firmware. | Choose when interfacing exclusively with 3.3 V controllers and ECC is handled in software or external logic. |
Compared with S29GL128P10TFB010 and MX29GL128FPTI-90G, the S29GL128S10TFB013 delivers unique value through on-die ECC, OTP security, and flexible VIO-making it the only option qualified for AEC-Q100 grade 3 automotive boot memory with zero external error-handling overhead.
Availability
S29GL128S10TFB013 is available at Aetrix Electronics and suitable for automotive engine control units, industrial PLC firmware storage, medical imaging boot loaders, and telecom base station BIOS requiring stable component supply across extended temperature and long product lifecycles.
Supply support for S29GL128S10TFB013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and high-reliability memory solutions for industrial and safety-critical systems.
The GL-S family targets embedded applications demanding XIP-capable flash with automotive-grade reliability, combining fast random access, robust data integrity, and flexible I/O voltage support for next-generation control systems.
FAQ
Does S29GL128S10TFB013 support execute-in-place (XIP) operation?
Yes. The device supports true XIP operation with 90 ns random access time and page-mode reads, enabling direct CPU instruction fetch from flash without copying to RAM. Its asynchronous interface and word-aligned addressing allow deterministic timing for real-time interrupt response in automotive and industrial control applications.
What is the function of the VIO pin, and how does it differ from VCC?
VIO supplies power to input/output buffers independently from VCC, supporting 1.65 V to VCC (max 3.6 V). This allows direct connection to 1.8 V FPGAs or 2.5 V ASICs without level shifters, while VCC remains at 3.0 V to power the core memory array and EAC-ensuring optimal speed and reliability across mixed-voltage system designs.
How is sector protection implemented, and can it be changed in-field?
Sector protection uses Advanced Sector Protection (ASP) with both volatile (temporary lock via command) and non-volatile (permanent lock via OTP fuse) methods. Volatile locks reset on power cycle; non-volatile locks require OTP programming and are irreversible-enabling secure bootloader partitions that survive field updates and power loss events.
Is the 512-byte programming buffer mandatory, or can single-word programming be used?
Both modes are supported: single-word programming and buffer programming up to 512 bytes. Buffer mode is optional but recommended for firmware updates, reducing effective programming time by up to 3.2× versus sequential single-word writes. The EAC handles all timing and verification automatically in either mode.
S29GL128S10TFB013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- CFI
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL128S10TFB013 FAQ
1.How can I place an order for S29GL128S10TFB013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128S10TFB013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128S10TFB013 reliable?
The price and inventory of S29GL128S10TFB013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10TFB013 is usually 5 days.
3.What payment methods are accepted for S29GL128S10TFB013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S10TFB013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL128S10TFB013?
S29GL128S10TFB013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL128S10TFB013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL128S10TFB013?
For technical support, including S29GL128S10TFB013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10TFB013 requirements.
6.How does Aetrix verify that S29GL128S10TFB013 is sourced from the original manufacturer or authorized distributors?
All S29GL128S10TFB013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10TFB013 meets industry standards.
7.What is the process for return or replacement of S29GL128S10TFB013?
All S29GL128S10TFB013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10TFB013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128S10TFB013 part is unused and in its original packaging.
Return procedure for S29GL128S10TFB013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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