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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL128S10TFB023

Name: S29GL128S10TFB023
Brand: Infineon Technologies
SKU: S29GL128S10TFB023
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL128S10TFB023

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-TFSOP (0.724", 18.40mm Width)

Datasheet:: S29GL128S10TFB023.pdf

Description:: IC FLASH 128MBIT CFI 56TSOP

Quantity:: RFQ Add To RFQ list

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Product details

Overview

S29GL128S10TFB023 from Infineon is a 128 Mb (16 MB) parallel NOR flash memory IC with 3.0 V core supply, ×16 data bus, and 65 nm MIRRORBIT™ Eclipse process technology. It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. Designed for embedded boot code storage in industrial control systems requiring AEC-Q100 Grade 2 qualification (–40°C to +105°C).

For engineers reviewing the S29GL128S10TFB023 datasheet, S29GL128S10TFB023 pinout, S29GL128S10TFB023 application, or S29GL128S10TFB023 equivalent, this device supports asynchronous XIP-capable read, 512-byte buffer programming, uniform 128-kB sector erase, and versatile I/O (1.65 V to VCC) - critical for automotive ECU firmware and industrial HMI boot memory design.

Technical Context

This parallel NOR flash implements an asynchronous interface with CE#, OE#, and WE# control signals, supporting word-aligned (16-bit) addressing up to A22 (4 MB address space). Its embedded algorithm controller (EAC) manages autonomous program/erase operations, status reporting via RY/BY# pin or status register, and suspend/resume capability for real-time interrupt handling.

The device integrates on-die ECC logic that automatically detects and corrects single-bit errors during read, and includes a dedicated 1024-byte OTP array with two lockable regions for secure configuration storage. Sector protection uses both volatile (via status register) and non-volatile (via ASP bits) methods, enabling fine-grained firmware write-protection.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	128 Mb (16 MB), mapped to 2²² word addresses for boot ROM expansion
Random access time	90 ns at full VCC = VIO, enabling direct XIP execution from flash without wait states
Page access time	15 ns, allowing rapid sequential reads within 32-byte aligned pages
Programming buffer	512 bytes, reducing effective programming time by batching writes instead of single-word operations
ECC support	On-chip hardware single-bit error correction, eliminating need for external ECC logic or software overhead
Endurance & retention	100,000 program/erase cycles and 20-year data retention at industrial temperature range
Supply voltage	Single 2.7 V–3.6 V VCC supply for read/program/erase; VIO independently configurable 1.65 V–VCC

Pinout & Package

Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/Terminal	Circuit Role	Design Meaning
A0–A22	Address inputs	Word-aligned address bus; A22 enables full 4 MB address space (2²² × 16-bit)
DQ0–DQ15	Data I/O	16-bit bidirectional data bus supporting byte/word writes and reads
CE#	Chip enable	Active-low chip select; controls device power state and command latching
OE#	Output enable	Active-low gate for data output drivers; used during read operations
WE#	Write enable	Active-low strobe for latching address/data during program/erase commands
RY/BY#	Ready/Busy indicator	Open-drain output signaling active embedded operation (low = busy)
RESET#	Hardware reset	Asynchronous active-low input forcing device into reset state and clearing status registers
VCC	Core supply	3.0 V nominal supply powering core logic, EAC, and memory array
VIO	I/O supply	Independent 1.65 V–VCC supply setting I/O voltage level for interfacing with diverse host controllers

Key Features

Feature	Design Value
Asynchronous page mode read	15 ns access within 32-byte pages enables high-throughput firmware fetch for real-time OS kernels
512-byte programming buffer	Reduces average programming time per byte by >60% vs. single-word writes in boot loader updates
Hardware ECC engine	Eliminates requirement for external error detection circuitry and reduces firmware validation complexity
Uniform 128-kB sectors	Enables deterministic erase timing and simplifies partitioning for dual-bank firmware over-the-air updates
Versatile I/O (VIO)	Allows direct interfacing with 1.8 V, 2.5 V, or 3.3 V microcontrollers without level shifters

Applications

Automotive Engine Control Unit (ECU)

Industrial Human-Machine Interface (HMI)

Use Scenario: Storing calibrated engine maps, diagnostic routines, and bootloader firmware in AEC-Q100 Grade 2 qualified ECUs.

IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with ≤90 ns latency.

Use Value: Meets automotive thermal requirements (–40°C to +105°C) and supports 100,000+ reflash cycles for field calibration updates.

Use Scenario: Hosting GUI assets, firmware images, and configuration data in panel-mounted HMIs deployed in factory automation.

IC Role / Device Role / Timing Role: Primary boot flash with 16-bit bus interface to ARM Cortex-A/M series processors.

Use Value: Versatile I/O allows direct connection to 1.8 V SoC interfaces while maintaining 20-year data retention under continuous operation.

Medical Diagnostic Imaging Controller

Railway Signaling System

Use Scenario: Storing FPGA configuration bitstreams and safety-critical application firmware in MRI/CT subsystem controllers.

IC Role / Device Role / Timing Role: Secure, ECC-protected firmware storage with OTP region for cryptographic key binding.

Use Value: Integrated hardware ECC ensures data integrity during long-term storage; OTP lock prevents unauthorized firmware modification.

Use Scenario: Boot code and safety firmware storage in EN 5012x-certified signaling interlock units operating in harsh rail environments.

IC Role / Device Role / Timing Role: Industrial-grade parallel NOR flash with sector protection for fail-safe firmware recovery.

Use Value: Uniform 128-kB sectors and suspend/resume allow safe firmware update mid-operation without system downtime.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL128S10TFI020	Same die, TSOP-56 package (not BGA); no VIO flexibility - VIO tied to VCC	Limited to PCBs with legacy TSOP footprints; incompatible with high-density BGA layouts	Select when board layout constraints prohibit BGA or require through-hole assembly
S29GL128S11TFB020	Same LAE BGA package but 110 ns random access (vs. 90 ns); identical ECC, OTP, and sector architecture	Suitable for cost-sensitive designs where 20 ns latency penalty is acceptable	Choose for price-optimized industrial applications where boot timing margin exceeds 110 ns

Compared with S29GL128S10TFB023, the TSOP variant sacrifices I/O voltage flexibility and board space efficiency, while the slower-speed BGA variant trades performance for lower unit cost - both retain identical firmware security and endurance characteristics.

Availability

S29GL128S10TFB023 is available at Aetrix Electronics and suitable for automotive ECU development, industrial HMI production, and medical imaging controller manufacturing requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S29GL128S10TFB023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.

The GL-S family targets high-reliability embedded systems needing fast, secure, and long-life parallel NOR flash - specifically engineered for automotive, industrial, and medical applications demanding AEC-Q100 qualification and 20-year data retention.

FAQ

What is the maximum operating temperature range for S29GL128S10TFB023?

The S29GL128S10TFB023 is rated for AEC-Q100 Grade 2 operation, supporting continuous operation from –40°C to +105°C. This rating is validated per JEDEC JESD22-A108 and confirmed in the official Infineon datasheet revision *U (2024-06-25), making it suitable for under-hood automotive and high-temperature industrial environments.

Does S29GL128S10TFB023 support execute-in-place (XIP) functionality?

Yes - the device supports true asynchronous XIP operation due to its 90 ns random access time and page-mode read capability. Host processors can fetch instructions directly from flash without copying to RAM, verified by the "fast random access" specification and block diagram showing direct address/data path to cell matrix in the datasheet.

How is the 1024-byte OTP array structured and secured?

The OTP array consists of two independent 512-byte lockable regions. Each region can be permanently locked via dedicated command sequences (0x60 → 0xD0), preventing further writes. Lock status is readable via CFI query and persists through power cycles, as documented in Section 2.7 and Table 2-12 of the datasheet.

Can S29GL128S10TFB023 interface with a 1.8 V microcontroller without level shifters?

Yes - the versatile I/O (VIO) feature allows VIO to be set between 1.65 V and VCC. When VCC = 3.0 V and VIO = 1.8 V, the device's DQ pins operate at 1.8 V logic levels, enabling direct connection to 1.8 V microcontrollers without external level translation circuitry.

S29GL128S10TFB023 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 56-TFSOP (0.724", 18.40mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: -

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR (SLC)

Memory Size:: 128Mbit

Memory Organization:: 16M x 8

Memory Interface:: CFI

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TSOP

S29GL128S10TFB023 FAQ

1.How can I place an order for S29GL128S10TFB023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL128S10TFB023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL128S10TFB023 reliable?

The price and inventory of S29GL128S10TFB023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10TFB023 is usually 5 days.

3.What payment methods are accepted for S29GL128S10TFB023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S10TFB023 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL128S10TFB023?

S29GL128S10TFB023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL128S10TFB023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL128S10TFB023?

For technical support, including S29GL128S10TFB023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10TFB023 requirements.

6.How does Aetrix verify that S29GL128S10TFB023 is sourced from the original manufacturer or authorized distributors?

All S29GL128S10TFB023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10TFB023 meets industry standards.

7.What is the process for return or replacement of S29GL128S10TFB023?

All S29GL128S10TFB023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10TFB023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL128S10TFB023 part is unused and in its original packaging.

Return procedure for S29GL128S10TFB023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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