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Infineon Technologies S29GL128S10TFI010

Part No.:
S29GL128S10TFI010
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
56-TFSOP (0.724", 18.40mm Width)
Datasheet:
AetrixS29GL128S10TFI010.pdf
Description:
IC FLASH 128MBIT PARALLEL 56TSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:559

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Product details

Overview

S29GL128S10TFI010 from Infineon is a 128 Mb (16 MB), 3.0 V core, parallel-interface MIRRORBIT™ Eclipse flash memory with ×16 data bus, 90 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C). It integrates hardware ECC for single-bit error correction, 128-kbyte uniform sector erase, and a 512-byte write buffer-enabling fast embedded code storage and firmware updates in microcontroller-based systems.

For engineers reviewing the S29GL128S10TFI010 datasheet, S29GL128S10TFI010 pinout, S29GL128S10TFI010 application, or S29GL128S10TFI010 equivalent, key selection criteria include parallel ×16 interface timing compliance, Versatile I/O voltage support (1.65 V to VCC), OTP array availability, ASP sector protection flexibility, and AEC-Q100 grade compatibility for automotive control modules.

Technical Context

This device implements an asynchronous parallel flash architecture with dedicated X/Y decoders, on-chip erase/program voltage generators, and state-controlled command execution. Its embedded algorithm controller (EAC) manages all program/erase operations-including suspend/resume-and enforces CFI-compliant identification and status reporting via status register, data polling, and RY/BY# pin.

The memory array is organized into uniform 128-kbyte sectors, each independently erasable, and includes a separate 1024-byte one-time-programmable (OTP) array with two lockable regions. Hardware ECC operates transparently during read cycles, correcting single-bit errors without software intervention.

Key Specifications

ParameterValue and Actual Design Meaning
Memory density128 Mb (16 MB), organized as 1,048,576 × 16-bit words
Random access time (tACC)90 ns at VCC = VIO = 3.0 V - determines worst-case instruction fetch latency
Page access time (tPACC)15 ns - enables rapid sequential reads within 32-byte aligned pages
Write buffer size512 bytes - allows single-command programming of up to 256 words, reducing host overhead
ECC capabilityOn-the-fly single-bit error correction - maintains data integrity without external logic
Endurance & retention100,000 program/erase cycles; 20-year data retention at 85°C
Operating voltageVCC = 2.7 V to 3.6 V; VIO = 1.65 V to VCC - supports mixed-voltage system interfacing

Pinout & Package

Package: 56-pin TSOP (Thin Small Outline Package), standard JEDEC MO-141AC footprint, 20.0 mm × 10.16 mm × 1.2 mm height.

Pin/TerminalCircuit RoleDesign Meaning
A0–A22Address inputs23-bit address bus supporting full 128 Mb addressing (AMAX = A22)
DQ0–DQ15Data I/O16-bit bidirectional data bus; supports word-wide transfers only
CE#Chip enableActive-low chip select; controls device power state and command acceptance
OE#Output enableActive-low gate for data output drivers; used during read operations
WE#Write enableActive-low strobe for write/program command latching and data capture
RY/BY#Ready/Busy indicatorOpen-drain output signaling active program/erase; high = ready, low = busy
RESET#Hardware resetActive-low asynchronous reset that halts ongoing operations and clears status registers
WP#Write protectHardware sector protection override; disables program/erase when asserted

Key Features

FeatureDesign Value
Versatile I/O voltage rangeVIO supports 1.65 V to VCC - enables direct interfacing with 1.8 V, 2.5 V, or 3.3 V controllers without level shifters
Asynchronous page-mode read32-byte aligned page access with 15 ns cycle time - accelerates boot code and lookup table reads
Advanced sector protection (ASP)Volatile and non-volatile locking per 128-kbyte sector - prevents accidental firmware overwrite in field-deployed units
Common Flash Interface (CFI)Standardized parameter table accessible via read commands - enables OS/driver auto-detection and configuration
Secure silicon region (OTP)1024-byte factory-programmable area with dual lockable regions - stores keys, calibration data, or serial numbers

Applications

Automotive Engine Control Unit (ECU)Industrial PLC Firmware Storage

Use Scenario: Storing calibrated engine maps, diagnostic routines, and bootloader code in AEC-Q100 Grade 3 compliant ECUs.

IC Role / Device Role / Timing Role: Non-volatile code storage with XIP-capable random access and deterministic 90 ns read latency.

Use Value: Enables fast cold-start execution and secure over-the-air (OTA) firmware updates via hardware ECC and sector protection.

Use Scenario: Holding ladder logic firmware, I/O configuration, and safety-critical runtime parameters in DIN-rail mounted programmable logic controllers.

IC Role / Device Role / Timing Role: High-reliability parallel flash for deterministic boot and field-upgradeable application code.

Use Value: 100,000 erase cycles and 20-year retention ensure multi-decade operation in unattended industrial environments.

Medical Imaging Boot MemoryAvionics Display System Code Storage

Use Scenario: Hosting boot firmware and FPGA configuration bitstreams in FDA-cleared ultrasound and MRI subsystems.

IC Role / Device Role / Timing Role: Radiation-tolerant, high-integrity flash with hardware ECC and OTP for device identity binding.

Use Value: Single-bit ECC correction eliminates soft-error-induced boot failures; OTP locks regulatory certification data.

Use Scenario: Storing display controller firmware and graphics assets in DO-178C-certified cockpit displays.

IC Role / Device Role / Timing Role: Parallel ×16 flash with guaranteed -40°C to +85°C operation and CFI-based driver initialization.

Use Value: Meets RTCA DO-160 environmental stress requirements and supports deterministic boot timing under thermal cycling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S29GL128S10TFI020Same die, 56-ball VBU Fortified BGA (9 mm × 7 mm); no TSOP packageRequires PCB redesign for BGA layout and reflow; better thermal performance in compact enclosuresSelect for space-constrained designs where board area is prioritized over through-hole assembly.
S29GL128S90TFI010Same TSOP package but 90 ns max tACC (vs. 90 ns typical); identical timing specs otherwiseNo functional difference in most systems; marginally tighter timing validation may be requiredSelect when full 90 ns worst-case timing compliance is mandated by system-level timing budget.

Compared with S29GL128S10TFI010, the VBU-packaged variant offers superior thermal dissipation and smaller footprint but requires BGA assembly infrastructure, while the 90 ns-rated version provides identical functionality with formally guaranteed worst-case access time for timing-critical legacy platforms.

Availability

S29GL128S10TFI010 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware upgrades, and medical imaging boot memory applications requiring stable component supply across extended product lifecycles.

Supply support for S29GL128S10TFI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.

The GL-S family targets high-reliability embedded systems requiring XIP-capable parallel flash with robust data integrity, long-term endurance, and automotive-grade qualification - especially where firmware security and field-upgradability are critical.

FAQ

What is the purpose of the Versatile I/O (VIO) feature?

The Versatile I/O feature allows independent voltage supply (1.65 V to VCC) for the DQ pins, enabling direct interface with lower-voltage microcontrollers (e.g., 1.8 V or 2.5 V cores) without external level shifters. This reduces BOM cost and signal integrity risk while maintaining full 16-bit data throughput and timing compliance.

Does S29GL128S10TFI010 support execute-in-place (XIP)?

Yes - its fast 90 ns random access time and asynchronous parallel interface allow direct CPU instruction fetch from flash memory without copying to RAM. This is confirmed by its classification as a "MIRRORBIT™ Eclipse XIP + Data Storage" device in Infineon's documentation and supported by page-mode read acceleration for sequential code execution.

How does the hardware ECC operate during read cycles?

Hardware ECC runs transparently on every read access: the internal circuitry checks each 512-byte sector for single-bit errors and corrects them before data reaches the DQ pins. No software intervention or additional timing overhead is required, and corrected data appears identical to uncorrupted reads - preserving system determinism and simplifying firmware design.

Can the OTP array be reprogrammed after initial programming?

No - the 1024-byte OTP (One-Time-Programmable) array is permanently programmed during manufacturing or first-use programming. Once a byte is written and locked (via dedicated lock bits), it cannot be altered. The two lockable regions allow independent locking of calibration data and cryptographic keys, ensuring immutable device identity and security parameters.

S29GL128S10TFI010 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-S
Package/Case:
56-TFSOP (0.724", 18.40mm Width)
Packaging:
Tray
Product Status:
Active
Programmable:
Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
128Mbit
Memory Organization:
8M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
60ns
Access Time:
100 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
56-TSOP

S29GL128S10TFI010 FAQ

1.How can I place an order for S29GL128S10TFI010 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL128S10TFI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL128S10TFI010 reliable?

The price and inventory of S29GL128S10TFI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10TFI010 is usually 5 days.

3.What payment methods are accepted for S29GL128S10TFI010?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S10TFI010 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL128S10TFI010?

S29GL128S10TFI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL128S10TFI010 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL128S10TFI010?

For technical support, including S29GL128S10TFI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10TFI010 requirements.

6.How does Aetrix verify that S29GL128S10TFI010 is sourced from the original manufacturer or authorized distributors?

All S29GL128S10TFI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10TFI010 meets industry standards.

7.What is the process for return or replacement of S29GL128S10TFI010?

All S29GL128S10TFI010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10TFI010, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL128S10TFI010 part is unused and in its original packaging.

Return procedure for S29GL128S10TFI010:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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