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Infineon Technologies S29GL128S10TFI023
- Part No.:
- S29GL128S10TFI023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL128S10TFI023.pdf
- Description:
- IC FLASH 128MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,923
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Product details
Overview
S29GL128S10TFI023 from Infineon is a 128 Mb (16 MB), 3.0 V core, parallel-interface MIRRORBIT™ Eclipse flash memory with ×16 data bus, 90 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C). It integrates hardware ECC for single-bit error correction, 128-kbyte uniform sector erase, and a 512-byte programming buffer - deployed in boot code storage for industrial HMIs and firmware update storage in network edge gateways.
For engineers reviewing the S29GL128S10TFI023 datasheet, S29GL128S10TFI023 pinout, S29GL128S10TFI023 application, or S29GL128S10TFI023 equivalent, key selection criteria include asynchronous parallel interface timing compliance, OTP array availability for secure configuration, Versatile I/O voltage range (1.65 V to VCC), and AEC-Q100 grade compatibility for automotive control modules.
Technical Context
This device implements an asynchronous parallel flash architecture with dedicated X/Y decoders, on-die erase/program voltage generators, and state-controlled command execution. It supports CFI-compliant identification, status register polling, RY/BY# signaling, and suspend/resume for both program and erase operations.
The embedded algorithm controller (EAC) manages all internal write/erase sequences, including automatic ECC generation and verification during read-modify-write cycles. Sector protection uses volatile and non-volatile lock bits per 128-kbyte sector, and the 1024-byte OTP array is split into two independently lockable regions for secure key or calibration data storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 128 Mb (16 MB); supports full firmware image storage for mid-tier microcontrollers |
| Interface type | Asynchronous parallel ×16 bus; no clock required, compatible with legacy ARM9/PowerPC boot interfaces |
| Random access time | 90 ns at VCC = VIO; enables direct XIP execution from flash without external cache penalty |
| Page access time | 15 ns; allows rapid sequential reads within 32-byte aligned pages for instruction fetch bursts |
| Programming buffer | 512 bytes; reduces effective programming time by batching up to 256 words per command |
| ECC capability | Internal hardware single-bit error correction; eliminates need for external ECC logic in safety-critical systems |
| Endurance | 100,000 program/erase cycles per sector; supports field firmware updates over 10+ year product life |
| Data retention | 20 years at +85°C; validated for long-term deployment in uncooled industrial enclosures |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), standard JEDEC MO-141AC footprint, 18.4 mm × 10.16 mm body size, lead pitch 0.5 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | 23-bit word address bus; A22 is MSB for 128 Mb (2²³ × 16-bit = 16 MB) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte/word writes via WE# and BYTE# control |
| CE# | Chip enable | Active-low device select; controls power-down entry when deasserted |
| OE# | Output enable | Active-low read strobe; gates output drivers without affecting internal state |
| WE# | Write enable | Active-low write strobe; initiates command latching or data programming |
| RY/BY# | Ready/Busy indicator | Open-drain active-low signal; asserts low during erase/program, high when ready |
| RESET# | Hardware reset | Active-low asynchronous reset; aborts ongoing operation and returns to read mode |
| WP# | Write protect | Active-low hardware sector protection override; disables program/erase when asserted |
| VCC | Core supply | 3.0 V ±0.3 V; powers core logic, EAC, and voltage generators |
| VIO | I/O supply | 1.65 V to VCC; independent I/O voltage enables interfacing with 1.8 V or 3.3 V controllers |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC, enabling interoperability with mixed-voltage SoCs without level shifters |
| 512-byte programming buffer | Reduces average programming time by >60% vs. single-word writes, critical for OTA firmware patching |
| Hardware ECC engine | Single-bit correction with no software overhead; meets IEC 61508 SIL-2 data integrity requirements |
| Uniform 128-kbyte sectors | Enables deterministic erase scheduling and wear leveling across 128 independent erasable blocks |
| OTP array with dual lock regions | 1024-byte one-time-programmable space split into two 512-byte lockable zones for secure key + calibration separation |
| Suspend/resume capability | Allows interrupting erase or program to service high-priority reads, essential for real-time HMI responsiveness |
Applications
| Industrial HMI Boot Storage | Automotive ADAS Firmware Vault |
|---|---|
|
Use Scenario: Storing boot loader and kernel images for ARM Cortex-A7-based human-machine interface panels in factory automation. IC Role / Device Role / Timing Role: Primary non-volatile boot memory with XIP-capable random access and deterministic 90 ns latency for cold-start execution. Use Value: Eliminates external SRAM requirement for boot code shadowing; 20-year retention ensures firmware persistence across equipment lifecycle. |
Use Scenario: Secure firmware storage for radar processing units requiring AEC-Q100 Grade 2 qualification (–40°C to +105°C). IC Role / Device Role / Timing Role: Dual-role flash: main firmware partition + protected OTP region for cryptographic keys and sensor calibration data. Use Value: Hardware ECC and sector-level ASP meet ISO 26262 ASIL-B fault containment requirements for safety-critical updates. |
| Network Edge Gateway Image Storage | Medical Diagnostic Device Configuration |
|
Use Scenario: Holding full Linux OS image and field-upgradable application binaries in 5G small cell gateways operating in outdoor cabinets. IC Role / Device Role / Timing Role: High-reliability parallel flash with 100,000-cycle endurance supporting remote firmware rollbacks and delta updates. Use Value: 512-byte buffer enables sub-second OTA patch application; Versatile I/O simplifies interface to 1.8 V FPGA fabric. |
Use Scenario: Storing calibrated sensor coefficients and regulatory-compliant device configuration profiles in portable ultrasound systems. IC Role / Device Role / Timing Role: Trusted configuration store using OTP lock regions to prevent unauthorized parameter tampering. Use Value: Dual-lock OTP prevents simultaneous overwrite of calibration and security keys; industrial temp grade ensures stability during sterilization cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128S10TFI020 | Same die, identical specs, but shipped in 64-ball LAE Fortified BGA (9 mm × 9 mm) | Requires PCB redesign for BGA layout; better thermal dissipation in high-density layouts | Select for space-constrained designs where TSOP footprint is prohibitive |
| MX29GL128FPTI-90G | Macronix 128 Mb parallel NOR; 90 ns access, no integrated ECC, no OTP array | Lacks hardware ECC and secure OTP; requires external error handling and key management | Select only if cost sensitivity outweighs functional safety and security requirements |
Compared with S29GL128S10TFI020, the TSOP variant offers easier prototyping and rework; compared with MX29GL128FPTI-90G, it delivers built-in ECC and OTP security - eliminating external components and reducing BOM risk in certified medical/automotive systems.
Availability
S29GL128S10TFI023 is available at Aetrix Electronics and suitable for industrial HMI boot storage, automotive ADAS firmware vaults, and network edge gateway image storage requiring stable component supply across multi-year production programs.
Supply support for S29GL128S10TFI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
The GL-S family targets high-reliability embedded systems requiring XIP-capable flash with industrial and automotive qualification, emphasizing data integrity, long-term retention, and secure configuration storage.
FAQ
Does S29GL128S10TFI023 support execute-in-place (XIP) operation?
Yes. Its 90 ns random access time and asynchronous parallel interface enable direct instruction fetch from flash without copying to RAM. The device supports page-mode reads for burst instruction fetching, and its CFI table provides boot loader compatibility with standard XIP-aware boot ROMs and U-Boot implementations.
What is the function of the STB pin on S29GL128S10TFI023?
The STB (Strobe) pin is not present on the S29GL128S10TFI023. This part uses standard CE#, OE#, and WE# control signals only - STB appears in older S29GL device families but was removed in the GL-S series. Pin 1 on the 56-pin TSOP package is NC (No Connect), not STB.
Can the OTP array be reprogrammed after locking?
No. Once either of the two 512-byte OTP lock bits is set (via specific unlock-and-program command sequence), that region becomes permanently read-only. The lock is irreversible and enforced by on-die fuses; no command or voltage sequence can clear it. Unlocking requires valid command sequences and proper timing - accidental lock is prevented by multi-step protocol.
Is VIO required to be equal to VCC for reliable operation?
No. VIO may range from 1.65 V to VCC, enabling flexible interfacing. For example, VCC = 3.3 V and VIO = 1.8 V is fully supported and validated per datasheet Table 10-5. However, VIO must remain stable during transitions; dynamic switching between VIO levels during active operation is not permitted.
S29GL128S10TFI023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL128S10TFI023 FAQ
1.How can I place an order for S29GL128S10TFI023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL128S10TFI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL128S10TFI023 reliable?
The price and inventory of S29GL128S10TFI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10TFI023 is usually 5 days.
3.What payment methods are accepted for S29GL128S10TFI023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S10TFI023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL128S10TFI023?
S29GL128S10TFI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL128S10TFI023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL128S10TFI023?
For technical support, including S29GL128S10TFI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10TFI023 requirements.
6.How does Aetrix verify that S29GL128S10TFI023 is sourced from the original manufacturer or authorized distributors?
All S29GL128S10TFI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10TFI023 meets industry standards.
7.What is the process for return or replacement of S29GL128S10TFI023?
All S29GL128S10TFI023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10TFI023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL128S10TFI023 part is unused and in its original packaging.
Return procedure for S29GL128S10TFI023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL128S10TFI023 Tags
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M24C02-WMN6TP
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