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Infineon Technologies S29GL128S10TFIV10

Part No.:
S29GL128S10TFIV10
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
56-TFSOP (0.724", 18.40mm Width)
Datasheet:
AetrixS29GL128S10TFIV10.pdf
Description:
IC FLASH 128MBIT PARALLEL 56TSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:967

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Product details

Overview

S29GL128S10TFIV10 from Infineon is a 128 Mb (16 MB) parallel NOR flash memory IC with 3.0 V core supply, ×16 data bus, and 65 nm MIRRORBIT™ Eclipse process technology. It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. Designed for embedded boot code storage in industrial control systems requiring high reliability and fast XIP execution.

For engineers reviewing the S29GL128S10TFIV10 datasheet, S29GL128S10TFIV10 pinout, S29GL128S10TFIV10 application, or S29GL128S10TFIV10 equivalent, key selection criteria include its 128-kbyte uniform sector erase granularity, 512-byte programming buffer, Versatile I/O (1.65 V to VCC), and AEC-Q100 Grade 2 qualification (–40°C to +105°C).

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A22), supporting both standard and page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume capability and status reporting via RY/BY#, data polling, and status register.

The flash array is organized into uniform 128-kbyte sectors, each individually erasable. Internal hardware ECC operates transparently during read cycles, correcting single-bit errors without software intervention and flagging uncorrectable multi-bit errors via the ECC status address space offset.

Key Specifications

ParameterValue and Actual Design Meaning
Density128 Mb (16 MB); supports full boot image storage for mid-complexity microcontrollers.
Random Access Time90 ns at VCC = VIO; enables deterministic XIP execution latency in real-time firmware.
Page Access Time15 ns; allows rapid sequential reads within 32-byte aligned pages for instruction fetch bursts.
Programming Buffer512 bytes; reduces effective programming time by batching up to 256 words per command.
ECC SupportInternal hardware single-bit correction; eliminates need for external error-handling logic in safety-critical systems.
Endurance100,000 program/erase cycles per sector; ensures long-term field reliability in firmware update scenarios.
Data Retention20 years at +85°C; meets extended lifecycle requirements for industrial and automotive deployments.
Operating Temp–40°C to +105°C (AEC-Q100 Grade 2); qualified for under-hood automotive ECUs and harsh-environment controllers.

Pinout & Package

Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint.

Pin/TerminalCircuit RoleDesign Meaning
A0–A22Address InputsWord-aligned address bus (23-bit); A22 is MSB for 128 Mb density (2²³ × 16 bits = 128 Mb).
DQ0–DQ15Data I/O16-bit bidirectional data bus; supports both read and write transfers on word boundaries.
CE#Chip EnableActive-low device select; controls power state entry and timing reference for access cycles.
OE#Output EnableActive-low read strobe; gates output drivers without affecting internal state or timing.
WE#Write EnableActive-low write strobe; initiates program/erase commands and data latching sequences.
RY/BY#Ready/Busy OutputOpen-drain status indicator; low during embedded operations, high when ready for next command.
VCCCore Supply3.0 V ±0.3 V supply for core logic and flash array; supports single-supply operation across read/program/erase.
VIOI/O Supply1.65 V to VCC; enables flexible interfacing with 1.8 V, 2.5 V, or 3.3 V host processors.

Key Features

FeatureDesign Value
Asynchronous Page Read32-byte aligned page access with 15 ns cycle time enables burst instruction fetch without wait states.
512-Byte Programming BufferReduces average programming time by >60% vs. byte-by-byte writes, critical for OTA firmware updates.
Hardware ECC EngineSingle-bit correction with automatic detection; removes software overhead and improves system MTBF.
Uniform 128-kB Sector ErasePredictable, deterministic erase timing (477 kBps) simplifies wear-leveling and partition management.
Versatile I/O Voltage RangeVIO from 1.65 V to VCC allows direct connection to mixed-voltage SoCs without level shifters.
Suspend/Resume CapabilityInterrupts active program/erase to service high-priority reads; essential for real-time multitasking environments.

Applications

Automotive Engine Control Unit (ECU)Industrial PLC Firmware Storage

Use Scenario: Storing calibrated engine maps and boot firmware in AEC-Q100 Grade 2 qualified ECU modules.

IC Role / Device Role / Timing Role: Non-volatile boot memory with XIP-capable read performance and ECC-protected integrity.

Use Value: Ensures deterministic startup timing (<90 ns access) and immunity to bit flips from EMI or radiation in under-hood environments.

Use Scenario: Holding firmware images and configuration data in programmable logic controllers deployed in factory automation.

IC Role / Device Role / Timing Role: High-reliability code storage with 100,000-cycle endurance for frequent field updates.

Use Value: Eliminates need for external ECC logic while supporting secure over-the-air updates via 512-byte buffered programming.

Medical Diagnostic Imaging Boot LoaderRailway Signaling System Configuration Memory

Use Scenario: Hosting certified boot loader and safety-monitoring firmware in Class II medical imaging devices.

IC Role / Device Role / Timing Role: Safety-critical non-volatile memory with 20-year data retention and hardware error correction.

Use Value: Meets IEC 62304 SOUP requirements by guaranteeing bit integrity without software-based scrubbing routines.

Use Scenario: Storing fail-safe configuration tables and diagnostic logs in EN 5012x-certified railway signaling hardware.

IC Role / Device Role / Timing Role: Industrial-grade flash with –40°C to +105°C operation and sector-level protection.

Use Value: Enables robust sector locking (ASP) to prevent accidental overwrite of safety-critical configuration blocks.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S29GL128S10TFI010Same die, identical specs, but packaged in 64-ball LAE Fortified BGA (9 mm × 9 mm).Lacks TSOP footprint; requires PCB redesign for space-constrained board layouts.Select for compact, high-density routing where thermal dissipation favors BGA over TSOP.
MX29GL128FPTI-90GMacronix part; 90 ns access, same density, but no integrated hardware ECC or Versatile I/O.Requires external ECC logic and level-shifting for mixed-voltage hosts.Choose only if cost sensitivity outweighs ECC and I/O flexibility requirements.

Compared with S29GL128S10TFIV10, the LAE-BGA variant offers identical functionality in a smaller footprint but sacrifices through-hole assembly compatibility, while the Macronix alternative trades built-in ECC and voltage flexibility for lower unit cost-making Infineon's part optimal for safety- and reliability-driven designs.

Availability

S29GL128S10TFIV10 is available at Aetrix Electronics and suitable for automotive engine control units, industrial PLCs, medical diagnostic boot loaders, and railway signaling systems requiring stable component supply and long-term lifecycle assurance.

Supply support for S29GL128S10TFIV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions.

The GL-S family targets embedded systems needing fast XIP-capable flash with automotive-grade reliability, combining high-density storage and deterministic timing for safety-critical firmware execution.

FAQ

What is the maximum operating temperature range for S29GL128S10TFIV10?

The S29GL128S10TFIV10 is qualified to AEC-Q100 Grade 2, supporting continuous operation from –40°C to +105°C. This rating is verified per Infineon's qualification test plan and applies to the full electrical specification, including 90 ns access time and 100,000-cycle endurance, under thermal stress conditions.

Does this device require external voltage regulators for VCC and VIO?

No. The device accepts a single 3.0 V ±0.3 V supply on VCC and supports VIO from 1.65 V to VCC, enabling direct connection to common I/O rails (1.8 V, 2.5 V, or 3.3 V) without external regulators or level shifters. VCC must remain within specification during all operations including program and erase.

How does the hardware ECC function during normal read operations?

Hardware ECC operates transparently during every read access: single-bit errors in a 512-bit word are automatically corrected before data reaches DQ pins, and the status register flags uncorrectable multi-bit errors. No software intervention or additional timing overhead is required-correction occurs within the standard read access window.

Can sector protection be configured dynamically during runtime?

Yes. Advanced Sector Protection (ASP) supports both volatile (cleared on power-up) and non-volatile (persistent across resets) lock settings per 128-kbyte sector. Configuration is performed via CFI-compatible command sequences and does not require special programming voltages-only standard WE#/CE#/OE# timing.

S29GL128S10TFIV10 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-S
Package/Case:
56-TFSOP (0.724", 18.40mm Width)
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
128Mbit
Memory Organization:
8M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
60ns
Access Time:
100 ns
Voltage - Supply:
1.65V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
56-TSOP

S29GL128S10TFIV10 FAQ

1.How can I place an order for S29GL128S10TFIV10 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL128S10TFIV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL128S10TFIV10 reliable?

The price and inventory of S29GL128S10TFIV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10TFIV10 is usually 5 days.

3.What payment methods are accepted for S29GL128S10TFIV10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S10TFIV10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL128S10TFIV10?

S29GL128S10TFIV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL128S10TFIV10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL128S10TFIV10?

For technical support, including S29GL128S10TFIV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10TFIV10 requirements.

6.How does Aetrix verify that S29GL128S10TFIV10 is sourced from the original manufacturer or authorized distributors?

All S29GL128S10TFIV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10TFIV10 meets industry standards.

7.What is the process for return or replacement of S29GL128S10TFIV10?

All S29GL128S10TFIV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10TFIV10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL128S10TFIV10 part is unused and in its original packaging.

Return procedure for S29GL128S10TFIV10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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